Probe card assembly and method of forming same
    1.
    发明授权
    Probe card assembly and method of forming same 有权
    探针卡组装及其形成方法

    公开(公告)号:US07728612B2

    公开(公告)日:2010-06-01

    申请号:US11986453

    申请日:2007-11-21

    IPC分类号: G01R31/02 G01R1/073

    摘要: A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.

    摘要翻译: 探针卡组件具有在其上具有多个探针接触器尖端的探针接触器基板和设置在两者之间的插入器的探针卡布线板。 与探针接触器基板接触的支撑柱是垂直可调的,直到通过联接到探针卡布线板的锁定机构固定。 当柱固定在固定位置时,位置是多个探针接触器基板的平面基本上平行于预定参考平面的位置。

    Probe card with balanced lateral force
    2.
    发明授权
    Probe card with balanced lateral force 有权
    探头卡平衡横向力

    公开(公告)号:US07538567B2

    公开(公告)日:2009-05-26

    申请号:US11457132

    申请日:2006-07-12

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2891 G01R1/07342

    摘要: A novel method and structure for counter-balancing a lateral force exerted by a probe card onto a device under test (“DUT”) is disclosed. Many DUTs (particularly memory devices) are tested in parallel (i.e., many die at a time) and have unequal numbers of contact pads on top vs. bottom and/or right vs. left sides of the die. The probe card used to test the DUT would necessarily have an uneven distribution of probes that match the contact pads and, as a consequence, may exert a net lateral force on the DUT. By manipulating the individual characteristics of the individual probes, a probe card may be constructed that zeroes the lateral force. Characteristics such as the direction and stiffness of the individual probes can be varied to zero the net lateral force.

    摘要翻译: 公开了一种用于将探针卡施加到被测设备(“DUT”)上的横向力平衡的新颖方法和结构。 许多DUT(特别是存储器件)被并行测试(即,一次许多裸片),并且在芯片的顶部与底部和/或右侧或左侧具有不相等数量的接触焊盘。 用于测试DUT的探针卡必然具有与接触垫匹配的探头不均匀分布,因此可能在DUT上施加净侧向力。 通过操纵各个探针的各个特性,构造可以使横向力为零的探针卡。 诸如各个探针的方向和刚度的特征可以变化为零的净侧向力。

    HYBRID PROBE FOR TESTING SEMICONDUCTOR DEVICES
    3.
    发明申请
    HYBRID PROBE FOR TESTING SEMICONDUCTOR DEVICES 有权
    用于测试半导体器件的混合探针

    公开(公告)号:US20080252310A1

    公开(公告)日:2008-10-16

    申请号:US11734434

    申请日:2007-04-12

    IPC分类号: G01R1/067

    摘要: A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe. One or more additional angular elements may be added to change the energy absorption characteristics of the probe. And, the moment of inertia for the torsion and/or bending elements can by manipulated to achieve the desired probe characteristics.

    摘要翻译: 提出了一种新颖的混合探针设计,其包括扭转元件和弯曲元件。 这些元件允许探头将位移能量存储为扭转或弯曲。 该新型混合探针包括探针基座,扭转元件,弯曲元件和探针尖端。 当探针尖端接触DUT接触垫时,探头弹性变形以吸收位移能量。 弯曲元件通过弯曲吸收一些位移能量。 由于扭转元件和弯曲元件以一定角度接合,所以位移能量的一部分被传递到扭转元件,使其扭转(扭矩)。 扭转元件还可以弯曲以适应通过扭转和弯曲的能量存储。 此外,可以调节枢轴的位置以改变探头的能量吸收特性。 可以添加一个或多个附加角元件以改变探针的能量吸收特性。 并且,通过操纵扭转和/或弯曲元件的惯性矩可以实现所需的探针特性。

    Lateral interposer contact design and probe card assembly
    5.
    发明申请
    Lateral interposer contact design and probe card assembly 审中-公开
    横向插入器触点设计和探针卡组合

    公开(公告)号:US20070075717A1

    公开(公告)日:2007-04-05

    申请号:US11633324

    申请日:2006-12-04

    IPC分类号: G01R31/02

    摘要: The present invention is directed to an interposer having an interposer substrate with an upper surface and a lower surface and at least one resilient contact element having an upper portion and a lower portion. The upper portion extends in a substantially vertical fashion above the upper surface of said interposer substrate, and the lower portion extends in a substantially vertical fashion below the lower surface of said interposer substrate. The upper and lower portions of the resilient contact element are substantially resilient in a direction parallel to the substrate.

    摘要翻译: 本发明涉及具有具有上表面和下表面的插入件基板和至少一个具有上部和下部的弹性接触元件的插入件。 上部部分以大致垂直的方式在所述插入器基板的上表面上方延伸,并且下部部分以基本垂直的方式延伸到所述插入器基板的下表面之下。 弹性接触元件的上部和下部在平行于基底的方向上基本上具有弹性。

    SUPERFILLING SECONDARY METALLIZATION PROCESS IN MEMS FABRICATION
    6.
    发明申请
    SUPERFILLING SECONDARY METALLIZATION PROCESS IN MEMS FABRICATION 有权
    MEMS制造中的超级二次金属化过程

    公开(公告)号:US20110100826A1

    公开(公告)日:2011-05-05

    申请号:US12608857

    申请日:2009-10-29

    申请人: Montray Leavy

    发明人: Montray Leavy

    IPC分类号: C25D5/16 B44C1/22 B32B15/01

    CPC分类号: C25D1/003 B32B15/01 C25D3/38

    摘要: Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and a sacrificial secondary metal that provides structural support for the primary metal component during machining More specifically, techniques are disclosed to increase the rate of secondary metal deposition between primary metal features in order to prevent voiding in the sacrificial secondary metal and thus enhance structural support of the primary metal during machining.

    摘要翻译: 本文提供了用于利用集成到最终MEMS结构中的主要金属和在加工期间为主要金属部件提供结构支撑的牺牲二次金属制造MEMS的工艺。具体而言,公开了增加次级 金属沉积在主金属特征之间以防止牺牲二次金属中的空隙,从而增强在加工过程中初级金属的结构支撑。

    PROBE CARD SUBSTRATE WITH BONDED VIA
    7.
    发明申请
    PROBE CARD SUBSTRATE WITH BONDED VIA 审中-公开
    探针卡底座与绑定威盛

    公开(公告)号:US20100308854A1

    公开(公告)日:2010-12-09

    申请号:US12754452

    申请日:2010-04-05

    IPC分类号: G01R31/00 H01R9/00

    摘要: The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.

    摘要翻译: 本发明涉及一种探针头,其具有探针接触器基底,该探针接触器基底具有穿过该探针接触器基底的至少一个狭缝,至少一个探针接触器,其适用于测试被测器件,探针接触器与顶部 并且电连接到也设置在探针接触器基板顶部的端子,以及空间变压器,其具有耦合到空间变压器的顶侧的至少一个接合焊盘,以及电连接所述探针接触器基板 接合焊盘通过探头接触器基板中的插槽连接到端子。

    PROBE FOR TESTING SEMICONDUCTOR DEVICES
    8.
    发明申请
    PROBE FOR TESTING SEMICONDUCTOR DEVICES 有权
    用于测试半导体器件的探针

    公开(公告)号:US20080252328A1

    公开(公告)日:2008-10-16

    申请号:US12042295

    申请日:2008-03-04

    IPC分类号: G01R1/067

    CPC分类号: G01R1/06733 G01R1/06727

    摘要: A novel probe design is presented that increases a probe tolerance to stress fractures. Specifically, what is disclosed are three features increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers.

    摘要翻译: 提出了一种新的探针设计,增加了对应力骨折的探针耐受性。 具体来说,公开的是增加压力容忍度的三个特征。 这些特征包括各种联合角度界面边缘形状,枢轴切口和缓冲区。

    Probe card assembly
    10.
    发明授权
    Probe card assembly 有权
    探头卡组合

    公开(公告)号:US07365553B2

    公开(公告)日:2008-04-29

    申请号:US11317408

    申请日:2005-12-22

    IPC分类号: G01R31/02 G01R1/073

    摘要: A probe card assembly has a probe contractor substrate having a plurality of probe contractor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contractor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contractor substrates is substantially parallel to a predetermined reference plane.

    摘要翻译: 探针卡组件具有在其上具有多个探针承载器尖端的探针承载器基板和设置在两者之间的插入器的探针卡布线板。 与探针承载器基板接触的支撑柱是垂直可调的,直到通过联接到探针卡布线板的锁定机构固定。 当柱固定在固定位置时,位置是多个探头承载器基板的平面基本上平行于预定参考平面的位置。