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    Method for the production of electrooptical printed circuit boards comprising polysiloxane wave guides and use thereof
    3.
    发明授权
    Method for the production of electrooptical printed circuit boards comprising polysiloxane wave guides and use thereof 失效
    包含聚硅氧烷波导的电光印刷电路板的制造方法及其用途

    公开(公告)号：US07630592B2

    公开(公告)日：2009-12-08

    申请号：US10575125

    申请日：2004-10-08

    申请人： Andreas Neyer ,  Erik Rabe ,  Stefan Kopetz

    发明人： Andreas Neyer ,  Erik Rabe ,  Stefan Kopetz

    IPC分类号： G02B6/12 ,  G02B6/10

    CPC分类号： G02B6/43 ,  G02B6/4246 ,  H05K1/0274

    摘要： The invention relates to the production of an electrooptical printed circuit board (EOLP) and to the use thereof. The optical layer in the printed circuit board is made of highly transparent and soldering bath-resistant polysiloxane wave guides. The polysiloxane wave guides are produced according to casting techniques, and the ends of the wave guides can comprise deviating mirrors which are integrated at 45°. During the casting process of the printed circuit board, the substrate layers and the supersubstrate layers made of polysiloxane are brought into contact with printed circuit board materials having microstructured spacers which are used to define the thickness of the substrate layer and/or the thickness of the supersubstrate layer. Openings are located in the printed circuit board material above the deviating mirrors, such that vertical light decoupling and coupling can take place. The printed circuit board can be applied to rigid or flexible carrier materials as an optical link circuit, or can be used as an optical layer in a multilayer-board composite or as an integrated optical component.

    摘要翻译： 本发明涉及电光印刷电路板（EOLP）的生产及其用途。 印刷电路板中的光学层由高透明度和耐焊锡的聚硅氧烷波导制成。 聚硅氧烷波导是根据铸造技术生产的，波导端部可以包括45°积分的偏光镜。 在印刷电路板的铸造过程中，使基底层和由聚硅氧烷制成的超基层与具有微结构化间隔物的印刷电路板材料接触，所述微结构隔离层用于限定基底层的厚度和/或厚度 超基层 开口位于偏转镜上方的印刷电路板材料中，使得可以发生垂直光去耦和耦合。 印刷电路板可以应用于作为光连接电路的刚性或柔性载体材料，或者可以用作多层板复合材料或集成光学部件中的光学层。

    Method for the production of electrooptical printed circuit boards comprising polysiloxane wave guides and use thereof
    4.
    发明申请
    Method for the production of electrooptical printed circuit boards comprising polysiloxane wave guides and use thereof 失效
    包括聚硅氧烷波导的电光印刷电路板的制造方法及其用途

    公开(公告)号：US20070122073A1

    公开(公告)日：2007-05-31

    申请号：US10575125

    申请日：2004-10-08

    申请人： Andreas Neyer ,  Erik Rabe ,  Stefan Kopetz

    发明人： Andreas Neyer ,  Erik Rabe ,  Stefan Kopetz

    IPC分类号： G02B6/12

    CPC分类号： G02B6/43 ,  G02B6/4246 ,  H05K1/0274

    摘要： The invention relates to the production of an electrooptical printed circuit board (EOLP) and to the use thereof. The optical layer in the printed circuit board is made of highly transparent and soldering bath-resistant polysiloxane wave guides. The polysiloxane wave guides are produced according to casting techniques, and the ends of the wave guides can comprise deviating mirrors which are integrated at 45°. During the casting process of the printed circuit board, the substrate layers and the supersubstrate layers made of polysiloxane are brought into contact with printed circuit board materials having microstructured spacers which are used to define the thickness of the substrate layer and/or the thickness of the supersubstrate layer. Openings are located in the printed circuit board material above the deviating mirrors, such that vertical light decoupling and coupling can take place. The printed circuit board can be applied to rigid or flexible carrier materials as an optical link circuit, or can be used as an optical layer in a multilayer-board composite or as an integrated optical component.

    摘要翻译： 本发明涉及电光印刷电路板（EOLP）的生产及其用途。 印刷电路板中的光学层由高透明度和耐焊锡的聚硅氧烷波导制成。 聚硅氧烷波导是根据铸造技术生产的，波导端部可以包括45°积分的偏光镜。 在印刷电路板的铸造过程中，使基底层和由聚硅氧烷制成的超基层与具有微结构间隔物的印刷电路板材料接触，所述微结构化隔板用于限定基底层的厚度和/或厚度 超基层 开口位于偏转镜上方的印刷电路板材料中，使得可以发生垂直光去耦和耦合。 印刷电路板可以应用于作为光连接电路的刚性或柔性载体材料，或者可以用作多层板复合材料或集成光学部件中的光学层。

    Method for linking two plastic work pieces without using foreign matter
    5.
    发明授权
    Method for linking two plastic work pieces without using foreign matter 有权
    连接两个塑料工件而不使用异物的方法

    公开(公告)号：US06838156B1

    公开(公告)日：2005-01-04

    申请号：US10088922

    申请日：2000-03-29

    申请人： Andreas Neyer ,  Matthias Jöhnck

    发明人： Andreas Neyer ,  Matthias Jöhnck

    IPC分类号： B29C65/00 ,  B29C65/02 ,  B29C71/04 ,  C08J5/12 ,  B32B3/00 ,  B32B31/00 ,  H05B6/00 ,  B29L59/16

    CPC分类号： B29C66/028 ,  B29C65/02 ,  B29C66/0242 ,  B29C66/1122 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/712 ,  B29C66/73117 ,  B29C71/04 ,  B29L2031/756 ,  C08J5/121 ,  Y10T428/24612 ,  Y10T428/24661 ,  B29K2069/00 ,  B29K2033/12

    摘要： The invention relates to a method for linking two adjacent plastic work pieces (2, 3). The inventive method is characterized in that the intended contact zone (K) of at least one of the two work pieces (2) with which the latter adjoins to the other work piece (3) is at least partially subjected to a high-energy radiation to such an extent that the glass transition temperature is reduced in a marginal zone (R). The two work pieces (2, 3) are brought in the desired position relative to each other. For establishing the connection of the two work pieces (2, 3) at least the marginal zone (R) modified by the previous radiation process is heated at least in its surface area to a temperature that is higher than the glass transition temperature of the marginal zone (R) modified by the radiation process but lower than the glass transition temperature of the zones of the work pieces (2, 3) that have not been modified. The invention also relates to an article (1) produced according to the inventive method that consists of two work pieces (2, 3) that are linked without using foreign matte. The inventive article is characterized in that recesses (V), especially channel-shaped recesses, are introduced in at least one contact zone (K) of the two work pieces (2).

    摘要翻译： 本发明涉及一种连接两个相邻的塑料件（2,3）的方法。 本发明的方法的特征在于，两个工件（2）中的至少一个工件（2）的后端与另一个工件（3）相邻的预定接触区域（K）至少部分地经受高能辐射 达到在边缘区域（R）中玻璃化转变温度降低的程度。 两个工件（2,3）相对于彼此被带入期望的位置。 为了建立两个工件（2,3）的连接，至少将由先前辐射过程修改的边缘区域（R）至少在其表面积中加热到高于边缘玻璃化转变温度的温度 （R），但是低于未被修改的工件（2,3）的区域的玻璃化转变温度。 本发明还涉及根据本发明的方法制造的制品（1），该制品由两个不使用异物磨砂而连接的工件（2,3）组成。 本发明的制品的特征在于，在两个工件（2）的至少一个接触区（K）中引入凹口（V），特别是通道形凹槽。