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公开(公告)号:US09074604B2
公开(公告)日:2015-07-07
申请号:US13432096
申请日:2012-03-28
申请人: Atsuo Konishi , Hiroyoshi Teshima
发明人: Atsuo Konishi , Hiroyoshi Teshima
CPC分类号: F04D17/164 , F04D25/0606 , F04D29/162 , F04D29/662
摘要: A centrifugal fan includes an upstream side impeller, a downstream side impeller, a motor, and a housing arranged to accommodate the upstream side impeller, the downstream side impeller, and the motor. The housing includes a first intake port through which a gas is drawn from an outside, an exhaust port through which the gas is discharged to the outside, and a flow path defined within the housing to bring the first intake port and the exhaust port into communication with each other. The flow path includes a first wind tunnel portion positioned below the upstream side impeller to extend in a circumferential direction and arranged to receive a gas stream from the upstream side impeller and a second wind tunnel portion positioned above the downstream side impeller to extend in the circumferential direction and arranged to receive a gas stream from the downstream side impeller.
摘要翻译: 离心风扇包括上游侧叶轮,下游侧叶轮,马达和布置成容纳上游侧叶轮,下游侧叶轮和马达的壳体。 壳体包括从外部抽出气体的第一进气口,将气体排出到外部的排气口和限定在壳体内的流路,以使第一进气口和排气口连通 与彼此。 流路包括位于上游侧叶轮下方的第一风洞部分,其沿圆周方向延伸并布置成接收来自上游侧叶轮的气流和位于下游侧叶轮上方的第二风洞部分,以在圆周方向上延伸 并且布置成从下游侧叶轮接收气流。
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公开(公告)号:US20070200223A1
公开(公告)日:2007-08-30
申请号:US11700106
申请日:2007-01-31
申请人: Atsuo Konishi
发明人: Atsuo Konishi
IPC分类号: H01L23/34
CPC分类号: H01L23/49568 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L29/0657 , H01L2224/04042 , H01L2224/05552 , H01L2224/05554 , H01L2224/05599 , H01L2224/06051 , H01L2224/274 , H01L2224/291 , H01L2224/29101 , H01L2224/29339 , H01L2224/32057 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83139 , H01L2224/83141 , H01L2224/83385 , H01L2224/8385 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/45099 , H01L2924/3512 , H01L2924/00012
摘要: A semiconductor device capable of dissipating heat with a high degree of efficiency without impairing the strength thereof is provided. The semiconductor device includes a semiconductor chip 2, a heatsink plate 1 overlapping a rear face of the semiconductor chip 2, and an adhesive 4 for adhesively fixing the semiconductor chip 2 and the heatsink plate 1 to each other. In the rear face of the semiconductor chip 2, there is formed a depressed portion 7 right under a heat generating portion 6 of the semiconductor chip 2. On the front face of the heatsink plate 1, there is formed a protruding portion 8 that is to fit in the depressed portion 7.
摘要翻译: 提供了能够以高效率而不损害强度的方式散热的半导体装置。 半导体器件包括半导体芯片2,与半导体芯片2的背面重叠的散热板1和用于将半导体芯片2和散热板1彼此粘合固定的粘合剂4。 在半导体芯片2的背面,在半导体芯片2的发热部6正下方形成有凹部7。 在散热板1的正面上形成有与凹部7嵌合的突出部8。
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公开(公告)号:US20120275915A1
公开(公告)日:2012-11-01
申请号:US13432096
申请日:2012-03-28
申请人: Atsuo KONISHI , Hiroyoshi TESHIMA
发明人: Atsuo KONISHI , Hiroyoshi TESHIMA
IPC分类号: F04D17/08
CPC分类号: F04D17/164 , F04D25/0606 , F04D29/162 , F04D29/662
摘要: A centrifugal fan includes an upstream side impeller, a downstream side impeller, a motor, and a housing arranged to accommodate the upstream side impeller, the downstream side impeller, and the motor. The housing includes a first intake port through which a gas is drawn from an outside, an exhaust port through which the gas is discharged to the outside, and a flow path defined within the housing to bring the first intake port and the exhaust port into communication with each other. The flow path includes a first wind tunnel portion positioned below the upstream side impeller to extend in a circumferential direction and arranged to receive a gas stream from the upstream side impeller and a second wind tunnel portion positioned above the downstream side impeller to extend in the circumferential direction and arranged to receive a gas stream from the downstream side impeller.
摘要翻译: 离心风扇包括上游侧叶轮,下游侧叶轮,马达和布置成容纳上游侧叶轮,下游侧叶轮和马达的壳体。 壳体包括从外部抽出气体的第一进气口,将气体排出到外部的排气口和限定在壳体内的流路,以使第一进气口和排气口连通 与彼此。 流路包括位于上游侧叶轮下方的第一风洞部分,其沿圆周方向延伸并布置成接收来自上游侧叶轮的气流和位于下游侧叶轮上方的第二风洞部分,以在圆周方向上延伸 并且布置成从下游侧叶轮接收气流。
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公开(公告)号:US20070099459A1
公开(公告)日:2007-05-03
申请号:US11554087
申请日:2006-10-30
申请人: Takaya OTSUKI , Takahiro KIKUICHI , Masayuki YAMADA , Toshikazu FUKUNAGA , Katsuo TAZAWA , Atsuo KONISHI , Mitsunobu NAKASE , Yusuke YOSHIDA
发明人: Takaya OTSUKI , Takahiro KIKUICHI , Masayuki YAMADA , Toshikazu FUKUNAGA , Katsuo TAZAWA , Atsuo KONISHI , Mitsunobu NAKASE , Yusuke YOSHIDA
IPC分类号: H01R13/44
CPC分类号: F04D25/0613 , F04D25/0693
摘要: A fan includes a motor, an impeller mounted to the motor and generating air flow by rotation around a rotation axis thereof, and a housing defining a passage of the air flow and supporting the motor. A wire outlet opening is provided on the housing in a manner axially penetrating the housing, and a lead wire is inserted into the wire outlet opening. A lead wire holding member is inserted into the wire outlet opening into which the lead wire is inserted, the lead wire holding member elastically presses the lead wire to the housing, and a latching portion of the lead wire holding member is latched to a portion of the housing. Therefore, the lead wire holding member fits in the wire outlet opening while firmly holding the lead wire in the wire outlet opening.
摘要翻译: 风扇包括电动机,安装到电动机上的叶轮,并且围绕其旋转轴线旋转产生空气流;以及壳体,其限定空气流的通道并支撑电动机。 电线出口开口以轴向穿透壳体的方式设置在壳体上,并且引线插入到电线出口开口中。 引线保持部件被插入导线插入的导线插口中,引线保持部件将导线弹性地按压到壳体,并且引线保持部件的闩锁部分被闩锁到 住房。 因此,在将导线牢固地固定在电线出口开口部的同时,引线保持部件嵌合在电线引出口中。
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公开(公告)号:US5427938A
公开(公告)日:1995-06-27
申请号:US185056
申请日:1994-01-24
申请人: Tsuneo Matsumura , Atsuo Konishi , Kouji Shirai
发明人: Tsuneo Matsumura , Atsuo Konishi , Kouji Shirai
CPC分类号: H01L23/49562 , B29C45/14655 , H01L21/565 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/97 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/181
摘要: A method of manufacturing a resin-sealed semiconductor device includes the steps of: supporting and fixing a supporting plate in a set of molds using a positioning pin with a sharp pin point which is inserted into the molds to have a predetermined clearance from the supporting plate; injecting a sealing resin 11 into a cavity formed in the molds; and removing the positioning pin from the molds after the sealing resin 11 hardens. This method increases the life of the positioning pin, facilitates the removal of a semiconductor device from the molds, and achieves a semiconductor device with good insulation.
摘要翻译: 一种制造树脂密封半导体器件的方法包括以下步骤:使用定位销将支撑板支撑并固定在一组模具中,所述定位销具有尖锐的销钉点,所述定位销插入到模具中以与支撑板具有预定的间隙 ; 将密封树脂11注入形成在模具中的空腔中; 并且在密封树脂11硬化之后从模具中移除定位销。 该方法增加了定位销的使用寿命,有助于从模具中去除半导体器件,并且实现了具有良好绝缘性的半导体器件。
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