Semiconductor light detecting element includes film which covers light receiving region near main surface of multilayer structure and electrode on main surface
    1.
    发明授权
    Semiconductor light detecting element includes film which covers light receiving region near main surface of multilayer structure and electrode on main surface 有权
    半导体光检测元件包括覆盖多层结构主表面附近的受光区域和主表面上的电极的膜

    公开(公告)号:US07868408B2

    公开(公告)日:2011-01-11

    申请号:US10594619

    申请日:2005-03-28

    申请人: Akimasa Tanaka

    发明人: Akimasa Tanaka

    摘要: A semiconductor photodetector device (PD1) comprises a multilayer structure (LS1) and a glass substrate (1) optically transparent to incident light. The multilayer structure includes an etching stop layer (2), an n-type high-concentration carrier layer (3), an n-type light-absorbing layer (5), and an n-type cap layer (7) which are laminated. A photodetecting region (9) is formed near a first main face (101) of the multilayer structure, whereas a first electrode (21) is provided on the first main face. A second electrode (27) and a third electrode (31) are provided on a second main face (102). A film (10) covering the photodetecting region and first electrode is formed on the first main face. A glass substrate (1) is secured to the front face (10a) of this film.

    摘要翻译: 半导体光检测器件(PD1)包括对入射光进行光学透明的多层结构(LS1)和玻璃基板(1)。 多层结构包括层压的蚀刻停止层(2),n型高浓度载体层(3),n型光吸收层(5)和n型覆盖层(7) 。 在多层结构的第一主面(101)附近形成光检测区域(9),而在第一主面上设置第一电极(21)。 第二电极(27)和第三电极(31)设置在第二主面(102)上。 覆盖光电检测区域和第一电极的膜(10)形成在第一主面上。 玻璃基板(1)固定在该薄膜的前表面(10a)上。

    SOUNDPROOF MATERIAL
    3.
    发明申请
    SOUNDPROOF MATERIAL 失效
    防爆材料

    公开(公告)号:US20070119651A1

    公开(公告)日:2007-05-31

    申请号:US11562075

    申请日:2006-11-21

    IPC分类号: E04B1/82

    摘要: A soundproof material is provided with a first sound absorbing layer arranged on a vehicle panel, a second sound absorbing layer closer to an inner side of a passenger compartment, and an intermediate layer provided between the sound absorbing layers. The intermediate layer is constituted by two layers having a high-density layer and a low-density layer. The air permeability of the intermediate layer is set lower than the first sound absorbing layer and the second sound absorbing layer. The intermediate layer is arranged in such a manner that the high-density layer is adjacent to the second sound absorbing layer.

    摘要翻译: 隔音材料设置有布置在车辆面板上的第一吸声层,更靠近乘客室内侧的第二吸声层和设置在吸声层之间的中间层。 中间层由具有高密度层和低密度层的两层构成。 中间层的透气度被设定为低于第一吸声层和第二吸音层。 中间层以高密度层与第二吸音层相邻的方式排列。

    Semiconductor light emitting element and manufacturing method thereof
    4.
    发明授权
    Semiconductor light emitting element and manufacturing method thereof 失效
    半导体发光元件及其制造方法

    公开(公告)号:US08048700B2

    公开(公告)日:2011-11-01

    申请号:US12654983

    申请日:2010-01-12

    申请人: Akimasa Tanaka

    发明人: Akimasa Tanaka

    IPC分类号: H01L21/84

    摘要: A semiconductor light-emitting device (LE1) comprises a multilayer structure LS generating light. This multilayer structure includes a plurality of laminated compound semiconductor layers (3 to 8) and has first and second main faces (61, 62) opposing each other. A first electrode (21) and a second electrode (31) are arranged on the first and second main faces, respectively. A film made of silicon oxide (10) is also formed on the first main face so as to cover the first electrode. A glass substrate (1) optically transparent to the light generated by the multilayer structure is secured to the multilayer structure through the film made of silicon oxide.

    摘要翻译: 半导体发光器件(LE1)包括产生光的多层结构LS。 该多层结构包括多个层叠化合物半导体层(3〜8),并且具有彼此相对的第一和第二主面(61,62)。 第一电极(21)和第二电极(31)分别布置在第一和第二主面上。 在第一主面上也形成由氧化硅(10)构成的膜,以覆盖第一电极。 通过由多层结构产生的光透明的玻璃基板(1)通过由氧化硅制成的膜固定到多层结构。

    Semiconductor Photodetector and Method of Manufacturing the Same
    5.
    发明申请
    Semiconductor Photodetector and Method of Manufacturing the Same 失效
    半导体光电探测器及其制造方法

    公开(公告)号:US20070284685A1

    公开(公告)日:2007-12-13

    申请号:US10581081

    申请日:2004-11-30

    申请人: Akimasa Tanaka

    发明人: Akimasa Tanaka

    IPC分类号: H01L31/0232 H01L31/18

    摘要: The present invention relates to a semiconductor photodetector and the like that can be made adequately compact while maintaining mechanical strength. The semiconductor photodetector includes a structural body of layers and a glass substrate. The structural body of layers is arranged from an antireflection film, a high-concentration carrier layer of an n-type (first conductive type), a light absorbing layer of the n-type, and a cap layer of the n-type that are laminated successively. The glass substrate is adhered via a silicon oxide film onto the antireflection film side of the structural body of layers. The glass substrate is optically transparent to incident light.

    摘要翻译: 本发明涉及一种半导体光电检测器等,其可以在保持机械强度的同时可以制造得足够紧凑。 半导体光电检测器包括层的结构体和玻璃基板。 层的结构体由防反射膜,n型(第一导电型)的高浓度载体层,n型光吸收层和n型覆盖层构成, 连续层压。 玻璃基板通过氧化硅膜粘附到层的结构体的抗反射膜侧。 玻璃基板对入射光是光学透明的。

    Semiconductor photodetector and method of manufacturing the same
    6.
    发明授权
    Semiconductor photodetector and method of manufacturing the same 失效
    半导体光电探测器及其制造方法

    公开(公告)号:US07834413B2

    公开(公告)日:2010-11-16

    申请号:US10581081

    申请日:2004-11-30

    申请人: Akimasa Tanaka

    发明人: Akimasa Tanaka

    IPC分类号: H01L31/0224

    摘要: The present invention relates to a semiconductor photodetector and the like that can be made adequately compact while maintaining mechanical strength. The semiconductor photodetector includes a structural body of layers and a glass substrate. The structural body of layers is arranged from an antireflection film, a high-concentration carrier layer of an n-type (first conductive type), a light absorbing layer of the n-type, and a cap layer of the n-type that are laminated successively. The glass substrate is adhered via a silicon oxide film onto the antireflection film side of the structural body of layers. The glass substrate is optically transparent to incident light.

    摘要翻译: 本发明涉及一种半导体光电检测器等,其可以在保持机械强度的同时可以制造得足够紧凑。 半导体光电检测器包括层的结构体和玻璃基板。 层的结构体由防反射膜,n型(第一导电型)的高浓度载体层,n型光吸收层和n型覆盖层构成, 连续层压。 玻璃基板通过氧化硅膜粘附到层的结构体的抗反射膜侧。 玻璃基板对入射光是光学透明的。

    Semiconductor Light Detecting Element and Manufacturing Method Thereof
    8.
    发明申请
    Semiconductor Light Detecting Element and Manufacturing Method Thereof 有权
    半导体光检测元件及其制造方法

    公开(公告)号:US20080006894A1

    公开(公告)日:2008-01-10

    申请号:US10594619

    申请日:2005-03-28

    申请人: Akimasa Tanaka

    发明人: Akimasa Tanaka

    IPC分类号: H01L31/101 H01L31/18

    摘要: A semiconductor photodetector device (PD1) comprises a multilayer structure (LS1) and a glass substrate (1) optically transparent to incident light. The multilayer structure includes an etching stop layer (2), an n-type high-concentration carrier layer (3), an n-type light-absorbing layer (5), and an n-type cap layer (7) which are laminated. A photodetecting region (9) is formed near a first main face (101) of the multilayer structure, whereas a first electrode (21) is provided on the first main face. A second electrode (27) and a third electrode (31) are provided on a second main face (102). A film (10) covering the photodetecting region and first electrode is formed on the first main face. A glass substrate (1) is secured to the front face (10a) of this film.

    摘要翻译: 半导体光检测器件(PD 1)包括多层结构(LS 1)和对入射光进行光学透明的玻璃基板(1)。 多层结构包括层压的蚀刻停止层(2),n型高浓度载体层(3),n型光吸收层(5)和n型覆盖层(7) 。 在多层结构的第一主面(101)附近形成光检测区域(9),而在第一主面上设置第一电极(21)。 第二电极(27)和第三电极(31)设置在第二主面(102)上。 覆盖光电检测区域和第一电极的膜(10)形成在第一主面上。 玻璃基板(1)固定在该薄膜的前表面(10a)上。

    Semiconductor light detecting element and manufacturing method thereof
    9.
    发明申请
    Semiconductor light detecting element and manufacturing method thereof 有权
    半导体光检测元件及其制造方法

    公开(公告)号:US20090291521A1

    公开(公告)日:2009-11-26

    申请号:US12453588

    申请日:2009-05-15

    申请人: Akimasa Tanaka

    发明人: Akimasa Tanaka

    IPC分类号: H01L31/18

    摘要: A semiconductor photodetector device (PD1) comprises a multilayer structure (LS1) and a glass substrate (1) optically transparent to incident light. The multilayer structure includes an etching stop layer (2), an n-type high-concentration carrier layer (3), an n-type light-absorbing layer (5), and an n-type cap layer (7) which are laminated. A photodetecting region (9) is formed near a first main face (101) of the multilayer structure, whereas a first electrode (21) is provided on the first main face. A second electrode (27) and a third electrode (31) are provided on a second main face (102). A film (10) covering the photodetecting region and first electrode is formed on the first main face. A glass substrate (1) is secured to the front face (10a) of this film.

    摘要翻译: 半导体光检测器件(PD1)包括对入射光进行光学透明的多层结构(LS1)和玻璃基板(1)。 多层结构包括层压的蚀刻停止层(2),n型高浓度载体层(3),n型光吸收层(5)和n型覆盖层(7) 。 在多层结构的第一主面(101)附近形成光检测区域(9),而在第一主面上设置第一电极(21)。 第二电极(27)和第三电极(31)设置在第二主面(102)上。 覆盖光电检测区域和第一电极的膜(10)形成在第一主面上。 玻璃基板(1)固定在该薄膜的前表面(10a)上。

    Method of manufacturing a semiconductor photodetector device by removing the semiconductor substrate on one surface after forming the light-transmitting layer on the opposing surface
    10.
    发明授权
    Method of manufacturing a semiconductor photodetector device by removing the semiconductor substrate on one surface after forming the light-transmitting layer on the opposing surface 有权
    在相对表面上形成透光层之后,通过去除一个表面上的半导体衬底来制造半导体光电检测器器件的方法

    公开(公告)号:US07968429B2

    公开(公告)日:2011-06-28

    申请号:US12453588

    申请日:2009-05-15

    申请人: Akimasa Tanaka

    发明人: Akimasa Tanaka

    IPC分类号: H01L21/304

    摘要: A semiconductor photodetector device (PD1) comprises a multilayer structure (LS1) and a glass substrate (1) optically transparent to incident light. The multilayer structure includes an etching stop layer (2), an n-type high-concentration carrier layer (3), an n-type light-absorbing layer (5), and an n-type cap layer (7) which are laminated. A photodetecting region (9) is formed near a first main face (101) of the multilayer structure, whereas a first electrode (21) is provided on the first main face. A second electrode (27) and a third electrode (31) are provided on a second main face (102). A film (10) covering the photodetecting region and first electrode is formed on the first main face. A glass substrate (1) is secured to the front face (10a) of this film.

    摘要翻译: 半导体光检测器件(PD1)包括对入射光进行光学透明的多层结构(LS1)和玻璃基板(1)。 多层结构包括层压的蚀刻停止层(2),n型高浓度载体层(3),n型光吸收层(5)和n型覆盖层(7) 。 在多层结构的第一主面(101)附近形成光检测区域(9),而在第一主面上设置第一电极(21)。 第二电极(27)和第三电极(31)设置在第二主面(102)上。 覆盖光电检测区域和第一电极的膜(10)形成在第一主面上。 玻璃基板(1)固定在该薄膜的前表面(10a)上。