公开(公告)号：US20250167440A1

公开(公告)日：2025-05-22

申请号：US19033476

申请日：2025-01-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q5/378 ,  H01Q21/06

Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.

公开(公告)号：US20250167092A1

公开(公告)日：2025-05-22

申请号：US18518322

申请日：2023-11-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yung-Li LU ,  Cheng-Nan LIN

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/18

Abstract: An electronic device is disclosed. The electronic device includes a first module having a first electronic component, a second module at least partially overlapped with the first module and having an encapsulant, and a first power path penetrating through the encapsulant and providing a first power signal to a backside surface of the first electronic component.

公开(公告)号：US12300681B2

公开(公告)日：2025-05-13

申请号：US17576822

申请日：2022-01-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hao Chang

IPC: H01L23/34 ,  H01L23/31 ,  H01L25/16 ,  H01L31/0216 ,  H01L31/12 ,  H05K1/02 ,  H05K1/11

Abstract: The present disclosure provides an electronic package. The electronic package includes a substrate, a first component disposed on the substrate and configured to detect an external signal, and an encapsulant disposed on the substrate. The electronic package also includes a protection element disposed on the substrate and physically separating the first device from the encapsulant and exposing the first device. The present disclosure also provides an electronic device.

公开(公告)号：US20250133662A1

公开(公告)日：2025-04-24

申请号：US19007363

申请日：2024-12-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tun-Ching PI ,  Ming-Hung CHEN

IPC: H05K3/34 ,  A61B5/00 ,  G06F1/16 ,  H05K1/02

Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

公开(公告)号：US20250132278A1

公开(公告)日：2025-04-24

申请号：US18491720

申请日：2023-10-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Jing HSU ,  Hsu-Nan FANG

IPC: H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L25/18

Abstract: An electronic device is disclosed. The electronic device includes a unit chip. The unit chip includes an electronic component having a power delivery circuit and a reinforcement supporting the electronic component. The reinforcement is configured to transmit a power signal to the power delivery circuit. The reinforcement includes a thermosetting reinforcement or a glass reinforcement.

公开(公告)号：US12272671B2

公开(公告)日：2025-04-08

申请号：US18212158

申请日：2023-06-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Ming Hung ,  Meng-Jen Wang ,  Tsung-Yueh Tsai ,  Jen-Kai Ou

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/544 ,  H01L27/146 ,  G06V40/13

Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

公开(公告)号：US12267961B2

公开(公告)日：2025-04-01

申请号：US18420528

申请日：2024-01-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Fan Chen ,  Chien-Hao Wang

IPC: H05K1/18 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538

Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.

公开(公告)号：US12266644B2

公开(公告)日：2025-04-01

申请号：US17170666

申请日：2021-02-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu Lin ,  Chi-Han Chen ,  Chieh-Chen Fu

IPC: H01L25/16 ,  H01L23/538 ,  H01L33/52 ,  H01L33/58 ,  G02B6/42

Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.

公开(公告)号：US12266610B2

公开(公告)日：2025-04-01

申请号：US17942984

申请日：2022-09-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yencheng Kuo ,  Shao-Lun Yang

IPC: H01L23/538 ,  B81B7/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/16

Abstract: A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, a first dielectric layer, and a first hole. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface. The first dielectric layer is disposed on the second surface and has a third surface away from the substrate. The first hole extends from the first dielectric layer and the substrate. The first hole is substantially aligned with the first electronic component.

公开(公告)号：US12261350B2

公开(公告)日：2025-03-25

申请号：US18231771

申请日：2023-08-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Guo-Cheng Liao ,  Yi Chuan Ding

IPC: H01Q1/38 ,  H01L21/48 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22

Abstract: A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure. The first antenna has a first surface, a second surface opposite the first surface and a third surface extending from the first surface to the second surface, wherein the first surface and the second surface of the first antenna are exposed.