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公开(公告)号：US20240361072A1
公开(公告)日：2024-10-31
申请号：US18644688
申请日：2024-04-24
CPC分类号： F26B3/04 , B08B3/041 , H01L21/67028
摘要： This invention is directed to substrate processing techniques for performing a chemical liquid processing, a cleaning process, or the like on a substrate. In this invention, while the substrate is processed with the processing liquid, liquid droplets of the processing liquid scattered from the substrate are collected by an inner peripheral surface of a cup. After this processing and before the cup is elevated to a cup elevation position, a heated gas is supplied to the inner peripheral surface of the cup via an upper surface of the substrate while the cup is rotated. Thus, the cup is dried by the rotation of the cup and the supply of the heated gas to the cup.
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公开(公告)号：US20240359220A1
公开(公告)日：2024-10-31
申请号：US18648197
申请日：2024-04-26
发明人： Shigeru YAMAMOTO , Yasuhiko NAGAI , Keiji IWATA , Takashi AKIYAMA , Akira ITO , Daiki FUJII , Kazuki GODA , Yosuke NISHINO , Yuya KAWAI , Kenji EDAMITSU
CPC分类号： B08B9/027 , H01L21/6715 , B08B2209/027
摘要： Provided is a substrate treating apparatus for treating a substrate. The substrate treating apparatus includes a substrate treating unit configured to supply a water-insoluble water repellent to the substrate to perform water-repellent treatment to the substrate, a decomposition solution mixing mechanism configured to mix a decomposition solution for decomposing the water repellent to a water repellent-containing liquid that contains the water repellent as a waste liquid generated through the water-repellent treatment of the substrate, and a discharging unit configured to discharge a mixed liquid of the water repellent-containing liquid and the decomposition solution to an outside of the substrate treating apparatus.
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公开(公告)号：US12132876B2
公开(公告)日：2024-10-29
申请号：US18458419
申请日：2023-08-30
发明人： Yuya Sugihara , Tomoyasu Okushima , Seiya Nomura
CPC分类号： H04N1/00814 , H04N1/40068 , H04N1/00005
摘要： An object is to provide a technique allowing photographed data acquired by a camera to be converted properly to an image having a resolution necessary for inspection. An imaging device includes a camera, an image data output unit, and an external output signal generator. The camera outputs photographed data obtained by photographing an image on the basis of a camera output signal generated with a constant period. The image is printed on a printing medium transported in a transport direction X. The image data output unit outputs image data based on the photographed data to an inspection device. The external output signal generator generates an external output signal indicating timing of output of the image data by the image data output unit. The image data output unit calculates a weighted average of several pieces of photographed data stored in a buffer while giving respective weights responsive to a time gap between the camera output signal and the external output signal to the several pieces of photographed data.
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公开(公告)号：US12126775B2
公开(公告)日：2024-10-22
申请号：US17885068
申请日：2022-08-10
发明人： Tomohiro Suzuki
CPC分类号： H04N1/0044 , G06T7/0004 , H04N1/00005 , H04N1/00029 , H04N1/00076 , G06T2207/20081 , G06T2207/30144
摘要： An image inspection device includes: an inspection condition setting unit for setting, as an inspection condition, a determination criterion when detecting a defective image; an imaging unit that performs capturing a print image and outputs a captured image obtained by the capturing; and a defective image detection unit that detects a defective image from the captured image on the basis of the inspection condition. The inspection condition setting unit is configured to be able to set, as the inspection condition, first parameter values and second parameter values that are two different determination criteria. The defective image detection unit performs first detection processing of detecting a defective image from the captured image on the basis of the first parameter values and second detection processing of detecting a defective image from the captured image on the basis of the second parameter values.
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公开(公告)号：US12125723B2
公开(公告)日：2024-10-22
申请号：US17255466
申请日：2019-05-31
发明人： Oma Nakajima , Mao Omori
IPC分类号： H01L21/67 , F27B17/00 , F27D21/04 , G01J5/00 , G01J5/10 , H01L21/268 , H01L21/66 , H05B1/02 , H05B3/00
CPC分类号： H01L21/67248 , F27B17/0025 , F27D21/04 , G01J5/0007 , G01J5/10 , H01L21/2686 , H01L21/67115 , H01L22/12 , H05B1/0233 , H05B3/0047
摘要： The semiconductor wafer is preheated by halogen lamps and then heated by a flash of light irradiation from flash lamps. A length of a light emission waveform of a flash of light applied from the flash lamps can be adjusted as appropriate. A data collection cycle (sampling interval) of a radiation thermometer that measures a surface temperature of the semiconductor wafer is made variable, and the longer the light emission waveform of the flash of light, the longer the data collection cycle. Even when a rising and falling time of the surface temperature of the semiconductor wafer changes due to the length of the light emission waveform of a flash of light, a temperature change can be included in a temperature profile with a constant number of data points until the surface temperature rises, goes through a maximum reaching temperature, and falls.
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公开(公告)号：US20240342672A1
公开(公告)日：2024-10-17
申请号：US18755680
申请日：2024-06-27
发明人： Hajime NISHIDE , Takashi IZUTA , Takatoshi HAYASHI , Katsuhiro FUKUI , Koichi OKAMOTO , Kazuhiro FUJITA , Atsuyasu MIURA , Kenji KOBAYASHI , Sei NEGORO , Hiroki TSUJIKAWA
IPC分类号： B01F35/82 , B01F23/231 , B01F23/237 , B01F35/21 , B01F35/22 , G05D11/00 , G05D21/02 , H01L21/306 , H01L21/3213 , H01L21/67 , B01F101/58
CPC分类号： B01F35/82 , B01F23/231 , B01F23/237611 , B01F23/237612 , B01F23/23765 , B01F35/2132 , B01F35/2202 , G05D11/00 , G05D21/02 , H01L21/30608 , H01L21/32134 , H01L21/67017 , H01L21/67028 , H01L21/67051 , H01L21/67075 , H01L21/6708 , B01F2101/58
摘要： A chemical liquid preparation method of preparing a TMAH-containing chemical liquid, including, a correspondence relationship preparing step of preparing a correspondence relationship between a supply flow rate ratio between an oxygen-containing gas and an inert-gas-containing gas and a convergent dissolved oxygen concentration in the TMAH-containing chemical liquid that is converged to when the oxygen-containing gas and the inert-gas-containing gas are supplied into the TMAH-containing chemical liquid; a concentration setting step of setting a target dissolved oxygen concentration in the TMAH-containing chemical liquid; a supply-flow-rate-ratio acquiring step of acquiring the supply flow rate ratio between the oxygen-containing gas and the inert-gas-containing gas corresponding to the target dissolved oxygen concentration in accordance with the correspondence relationship prepared in the correspondence relationship preparing step; and a gas supplying step of supplying the oxygen-containing gas and the inert-gas-containing gas with the supply flow rate ratio acquired in the supply-flow-rate-ratio acquiring step.
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公开(公告)号：US20240339317A1
公开(公告)日：2024-10-10
申请号：US18551302
申请日：2022-01-20
发明人： Shogo KUNIEDA , Yuta SASAKI
CPC分类号： H01L21/02282 , B05D3/0406 , B05D3/0466 , B05D2320/10 , B05D2401/10
摘要： This disclosure relates to a substrate treating method and a treatment liquid. The substrate treating method includes a treatment liquid supplying step, a solidified film forming step, and a sublimation step. In the treatment liquid supplying step, a treatment liquid is supplied to a substrate. The treatment liquid contains a sublimable substance, a solvent, and a surfactant. In the solidified film forming step, the solvent and the surfactant evaporate from the treatment liquid on the substrate. In the solidified film forming step, a solidified film containing the sublimable substance is formed on the substrate. In the sublimation step, the solidified film sublimates. The surfactant has an octanol-water partition coefficient LOGPow of −1 or more and 1 or less. Vapor pressure Pc of the surfactant at room temperature is 0.9 times or more and 3 times or less vapor pressure Pb of the solvent at room temperature.
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公开(公告)号：US20240303813A1
公开(公告)日：2024-09-12
申请号：US18599728
申请日：2024-03-08
发明人： Ryo HASEBE , Toshihiko Maekawa , Ayu Inoue
CPC分类号： G06T7/0012 , G06T7/11 , G06T2207/30024
摘要： In an evaluation method, first, spheroids obtained by three-dimensional culture of multiple kinds of liver-derived cells are imaged by optical coherence photography, a localization region is extracted from the photographic image, the localization region is analyzed (analysis step), and the condition of the spheroid is evaluated. The analysis step includes a first calculation step of calculating the area of the entire spheroid in the photographic image, a second calculation step of calculating the area of the localization region, a third calculation step of calculating the ratio of the localization region on the basis of the two areas, and a fourth calculation step of calculating an evaluation parameter on the basis of the ratio.
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公开(公告)号：US12083563B2
公开(公告)日：2024-09-10
申请号：US17016438
申请日：2020-09-10
IPC分类号： B08B3/04 , B08B3/08 , B08B3/10 , B08B5/02 , B08B13/00 , H01L21/67 , H01L21/683 , H01L21/687
CPC分类号： B08B3/041 , B08B3/08 , B08B3/10 , B08B5/023 , B08B13/00 , H01L21/67051 , H01L21/6838 , H01L21/68742 , H01L21/68764
摘要： Disclosed is a substrate treating apparatus for treating a substrate with a treating liquid, the apparatus including the following: a rotating member including a plurality of through-holes formed therein; a plurality of support pins attached to the through-holes with a non-sealing structure, and configured to support a substrate in such a manner that the substrate is spaced apart; a supply nozzle configured to supply a treating liquid to the substrate; a cover spaced apart below the rotating member; a rotational drive device configured to drive the rotating member rotationally in a horizontal plane; and a drive device configured to drive the support pins.
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公开(公告)号：US12080566B2
公开(公告)日：2024-09-03
申请号：US17640858
申请日：2020-05-25
CPC分类号： H01L21/67023 , B05C5/02 , B05C11/08 , B05C11/1039 , H01L21/67242 , H01L21/68
摘要： A substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a treating unit and a controller. The treating unit includes a substrate holder, a rotation driving unit, a treatment liquid supplying unit, a liquid collecting unit, and a guard driving unit. The substrate holder holds a substrate in a horizontal posture. The rotation driving unit rotates the substrate holder. The liquid collecting unit includes a first guard, a second guard, and a liquid inlet. The first guard and the second guard are arranged so as to surround the substrate holder laterally. The liquid inlet is defined by the guards. The liquid inlet is open toward the substrate held by the substrate holder. The guard driving unit moves the second guard in a vertical direction. The controller controls the guard driving unit in accordance with the shape of the substrate held by the substrate holder, thereby changing a height position of an upper end of the liquid inlet.
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