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    THERMAL TRANSFER PROTECTIVE SHEETS, PRINTS, AS WELL AS PRINTS WITH WINDOW MEMBERS
    1.
    发明申请
    THERMAL TRANSFER PROTECTIVE SHEETS, PRINTS, AS WELL AS PRINTS WITH WINDOW MEMBERS 有权
    热转印保护片，打印机，作为打印机与WINDOW会员

    公开(公告)号：US20060216482A1

    公开(公告)日：2006-09-28

    申请号：US11419613

    申请日：2006-05-22

    申请人： Junichiro Sugita

    发明人： Junichiro Sugita

    IPC分类号： B41M5/00

    CPC分类号： B41M5/38264 ,  B41M5/44 ,  B41M7/0027 ,  Y10T428/24802

    摘要： A thermal transfer protective sheet, a print, and a print with a window member are provided. The thermal transfer protective sheet includes a release layer and a topcoat layer having adhesiveness to an object to be transferred, which are stacked in this order on a base material, wherein the release layer and the topcoat layer are cold-peeled and transferred to the surface of the object to be transferred by the fusion thermal transfer recording method. The release layer comprises a first resin consisting of a thermoplastic resin and a second resin incompatible with the first resin in a mixed state. The first resin is an acrylic resin, and the second resin is a thermoplastic resin having a glass transition point of 50° C. or less. The mixing ratio of the first resin to the second resin is 80:20 or more and 99:1 or less in a weight ratio. In the release layer, the second resin exists as a particulate phase in the first resin, thereby inhibiting fusion between the base material and the release layer even if cooling is insufficient during peeling.

    摘要翻译： 提供热转印保护片，印刷品和具有窗口构件的印刷品。 热转印保护片包括剥离层和与要转印的物体具有粘合性的面涂层，其按顺序堆叠在基材上，其中剥离层和顶涂层被冷去皮并转移到表面 通过熔融热转印记录方法转印的物体。 剥离层包括由热塑性树脂构成的第一树脂和与混合状态的第一树脂不相容的第二树脂。 第一树脂是丙烯酸树脂，第二树脂是玻璃化转变点为50℃以下的热塑性树脂。 第一树脂与第二树脂的混合比例为80:20以上且99:1以下。 在剥离层中，第二树脂以第一树脂中的颗粒状相存在，从而即使剥离时冷却不充分，也能抑制基材与剥离层的熔融。

    Bumpless semiconductor device
    2.
    发明授权
    Bumpless semiconductor device 有权
    无铅半导体器件

    公开(公告)号：US07109058B2

    公开(公告)日：2006-09-19

    申请号：US10467638

    申请日：2002-02-18

    申请人： Yukio Yamada ,  Masayuki Nakamura ,  Hiroyuki Hishinuma

    发明人： Yukio Yamada ,  Masayuki Nakamura ,  Hiroyuki Hishinuma

    IPC分类号： H01L21/44

    CPC分类号： H01L21/563 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11332 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/73203 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014

    摘要： When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.

    摘要翻译： 当通过倒装芯片方法将诸如IC芯片的半导体器件与电路板连接时，提供半导体器件而不在其上形成凸块，这使得IC芯片和电路板之间可以实现高可靠性和低成本的连接，同时确保抑制短路 电路，降低连接成本，抑制接头处的应力集中，降低IC芯片或电路板的损坏。 无源半导体器件在其表面上设置有电极焊盘2，并且在电极焊盘2的周围具有钝化膜3，并且导电粒子4金属结合到电焊盘2。 采用在树脂粒子表面形成有金属镀层的复合粒子作为导电粒子4.这种无凸起的半导体器件可以通过（a）使导电粒子静电吸附在平板的一个面上来制造。 和（b）将具有吸附的导电颗粒的板的表面覆盖在其表面上设置有电极焊盘的无扰动半导体器件的电极焊盘的表面上，并且在电极焊盘的周围具有钝化膜， 并且超声波焊接该组件，使得导电颗粒被金属地结合并从平板转移到电极焊盘。

    Protective element
    3.
    发明申请
    Protective element 有权

    公开(公告)号：US20060125594A1

    公开(公告)日：2006-06-15

    申请号：US10538754

    申请日：2003-12-05

    申请人： Yuji Furuuchi

    发明人： Yuji Furuuchi

    IPC分类号： H01H85/00

    CPC分类号： H01H85/046 ,  H01H2085/466

    摘要： A protective element has a heat-generating member and a low-melting metal member on a substrate, in which the low-melting metal member is blown out by the heat generated by the heat-generating member, wherein at least two strips of low-melting metal member are provided as the low-melting metal member, for example, between the pair of electrodes that pass current to the low-melting metal member, so that the lateral cross section of at least part of the low-melting metal member is substantially divided into at least two independent cross sections. This protective element has a shorter and more consistent operating time. It is preferable here to provide at least two strips of low-melting metal member between the pair of electrodes that pass current to the low-melting metal member. It is also preferable to provide one strip of low-melting metal member having a slit in its center, between the pair of electrodes that pass current to the low-melting metal member.

    Flexible printed wiring boards
    7.
    发明授权
    Flexible printed wiring boards 失效
    柔性印刷线路板

    公开(公告)号：US06930390B2

    公开(公告)日：2005-08-16

    申请号：US09909827

    申请日：2001-07-23

    申请人： Yutaka Kaneda ,  Akira Tsutsumi ,  Hiroyuki Hishinuma

    发明人： Yutaka Kaneda ,  Akira Tsutsumi ,  Hiroyuki Hishinuma

    IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H01L23/48

    CPC分类号： H05K3/4007 ,  H05K1/0393 ,  H05K3/002 ,  H05K3/423 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4635 ,  H05K3/4647 ,  H05K2201/0154 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0278

    摘要： An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps.A resin coating 21 and a resist film 24 are formed in this order on the surface of a metal film 11 and on the surface of each metal bump 16 formed on the metal film 11, and a pressure is applied on the surface to depress the resist film 24 on the metal bump 16, followed by etching. As the surface of the resin coating 21 is partially exposed at the depressed portion of the resist film 24, etching of the resin coating 21 proceeds from that portion to bulge the surface of the metal bump 16 from the resin coating 21. If the resist film 24 is formed after a flexible resin coating 22 is formed on the rigid resin coating 21, the flexible resin coating 22 can serve as an adhesive layer.

    摘要翻译： 本发明的目的是提供一种用于制造具有细金属凸块的柔性印刷线路板的简单方法。 在金属膜11的表面和形成在金属膜11上的各金属凸块16的表面上依次形成树脂涂层21和抗蚀剂膜24，并且在表面上施加压力以压下抗蚀剂 金属凸块16上的薄膜24，然后蚀刻。 当树脂涂层21的表面部分地露出在抗蚀剂膜24的凹陷部分时，树脂涂层21的蚀刻从该部分进行，以从树脂涂层21凸出金属凸块16的表面。 如果在刚性树脂涂层21上形成柔性树脂涂层22之后形成抗蚀剂膜24，则柔性树脂涂层22可以用作粘合剂层。