公开(公告)号：US09985600B2

公开(公告)日：2018-05-29

申请号：US15088147

申请日：2016-04-01

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： Yong-Chun Xu ,  Jian-She Hu ,  Chao-Tung Huang ,  Chih-Ching Hsu

IPC: H03H7/09 ,  H01F30/02 ,  H01F27/24 ,  H01F27/28 ,  H05K1/11 ,  H01F27/29 ,  H05K1/02

CPC classification number: H03H7/09 ,  H01F27/24 ,  H01F27/28 ,  H01F27/29 ,  H01F27/292 ,  H01F30/02 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0245 ,  H05K1/111 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10015 ,  H05K2201/1003

Abstract: A printed circuit board assembly includes a printed circuit board, a number of electronic components mounted thereon, and a number of conductive traces electrically connecting the components to form a number of transmission channels. Each of the channels has first and second transmission routes for transmitting differential signals. Each channel includes a common mode choke, a pair of capacitors, and an autotransformer. The common mode choke includes a first coil series connection with the first transmission route and a second coil series connection with the second transmission route. The capacitors include a first capacitor series connection with the first transmitting route and a second capacitor series connection with the second transmitting route.

公开(公告)号：US09984829B2

公开(公告)日：2018-05-29

申请号：US15678237

申请日：2017-08-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadateru Yamada

IPC: H05K1/16 ,  H01G4/30 ,  H01G4/248 ,  H05K1/18 ,  H01G4/12 ,  H01G4/012

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/248 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10681

Abstract: In a capacitor main body, a dimension along the thickness direction of a first region where a first inner electrode and a second inner electrode are provided is t1, a dimension along the thickness direction of a second region that is positioned on the side of a first main surface relative to the first region is t2, and a dimension along the thickness direction of a third region that is positioned on the side of a second main surface relative to the first region is t3. A condition of t2/t1>about 0.15 and a condition of t3/t1>about 0.15 are satisfied.

公开(公告)号：US20180145385A1

公开(公告)日：2018-05-24

申请号：US15819587

申请日：2017-11-21

Applicant: M-Tron Industries, Inc

Inventor： Michael D. Howard ,  Roger Paulsen

IPC: H01P1/207 ,  H01P3/08 ,  H05K1/18 ,  H05K1/02 ,  H01P1/30

CPC classification number: H01P1/207 ,  H01P1/2088 ,  H01P1/30 ,  H01P3/08 ,  H05K1/0201 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/0262 ,  H05K1/16 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10151 ,  H05K2203/165

Abstract: A filter of the present invention creates a cavity filter that can be embedded within the inner layers of a printed circuit board. The embodiment can provide for a tunable microwave filter with lower loss, lower manufacturing cost and higher production yields. In addition, the tunable microwave includes a temperature compensation means to accommodate an electrical characteristic of filter with regard to the temperature variation. Such temperature compensation embodiment can be embedded into the upper layer communicably associated with the processor. For performing intelligent temperature compensation, the processor can include a look-up table of tuning values for controlling can store a set of temperature offset value that can modify the tuning table.

公开(公告)号：US09974194B2

公开(公告)日：2018-05-15

申请号：US15256537

申请日：2016-09-03

Applicant: SMR Patents S.à.r.l.

Inventor： Artem Rudi ,  Romeo Wieczorek ,  Andreas Herrmann ,  Nitesh Shah

IPC: H05K1/14 ,  H05K5/00 ,  B60Q1/26 ,  B60R1/12 ,  H05K1/18 ,  B60R1/00

CPC classification number: H05K5/0026 ,  B60Q1/2665 ,  B60R1/00 ,  B60R1/12 ,  H05K1/141 ,  H05K1/144 ,  H05K1/18 ,  H05K5/0017 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10189

Abstract: An electronic circuit board unit for an electronic module installed in a vehicle rear view device. The electronic circuit board unit has a base plate, at least one printed circuit board, and at least one plug connection for an electronic and physical connection between the printed circuit board and the base plate. The electronic circuit board has at least one first receiver for mounting an electronic consumer unit of the electronic module and being attachable or attached to the base plate or to one of the at least one printed circuit board. There is at least one second connector attachable or attached to the base plate or to the at least one printed circuit board for connecting at least one further electronic consumer unit of the electronic module to the driver circuit of the base plate. This configuration provides either n printed circuit boards and n+1 of electronic consumer units, with n being an integer number of 1 and above, or a plurality of printed circuit boards is provided, with each circuit board comprising at least one first receiver and at least one second connector.

公开(公告)号：US20180130605A1

公开(公告)日：2018-05-10

申请号：US15865803

申请日：2018-01-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Hwa LEE ,  Kyo Kwang LEE ,  Min Cheol PARK ,  Young Ghyu AHN ,  Sang Soo PARK

IPC: H01G4/30 ,  H01G4/248 ,  H01G2/06 ,  H01G4/008 ,  H01G4/12 ,  H05K1/18 ,  H05K1/11 ,  H01G4/232 ,  H05K3/34

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from one another. When a thickness of an active layer including a plurality of first and second internal electrodes disposed therein is defined as AT, and a gap between a first or second lead part of the first internal electrode and a third lead part of the second internal electrode is defined as LG, the following Equation may be satisfied: 0.00044≤LG*log [1/AT]≤0.00150.

公开(公告)号：US20180130604A1

公开(公告)日：2018-05-10

申请号：US15865773

申请日：2018-01-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Hwa LEE ,  Kyo Kwang LEE ,  Min Cheol PARK ,  Young Ghyu AHN ,  Sang Soo PARK

IPC: H01G4/30 ,  H01G4/248 ,  H01G2/06 ,  H01G4/008 ,  H01G4/12 ,  H05K1/18 ,  H05K1/11 ,  H01G4/232 ,  H05K3/34

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from one another. When a thickness of an active layer including a plurality of first and second internal electrodes disposed therein is defined as AT, and a gap between a first or second lead part of the first internal electrode and a third lead part of the second internal electrode is defined as LG, the following Equation may be satisfied: 0.00044≤LG*log [1/AT]≤0.00150.

公开(公告)号：US09967980B2

公开(公告)日：2018-05-08

申请号：US15389484

申请日：2016-12-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akio Masunari ,  Hirokazu Takashima ,  Tomoyuki Nakamura

IPC: H05K1/09 ,  H05K1/18 ,  H01G4/005 ,  H01G4/12 ,  H01G4/248 ,  H01G4/30 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/005 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01G4/40 ,  H05K1/09 ,  H05K1/111 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10636 ,  H05K2203/048 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic capacitor includes a ceramic element body including first and second external electrodes on first and second end surface sides of the ceramic element body, respectively. The first external electrode includes an Ni plating layer and an Sn plating layer defining a plating layer. The second external electrode includes an Au plating layer defining a plating layer.

公开(公告)号：US09953765B2

公开(公告)日：2018-04-24

申请号：US14702881

申请日：2015-05-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shunsuke Takeuchi ,  Masashi Nishimura

IPC: H01G4/30 ,  H01G4/228 ,  H01G4/005 ,  H01G2/02 ,  H01G4/012 ,  H01G4/248 ,  H05K1/18 ,  H05K1/11 ,  H01G4/232 ,  H01G2/06 ,  H01G4/12

CPC classification number: H01G4/005 ,  H01G2/02 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015

Abstract: A laminated ceramic electronic component mounting structure includes a laminated ceramic electronic component including a ceramic body, first and second inner electrodes in the ceramic body including opposed portions including at least portions of which are opposed to each other in a thickness direction of the ceramic body, a first terminal electrode electrically connected to the first inner electrode, and a second terminal electrode electrically connected to the second inner electrode; and a circuit board including first and second electrode lands electrically connected to the first and second terminal electrodes and on which the laminated ceramic electronic component is mounted, wherein widths of the first and second electrode lands are smaller than widths of the first and second inner electrodes at the opposed portions.

公开(公告)号：US09913380B2

公开(公告)日：2018-03-06

申请号：US15490178

申请日：2017-04-18

Applicant: Delta Electronics Int'l (Singapore) Pte Ltd

Inventor： Yiu-Wai Lai ,  Da-Jung Chen

IPC: H05K1/18 ,  H05K1/09 ,  H05K1/16 ,  H05K1/11

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/2518 ,  H01L2924/19105 ,  H05K1/115 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003

Abstract: An embedded package structure includes an insulation substrate, a first conductive layer, a second conductive layer, an electronic component and a passive component. The insulation substrate has a first conductive via and a second conductive via. The first conductive layer is formed on a top surface of the insulation substrate and contacted with the first conductive via. The second conductive layer is formed on a bottom surface of the insulation substrate, and contacted with the second conductive via. The electronic component is embedded within the insulation substrate. Moreover, plural conducting terminals of the electronic components are electrically connected with the first conductive layer and the second conductive layer through the first conductive via and the second conductive via. The passive component is located near a first side of the electronic component and separated from the electronic component. The passive component is at least partially embedded within the insulation substrate.

公开(公告)号：US20180061579A1

公开(公告)日：2018-03-01

申请号：US15792794

申请日：2017-10-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadateru YAMADA

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H05K1/18 ,  H01G4/248

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/248 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10681

Abstract: In a capacitor main body, a dimension along the thickness direction of a first region where a first inner electrode and a second inner electrode are provided is t1, a dimension along the thickness direction of a second region that is positioned on the side of a first main surface relative to the first region is t2, and a dimension along the thickness direction of a third region that is positioned on the side of a second main surface relative to the first region is t3. A condition of t2/t1>about 0.15 and a condition of t3/t1>about 0.15 are satisfied.