公开(公告)号：US20240317983A1

公开(公告)日：2024-09-26

申请号：US18611600

申请日：2024-03-20

申请人： H.B. Fuller Company

发明人： Thomas F. Kauffman ,  Jayesh G. Bokria

IPC分类号： C08L23/14 ,  B32B7/12 ,  B32B17/06 ,  C08L23/16 ,  H01L31/048 ,  H01L31/049 ,  H01L31/0296

CPC分类号： C08L23/14 ,  B32B7/12 ,  B32B17/06 ,  C08L23/16 ,  H01L31/0481 ,  H01L31/049 ,  B32B2457/12 ,  C08L2205/025 ,  C08L2205/035 ,  H01L31/0296 ,  H01L31/0488

摘要： The invention features a hot melt composition in the form of a film including a blend of propylene based polymers and ethylene based polymers. The hot melt composition in the form of a film is useful as an encapsulant for photovoltaic modules.

公开(公告)号：US12024607B2

公开(公告)日：2024-07-02

申请号：US18157619

申请日：2023-01-20

申请人： H.B. Fuller Company

发明人： Albert M. Giorgini

IPC分类号： C08J9/00 ,  C08K5/521 ,  C08L75/06 ,  H01M50/116 ,  H01M50/183 ,  H01M50/24

CPC分类号： C08J9/0038 ,  C08K5/521 ,  C08L75/06 ,  H01M50/116 ,  H01M50/183 ,  H01M50/24 ,  H01M2200/00

摘要： A battery module comprising an electric cell and a potting compound associated with the electric cell. The potting compound is formed of a flame retardant component; a first component having an isocyanate reactive compound and water; and a second component having an isocyanate compound. The potting compound is a foam.

公开(公告)号：US11820209B1

公开(公告)日：2023-11-21

申请号：US18045017

申请日：2022-10-07

申请人： H.B. Fuller Company

发明人： Craig A. Erichsen ,  Jonathon O. Cordell

IPC分类号： B60J10/35 ,  B60J10/15 ,  B60J1/00 ,  B62D63/06

CPC分类号： B60J10/35 ,  B60J1/006 ,  B60J10/15 ,  B62D63/06

摘要： This invention is directed to a structure and a method of sealing the structure as it is manufactured. The method uses a combination of thermoplastic sealants in the form of films and a substrate encapsulated tape.

公开(公告)号：US11732166B2

公开(公告)日：2023-08-22

申请号：US17003549

申请日：2020-08-26

申请人： H.B. Fuller Company

发明人： Kellen E. O'Brien ,  Marlen A. Valverde ,  Chao Wang ,  Chue Moua

IPC分类号： C09J175/04 ,  C08G18/42 ,  C08G18/72 ,  C09J5/06 ,  C08K3/34 ,  C08L23/08

CPC分类号： C09J175/04 ,  C08G18/4261 ,  C08G18/72 ,  C09J5/06 ,  C08K3/346 ,  C08L23/0853 ,  C08L23/0869 ,  C09J2301/304 ,  C09J2301/408 ,  C09J2423/106 ,  C09J2469/006

摘要： A moisture curable hot melt adhesive composition that includes isocyanate-terminated polyurethane prepolymer that includes the reaction product of a crystalline polyester polyol, a polyether polyol, and diisocyanate, clay, polyester/polyether elastomer, a first thermoplastic polymer selected from the group consisting of ethylene vinyl acetate copolymer, ethylene (alkyl)acrylate copolymer, and combinations thereof, a tackifying agent, and optionally a second thermoplastic polymer selected from the group consisting of thermoplastic polyurethane, thermoplastic polycaprolactone, and combinations thereof.

公开(公告)号：US11674008B2

公开(公告)日：2023-06-13

申请号：US17659422

申请日：2022-04-15

申请人： H.B. Fuller Company

发明人： Luke A. Strzegowski ,  Jayesh G. Bokria

IPC分类号： H01L31/046 ,  C08L33/08 ,  H01L31/048 ,  C08J5/18

CPC分类号： C08J5/18 ,  C08L33/08 ,  H01L31/046 ,  H01L31/0481 ,  H01L31/0488 ,  C08J2333/08

摘要： The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer.
The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.

公开(公告)号：US20220181511A1

公开(公告)日：2022-06-09

申请号：US17593073

申请日：2020-03-06

申请人： H.B. Fuller Company

发明人： Peter Remmers ,  Volker K. Kestler ,  Thomas F. Kauffman

IPC分类号： H01L31/18 ,  H01L21/67 ,  H01L31/048

摘要： A method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.

公开(公告)号：US20210222027A1

公开(公告)日：2021-07-22

申请号：US17273525

申请日：2019-09-20

申请人： Sekisui Fuller Company, Ltd.

发明人： Haruhiko Nishida ,  Yoshiki Nagata ,  Keiji Yoshimura

IPC分类号： C09D153/02 ,  C09D191/06 ,  C09D7/65 ,  C09D7/63

摘要： The present invention provides a hot-melt coating agent that is excellent in bubble-suppression properties during coating, that is cured in a short period of time after coating, and that is excellent in tack-free properties and bleed-out resistance properties. The present invention provides a hot-melt coating agent for a component-mounted electronic circuit board that contains a thermoplastic resin (A) and a liquid softener (B); and that has a melt viscosity at 160° C. (η1) of 20000 mPa·s or less and a melt viscosity at 180° C. (η2) of 10000 mPa·s or less, wherein the ratio of the melt viscosity at 160° C. (η1) to the melt viscosity at 180° C. (η2) (η1/η2) is 1.0 to 5.0.

公开(公告)号：US10316227B2

公开(公告)日：2019-06-11

申请号：US15467651

申请日：2017-03-23

申请人： H.B. Fuller Company

发明人： Haythem Bennour ,  Annett Linemann

IPC分类号： C08G18/10 ,  C09J175/06 ,  C08G18/28 ,  C08G18/32 ,  C08G18/42 ,  C08G18/76 ,  C09J175/08

摘要： The present invention relates to a process for preparing a reactive hotmelt adhesive formulation having a low residual content of monomeric diisocyanate. The present invention further provides a reactive hotmelt adhesive composition obtainable by the process of the invention.

公开(公告)号：US09944834B2

公开(公告)日：2018-04-17

申请号：US14969900

申请日：2015-12-15

申请人： H.B. Fuller Company

发明人： Brian W. Carlson ,  Rituparna Paul ,  Mutombo J. Muvundamina ,  Felix D. Mai

IPC分类号： C09J175/04 ,  C09J7/00 ,  C09J5/04 ,  C09J5/06 ,  B32B7/12 ,  B32B15/095 ,  B32B27/40 ,  B32B27/28 ,  B32B37/12 ,  B32B37/16 ,  B32B15/14 ,  B32B15/18 ,  C09J175/00

CPC分类号： C09J175/04 ,  B32B7/12 ,  B32B15/095 ,  B32B15/14 ,  B32B15/18 ,  B32B27/28 ,  B32B27/40 ,  B32B37/1207 ,  B32B37/16 ,  B32B2037/1253 ,  B32B2037/1269 ,  B32B2262/0261 ,  B32B2307/50 ,  B32B2375/00 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2471/02 ,  B32B2605/00 ,  C09J5/04 ,  C09J5/06 ,  C09J7/00 ,  C09J175/00 ,  C09J2475/00 ,  C09J2475/003

摘要： Disclosed is a self-supporting, heat curable adhesive film including a surface-deactivated solid isocyanate and a blend of two different polyurethanes. A method of making an article that includes the adhesive film and article made thereby are also disclosed.

公开(公告)号：US09731489B2

公开(公告)日：2017-08-15

申请号：US13904781

申请日：2013-05-29

申请人： H.B. FULLER COMPANY

发明人： Jorge A. Nash ,  Orion A. Cavins

IPC分类号： B32B38/00 ,  B32B41/00 ,  B32B38/18 ,  B65H35/08 ,  B65H37/04 ,  B65H39/14

CPC分类号： B32B38/0004 ,  B32B38/1858 ,  B32B41/00 ,  B65H35/08 ,  B65H37/04 ,  B65H39/14 ,  B65H2701/176 ,  B65H2701/1762 ,  Y10T156/1062 ,  Y10T156/12

摘要： A system for applying a material to a substrate comprising: a feed section that comprises a feed roll and configured for advancing a material along a predetermined path; a material applicator roll configured to receive the material from the feed roll and apply a cut length of material to a substrate; a knife element located between the feed section and the material applicator roll; and a non-vacuum anvil roll positioned near the knife element, wherein the knife element and the non-vacuum anvil roll are positioned along the path of the material and engage the material to cut the material into the cut length of material for applying to the substrate, and wherein the material contacts the peripheral surface of the non-vacuum anvil roll only at a cut engagement point.