公开(公告)号：US20090009215A1

公开(公告)日：2009-01-08

申请号：US11596011

申请日：2005-03-28

申请人： Yohei Matsumoto ,  Akira Masaki

发明人： Yohei Matsumoto ,  Akira Masaki

IPC分类号： H03K19/177 ,  G06F17/50

CPC分类号： H03K19/17736 ,  H01L27/11803 ,  H03K19/17796

摘要： An FPGA needs extremely large numbers of switches in its wiring architecture and therefore shows low logic density and low operating speed. This tendency becomes increasingly evident with high integration FPGAs. 3-dimensional FPGAs are getting attention for potential improvements in their operating speed and logic density. However, 3-dimensional integration processes have poor yield and are difficult to adapt for the production of devices with fine features. In addition, difficulty in heat radiation imposes limits on the number of stacks. The present invention exploits advantages of the 3-dimensional FPGA to deliver FPGAs with high speed/high integration and which resolves difficulty in manufacturing processes. The present invention solves problems by proposing a design method for an FPGA in which a high dimensional FPGA switch topology is embedded in a lower dimensional integrated circuit and a semiconductor integrated circuit including an FPGA in which a high dimensional FPGA switch topology is embedded in a lower dimensional integrated circuit.

摘要翻译： FPGA在其布线架构中需要极大数量的开关，因此显示出低的逻辑密度和低的运行速度。 高集成度FPGA的趋势越来越明显。 3维FPGA正在注意其运行速度和逻辑密度的潜在改进。 然而，三维一体化处理成品率低，难以适应具有精细特征的装置的生产。 此外，热辐射的困难对堆叠数量施加了限制。 本发明利用3维FPGA的优点来提供高速/高集成度的FPGA，并且解决了制造过程中的难度。 本发明通过提出一种用于FPGA的设计方法来解决问题，其中高维FPGA开关拓扑嵌入在低维集成电路中，以及包括FPGA的半导体集成电路，其中高维FPGA开关拓扑嵌入在较低维数 三维集成电路。

公开(公告)号：US20080006989A1

公开(公告)日：2008-01-10

申请号：US11770595

申请日：2007-06-28

申请人： Akira MASAKI ,  Yoshitaka KATAOKA

发明人： Akira MASAKI ,  Yoshitaka KATAOKA

IPC分类号： B65H45/20 ,  B41F13/56 ,  B65H29/68

CPC分类号： B65H9/06 ,  B65H29/12 ,  B65H29/68 ,  B65H2301/4474 ,  B65H2404/2691 ,  B65H2701/1932 ,  B65H2220/02 ,  B65H2220/01

摘要： Provided is a transporting device including: upstream-side upper and lower belts that transport a signature; downstream-side upper and lower belts that communicate with the upstream-side upper and lower belts, that run at a slower speed than that of the upstream-side upper and lower belts, and that receive the signature from the upstream-side upper and lower belts to transport the signature; and slowdown wheels including stoppers that come out on the transporting path of the signature between the downstream-side upper and lower belts so as to abut on the forward edge portion of the signature in the transporting direction thereof, the transporting device provided with pressing cams including pressing surfaces that press the downstream-side lower belt towards the downstream-side upper belt while the stoppers of the slowdown wheels abut on the forward edge portion of the signature in the transporting direction thereof.

摘要翻译： 提供一种输送装置，包括：输送签名的上游侧上下皮带; 与上游侧上，下带连通的下游侧上下带，其以比上游侧上下带更慢的速度运行，并且从上游侧上下侧接收签名 皮带运输签名; 以及减速轮，其包括在下游侧上下带之间的签名的输送路径上出来的挡块，以便在其输送方向上与签名的前边缘部分抵接，该输送装置设置有按压凸轮，该按压凸轮包括： 将下游侧下带向下游侧上皮带按压的表面，同时减速轮的止动件沿着输送方向抵靠签名的前缘部。

公开(公告)号：US07217233B2

公开(公告)日：2007-05-15

申请号：US11116368

申请日：2005-04-28

申请人： Akira Masaki ,  Takao Watanabe

发明人： Akira Masaki ,  Takao Watanabe

IPC分类号： B31F1/08

CPC分类号： B65H45/167 ,  B65H29/52 ,  B65H2404/693

摘要： A parallel folding apparatus of a folding machine comprises a first cylinder in contact with a second cylinder. A guide plate guides a signature transported on the lower circumferential surface of the second cylinder after being double-folded by grippers of the second cylinder in cooperation with knives of the first cylinder. The guide plate comprises a stationary guide located downstream, in the rotating direction, of the point of contact between the first cylinder and the second cylinder and disposed continuously along the circumferential surfaces of the first cylinder and the second cylinder, and a moving guide movable in accordance with the operating speed of the folding machine between a position, closer to the circumferential surface of the first cylinder than the stationary guide, and a position, more remote from the circumferential surface of the first cylinder than the stationary guide.

摘要翻译： 折叠机的平行折叠装置包括与第二气缸接触的第一气缸。 与第一气缸的刀片协作，引导板引导在第二气缸的夹持器双重折叠之后在第二气缸的下圆周表面上传送的标记。 引导板包括位于第一气缸和第二气缸之间的接触点的沿旋转方向的下游并沿着第一气缸和第二气缸的周向表面连续设置的静止引导件，以及可移动的移动引导件 根据折叠机在比第一圆柱体的圆周表面更靠近固定导轨的位置之间的操作速度以及比第一圆柱体的圆周表面更远离静止导轨的位置。

公开(公告)号：US4644385A

公开(公告)日：1987-02-17

申请号：US665548

申请日：1984-10-26

申请人： Keiichirou Nakanishi ,  Minoru Yamada ,  Akira Masaki ,  Kuninori Imai ,  Katuaki Chiba

发明人： Keiichirou Nakanishi ,  Minoru Yamada ,  Akira Masaki ,  Kuninori Imai ,  Katuaki Chiba

IPC分类号： H01L23/433 ,  H01L23/473 ,  H01L25/04

CPC分类号： H01L23/473 ,  H01L23/4332 ,  H01L2224/16

摘要： This invention concerns a cooling module for integrated circuit chips, characterized in that it is provided with cooling members through which a coolant circulates, and which are connected directly, or via insulating plates, to a plurality of integrated circuit chips mounted on a wiring substrate, and pipes which introduce the coolant into the cooling members and which have a resiliency which is high enough to enable the pipes to expand and contract in the direction perpendicular to the wiring substrate.

摘要翻译： 本发明涉及一种用于集成电路芯片的冷却模块，其特征在于，其具有冷却元件，冷却器通过该冷却元件循环并直接连接或经由绝缘板连接到安装在布线基板上的多个集成电路芯片， 以及将冷却剂引入冷却部件中并且具有足够高的弹性以使管能够在垂直于布线基板的方向膨胀和收缩的管道。

公开(公告)号：US07019804B2

公开(公告)日：2006-03-28

申请号：US10490709

申请日：2002-09-06

申请人： Yoshihiro Kumagai ,  Akira Masaki ,  Tetsuya Uesaka

发明人： Yoshihiro Kumagai ,  Akira Masaki ,  Tetsuya Uesaka

IPC分类号： G02F1/1335

CPC分类号： G02F1/1397 ,  G02F1/133636 ,  G02F2202/40

摘要： A liquid crystal display device has a liquid crystal cell, a liquid crystalline substance layer, a pair of polarizers, and an optical compensation element. The twist angle of the liquid crystal cell is set to 180 to 270 degrees. The optical compensation element has a twisted structure twisted in the opposite direction to that of the liquid crystal cell. The difference in the absolute values of the twist angles between the liquid crystal cell and the optical compensation element is from 40 to 100 degrees. The difference in retardation at a wavelength λ=550 nm between the liquid crystal cell and the optical compensation element is from 100 to 250 nm. When the absolute values of the differences in retardation at wavelengths λ of 400 nm and 550 nm between the liquid crystal cell and the optical compensation element are represented by ΔR(400) and ΔR(550), respectively, and the ratio D therebetween is represented by D=ΔR(400)/ΔR(550), D is within the range of 0.5 to 1.0.

摘要翻译： 液晶显示装置具有液晶单元，液晶物质层，一对偏振器和光学补偿元件。 液晶单元的扭转角度设定为180〜270度。 光学补偿元件具有与液晶单元相反方向扭转的扭曲结构。 液晶单元和光学补偿元件之间的扭转角的绝对值的差为40〜100度。 在液晶单元和光学补偿元件之间的波长λ= 550nm处的延迟差为100〜250nm。 当分别用DeltaR（400）和DeltaR（550）表示液晶单元和光学补偿元件之间在400nm和550nm波长λ处的延迟差的绝对值，并且其间的比率D被表示 通过D = DeltaR（400）/ DeltaR（550），D在0.5至1.0的范围内。

公开(公告)号：US4942320A

公开(公告)日：1990-07-17

申请号：US208118

申请日：1988-06-17

申请人： Hiroyuki Itoh ,  Toshio Yamada ,  Akira Masaki ,  Tohru Kobayashi

发明人： Hiroyuki Itoh ,  Toshio Yamada ,  Akira Masaki ,  Tohru Kobayashi

IPC分类号： H03K17/16 ,  H03K19/003 ,  H03K19/086

CPC分类号： H03K17/16 ,  H03K19/0033 ,  H03K19/086

摘要： A transistor circuit of this invention comprises a first transistor for receiving a first bias at its base, resistor means connected to the collector of the first transistor and clamp means connected to the junction between the first transistor and the resistor means, and obtains an output from a terminal of the resistor on the opposite to its junction with the first transistor. When a noise current due to .alpha. rays develops in the first transistor and the output is lowered, the clamp means operates in such a manner that the current flows through the clamp means and prevents the change of the output. The transistor circuit of this invention is connected to a resistor or a transistor and operates as a constant current circuit for supplying a current to the resistor or the transistor so that the current flowing therethrough becomes constant. For example, it is used as a constant current source of an emitter follower to constitute a level shift circuit. It is disposed in a feedback part and used as a constant current source in a logic circuit comprising a logic part consisting of a differential transistor circuit and the feedback part for negatively feeding back the in-phase output of the differential transistor circuit.

摘要翻译： 本发明的晶体管电路包括用于在其基极处接收第一偏压的第一晶体管，连接到第一晶体管的集电极的电阻器件和连接到第一晶体管和电阻器装置之间的结的钳位装置， 电阻器的端子与其与第一晶体管的连接相对。 当在第一晶体管中产生由于α射线引起的噪声电流并且输出降低时，钳位装置以使得电流流过钳位装置并防止输出变化的方式工作。 本发明的晶体管电路连接到电阻器或晶体管，并作为恒流电路用于向电阻器或晶体管提供电流，使得流过其中的电流恒定。 例如，它被用作射极跟随器的恒流源来构成电平移位电路。 它被布置在反馈部分中，并在逻辑电路中用作恒流源，该逻辑电路包括由差分晶体管电路和反馈部分组成的逻辑部分，用于对差分晶体管电路的同相输出进行负反馈。

公开(公告)号：US4748494A

公开(公告)日：1988-05-31

申请号：US853929

申请日：1986-04-21

申请人： Toshio Yamada ,  Hiroyuki Itho ,  Masayoshi Yagyu ,  Akira Masaki

发明人： Toshio Yamada ,  Hiroyuki Itho ,  Masayoshi Yagyu ,  Akira Masaki

IPC分类号： H01L21/822 ,  G11C11/401 ,  G11C11/407 ,  H01L21/8222 ,  H01L23/528 ,  H01L27/04 ,  H01L27/082 ,  H01L29/52 ,  H01L27/10

CPC分类号： H01L23/5286 ,  H01L2924/0002

摘要： A semiconductor device includes a plurality of circuit groups constituting an integrated circuit and each constituted by a plurality of circuit blocks and a bias circuit which applies a bias potential to said circuit blocks. The device further includes a plurality of power buses provided above the circuit groups through an insulating layer so as to feed power to circuit elements in the circuit groups. At least one of the power buses is constituted by a first bus for feeding power to the circuit groups and a plurality of second buses respectively provided for the circuit groups so that each second bus receives power from the first bus and feeds power to circuit elements in the corresponding circuit group. Each of the second buses is connected to the first bus at a predetermined position on the corresponding circuit group.

摘要翻译： 半导体器件包括构成集成电路的多个电路组，并且各个电路组由多个电路块和向所述电路块施加偏置电位的偏置电路构成。 该装置还包括多个电源总线，其通过绝缘层设置在电路组之上，以便向电路组中的电路元件供电。 电力总线中的至少一个由用于向电路组供电的第一总线和分别为电路组提供的多个第二总线构成，使得每个第二总线从第一总线接收电力并将电力馈送到电路元件 相应的电路组。 每个第二总线在相应电路组上的预定位置连接到第一总线。

公开(公告)号：US4686606A

公开(公告)日：1987-08-11

申请号：US827613

申请日：1986-02-10

申请人： Minoru Yamada ,  Mitsuru Usui ,  Akira Masaki ,  Keiichirou Nakanishi ,  Masahide Tokuda

发明人： Minoru Yamada ,  Mitsuru Usui ,  Akira Masaki ,  Keiichirou Nakanishi ,  Masahide Tokuda

IPC分类号： H01L23/473 ,  H01L21/58 ,  H01L23/36 ,  H01L23/373 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L24/83 ,  H01L23/3736 ,  H01L23/4332 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29191 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152

摘要： A cooling structure for cooling a multichip module for effectively removing heat generated from integrated circuit chips. A suction plate formed with minute grooves on one of its surfaces is disposed between each integrated circuit chip and an associated cooling block and is brought into contact at a grooved surface with the integrated circuit chip through a layer of a liquid such as silicone oil interposed therebetween, thereby producing negative hydrostatic pressure by capillary action of the minute grooves. The suction plate has a thickness small enough to be bent under influence of the negative hydrostatic pressure to follow a warping of the integrated circuit chip, so that the clearance between the opposing surfaces of the suction plate and the integrated circuit chip can be minimized. Thus, an integrated circuit chip cooling device of surface-to-surface contact type operable with a low thermal resistance is provided, which can improve the maintainability and reliability without sacrificing the cooling efficiency.

摘要翻译： 一种用于冷却多芯片模块的冷却结构，用于有效地去除由集成电路芯片产生的热量。 在其一个表面上形成有微小凹槽的吸盘设置在每个集成电路芯片和相关联的冷却块之间，并且在沟槽表面与集成电路芯片通过一层液体（例如插入其间的硅油）接触 ，从而通过微小凹槽的毛细管作用产生负静压。 吸盘的厚度足够小以在负静压力的影响下弯曲，以跟随集成电路芯片的翘曲，使得吸板和集成电路芯片的相对表面之间的间隙可以最小化。 因此，提供了以低热阻可操作的表面接触型的集成电路芯片冷却装置，这可以在不牺牲冷却效率的情况下提高可维护性和可靠性。

公开(公告)号：US4586169A

公开(公告)日：1986-04-29

申请号：US440723

申请日：1982-11-10

申请人： Hiroyuki Itoh ,  Akira Masaki ,  Hiroki Yamashita ,  Satoshi Hososaka

发明人： Hiroyuki Itoh ,  Akira Masaki ,  Hiroki Yamashita ,  Satoshi Hososaka

IPC分类号： H01L21/822 ,  G11C11/411 ,  H01L21/3205 ,  H01L21/82 ,  H01L23/52 ,  H01L27/04 ,  H01L27/10 ,  H01L27/118 ,  H03K3/2885 ,  H03K19/173 ,  G11C7/00 ,  G11C11/40 ,  G11C15/00

CPC分类号： G11C11/4113 ,  H03K19/1735 ,  H03K3/2885

摘要： A large scale integrated circuit including therein a logical gate circuit and a memory circuit is disclosed in which a large number of circuit blocks each having the same structure and including at least eight transistors and at least five resistors are arranged on a chip, and the logical gate circuit or memory circuit has a selected wiring pattern of the transistors and resistors included in the circuit block.

摘要翻译： 公开了一种包括逻辑门电路和存储电路的大规模集成电路，其中每个具有相同结构并且包括至少八个晶体管和至少五个电阻器的大量电路块布置在芯片上，逻辑 门电路或存储器电路具有包括在电路块中的晶体管和电阻器的选定布线图案。

公开(公告)号：US20050245380A1

公开(公告)日：2005-11-03

申请号：US11116368

申请日：2005-04-28

申请人： Akira Masaki ,  Takao Watanabe

发明人： Akira Masaki ,  Takao Watanabe

IPC分类号： B65H29/52 ,  B65H45/16 ,  B31B49/00

CPC分类号： B65H45/167 ,  B65H29/52 ,  B65H2404/693

摘要： A parallel folding apparatus of a folding machine comprises a first jaw cylinder and a lower second jaw cylinder arranged with their circumferential surfaces in contact with each other. A guide plate guides a signature which is transported on the lower circumferential surface of the lower second jaw cylinder after being double-folded by grippers of the lower second jaw cylinder in cooperation with knives of the first jaw cylinder. The guide plate comprises a stationary guide located downstream, in the rotating direction, of the point of contact between the first jaw cylinder and the lower second jaw cylinder and disposed continuously along the circumferential surfaces of the first jaw cylinder and the lower second jaw cylinder, and a moving guide disposed to be movable by an air cylinder in accordance with the operating speed of the folding machine between a position, where the moving guide is closer to the circumferential surface of the first jaw cylinder than the stationary guide, and a position, where the moving guide is more remote from the circumferential surface of the first jaw cylinder than the stationary guide.

摘要翻译： 折叠机的平行折叠装置包括第一钳口气缸和下部第二钳口气缸，它们的周向表面彼此接触。 与第一钳口缸的刀配合，引导板引导在下部第二爪形缸的下圆周表面上运送的签名，该双面折叠由下部第二卡爪缸的夹持器双重折叠。 引导板包括位于第一钳口气缸和下部第二钳口气缸之间的接触点的沿旋转方向的下游的静止引导件，并且沿第一钳口气缸和下部第二钳口气缸的圆周表面连续设置， 以及移动引导件，其设置成可以通过所述折叠机的操作速度由气缸移动，所述移动引导件在所述移动引导件比所述固定引导件更靠近所述第一爪形滚筒的圆周表面的位置与位置之间， 其中移动引导件比第一夹爪圆柱体的圆周表面比固定引导件更远。