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1.发明授权Method for production of a very thin layer with thinning by means of induced self-support 有权通过诱导自支撑生产具有变薄的非常薄层的方法公开(公告)号：US07776714B2
公开(公告)日：2010-08-17
申请号：US10558621
申请日：2004-06-03
IPC分类号： H01L21/30
CPC分类号： H01L21/76254
摘要： The invention relates to a process for obtaining a thin layer made of a first material on a substrate made of a second material called the final substrate, including the following steps: bonding a thick layer of a first material on one of its main faces on the final substrate at an interface, implantation of gaseous species in the thick layer of first material to create a weakened zone delimiting said thin layer between the interface and the weakened zone, deposit a layer of third material called the self-supporting layer on the thick layer made of first material, fracture within the structure composed of the final substrate, the thick layer of first material and the layer of third material, at the weakened zone to supply the substrate supporting said thin layer.
摘要翻译： 本发明涉及一种获得由第二材料制成的基板上由第一材料制成的薄层的方法，所述第二材料被称为最终基板，包括以下步骤：将第一材料的厚层在其主面之一 在界面处的最终底物，在第一材料的厚层中注入气态物质以产生限定界面和弱化区之间的所述薄层的弱化区，在厚层上沉积称为自支撑层的第三材料层 由第一材料制成，在由最终基底构成的结构内的断裂，第一材料的厚层和第三材料层在弱化区域处供应支撑所述薄层的基板。
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2.发明申请Method for production of a very thin layer with thinning by means of induced self-support 有权通过诱导自支撑生产具有变薄的非常薄层的方法公开(公告)号：US20070020895A1
公开(公告)日：2007-01-25
申请号：US10558621
申请日：2004-06-03
IPC分类号： H01L21/04
CPC分类号： H01L21/76254
摘要： The invention relates to a process for obtaining a thin layer made of a first material on a substrate made of a second material called the final substrate, including the following steps: bonding a thick layer of a first material on one of its main faces on the final substrate at an interface, implantation of gaseous species in the thick layer of first material to create a weakened zone delimiting said thin layer between the interface and the weakened zone, deposit a layer of third material called the self-supporting layer on the thick layer made of first material, fracture within the structure composed of the final substrate, the thick layer of first material and the layer of third material, at the weakened zone to supply the substrate supporting said thin layer.
摘要翻译： 本发明涉及一种获得由第二材料制成的基板上由第一材料制成的薄层的方法，所述第二材料被称为最终基板，包括以下步骤：将第一材料的厚层在其主面之一 在界面处的最终底物，在第一材料的厚层中注入气态物质以产生限定界面和弱化区之间的所述薄层的弱化区，在厚层上沉积称为自支撑层的第三材料层 由第一材料制成，在由最终基底构成的结构内的断裂，第一材料的厚层和第三材料层在弱化区域处供应支撑所述薄层的基板。
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3.发明授权公开(公告)号：US08329048B2
公开(公告)日：2012-12-11
申请号：US11722115
申请日：2005-12-22
IPC分类号： B23B37/02
CPC分类号： H01L21/02008 , H01L21/76251 , H01L21/76254 , Y10T156/10
摘要： A method for trimming a structure obtained by bonding a first wafer to a second waver on contact faces and thinning the first waver, wherein at least either the first wafer or the second wafer is chamfered and thus exposes the edge of the contact face of the first wafer, wherein the trimming concerns the first wafer. The method includes a) selecting the second wafer from among wafers with a resistance to a chemical etching planned in b) that is sufficient with respect to the first wafer to allow b) to be carried out; b) after bonding the first wafer to the second wafer, chemical etching the edge of the first wafer to form in the first wafer a pedestal resting entirely on the contact face of the second wafer and supporting the remaining of the first wafer; and c) thinning the first wafer until the pedestal is reached and attacked, to provide a thinned part of the first wafer.
摘要翻译： 一种用于修整通过将第一晶片接合在接触面上的第二摆动件并使第一摇摆器变薄而获得的结构的方法，其中至少第一晶片或第二晶片被倒角，从而使第一晶片或第二晶片的接触面的边缘暴露在第一 晶片，其中修整涉及第一晶片。 该方法包括：a）从具有对b）中计划的化学蚀刻的抗性的晶片中选择第二晶片，相对于第一晶片来说足以允许b）被执行; b）在将第一晶片接合到第二晶片之后，化学蚀刻第一晶片的边缘，以在第一晶片中形成完全搁置在第二晶片的接触面上并支撑第一晶片的剩余部分的基座; 以及c）使所述第一晶片变薄直到所述基座到达并受到攻击，以提供第一晶片的变薄部分。
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公开(公告)号：US20090095399A1
公开(公告)日：2009-04-16
申请号：US11722115
申请日：2005-12-22
IPC分类号： B32B37/02
CPC分类号： H01L21/02008 , H01L21/76251 , H01L21/76254 , Y10T156/10
摘要： A method for trimming a structure obtained by bonding a first wafer to a second waver on contact faces and thinning the first waver, wherein at least either the first wafer or the second wafer is chamfered and thus exposes the edge of the contact face of the first wafer, wherein the trimming concerns the first wafer. The method includes a) selecting the second wafer from among wafers with a resistance to a chemical etching planned in b) that is sufficient with respect to the first wafer to allow b) to be carried out; b) after bonding the first wafer to the second wafer, chemical etching the edge of the first wafer to form in the first wafer a pedestal resting entirely on the contact face of the second wafer and supporting the remaining of the first wafer; and c) thinning the first wafer until the pedestal is reached and attacked, to provide a thinned part of the first wafer.
摘要翻译： 一种用于修整通过将第一晶片接合在接触面上的第二摆动件并使第一摇摆器变薄而获得的结构的方法，其中至少第一晶片或第二晶片被倒角，从而使第一晶片或第二晶片的接触面的边缘暴露在第一 晶片，其中修整涉及第一晶片。 该方法包括：a）从具有对b）中计划的化学蚀刻的抗性的晶片中选择第二晶片，相对于第一晶片来说足以允许b）被执行; b）在将第一晶片接合到第二晶片之后，化学蚀刻第一晶片的边缘，以在第一晶片中形成完全搁置在第二晶片的接触面上并支撑第一晶片的剩余部分的基座; 以及c）使所述第一晶片变薄直到所述基座到达并受到攻击，以提供第一晶片的变薄部分。
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5.发明申请Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate 失效用于同时产生至少一对半导体结构的方法，每个半导体结构在衬底上包括至少一个有用层公开(公告)号：US20060286770A1
公开(公告)日：2006-12-21
申请号：US11509047
申请日：2006-08-24
CPC分类号： H01L21/76254 , Y10S438/977
摘要： A method for producing a semiconductor structure that includes at least one useful layer on a substrate. This method includes providing a source substrate with a zone of weakness therein that defines a relatively thick useful layer between the zone of weakness and a front face of the source substrate; bonding the front face of the source substrate to a support substrate and detaching the useful layer from the source substrate at the zone of weakness to transfer the useful layer to the support substrate; implanting atomic species into a free face of the useful layer to a controlled mean implantation depth therein to form a zone of weakness within the useful layer that defines front and rear useful layers, with the rear useful layer contacting the source substrate and the front useful layer containing a greater concentration of defects; bonding a stiffening substrate to the free face of the front useful layer after implantation of the atomic species; and detaching the front useful layer from the rear useful layer along the zone of weakness to form a semiconductor structure comprising the support substrate and the rear useful layer thereon. The structures obtained can be used in the fields of electronics, optoelectronics or optics.
摘要翻译： 一种用于制造半导体结构的方法，所述半导体结构在衬底上包括至少一个有用层。 该方法包括提供源极基底中的弱化区域，其在弱化区域和源极基底的前面之间限定相对较厚的有用层; 将源极基板的正面粘合到支撑基板上，并在弱化区域将有用层与源极基板分离，以将有用层转移到支撑基板; 将原子物质植入有用层的自由面中，以在其中形成受控的平均注入深度，以在限定前后有用层的有用层内形成弱化区，其中后部有用层与源极基底和前部有用层接触 含有较大浓度的缺陷; 在加入原子物质之后将加强基底粘合到前有用层的自由面上; 并且沿着弱化区从后部有用层分离前部有用层，以形成包括支撑基板和其上的后部有用层的半导体结构。 所获得的结构可用于电子学，光电子学或光学领域。
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公开(公告)号：US07688946B2
公开(公告)日：2010-03-30
申请号：US11666368
申请日：2005-10-24
IPC分类号： G01N23/20
摘要： The adhesion between two layers, in particular two thin layers of a microelectronic device, is a data item of importance. It was found that the closure ratio of the interface could be used, in non-destructive manner, to determine a measurement of bond energy. A method and a device using a magnitude characteristic of this length are described, in particular using low incidence X-ray reflection and electronic density at the interface.
摘要翻译： 两层之间的粘附，特别是微电子器件的两个薄层，是重要的数据项。 已经发现界面的封闭比可以以非破坏性方式用于确定键能的测量。 具体地说，使用该长度的幅度特性的方法和装置，特别是在界面处使用低入射X射线反射和电子密度。
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公开(公告)号：US20080063143A1
公开(公告)日：2008-03-13
申请号：US11666368
申请日：2005-10-24
IPC分类号： G01N23/20
摘要： The adhesion between two layers, in particular two thin layers of a microelectronic device, is a data item of importance. It was found that the closure ratio of the interface could be used, in non-destructive manner, to determine a measurement of bond energy. A method and a device using a magnitude characteristic of this length are described, in particular using low incidence X-ray reflection and electronic density at the interface.
摘要翻译： 两层之间的粘附，特别是微电子器件的两个薄层，是重要的数据项。 已经发现界面的封闭比可以以非破坏性方式用于确定键能的测量。 具体地说，使用该长度的幅度特性的方法和装置，特别是在界面处使用低入射X射线反射和电子密度。
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8.发明授权Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate 失效用于同时产生至少一对半导体结构的方法，每个半导体结构在衬底上包括至少一个有用层公开(公告)号：US07115481B2
公开(公告)日：2006-10-03
申请号：US10686084
申请日：2003-10-14
IPC分类号： H01L21/30
CPC分类号： H01L21/76254 , Y10S438/977
摘要： A method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate. The method includes providing an initial structure that includes a useful layer having a front face on a support substrate. Atomic species are implanted into the useful layer to a controlled mean implantation depth to form a zone of weakness within the useful layer that defines first and second useful layers. Next, a stiffening substrate is bonded to the front face of the initial structure. The first useful layer is then detached from the second useful layer along the zone of weakness to obtain a pair of semiconductor structures with a first structure including the stiffening substrate and the first useful layer and a second structure including the support substrate and the second useful layer. The structures obtained can be used in the fields of electronics, optoelectronics or optics.
摘要翻译： 一种用于同时产生至少一对半导体结构的方法，每个半导体结构在衬底上包括至少一个有用层。 该方法包括提供初始结构，其包括在支撑衬底上具有正面的有用层。 将原子物质植入有用层中至受控的平均植入深度，以形成限定第一和第二有用层的有用层内的弱点区域。 接下来，将加强基板粘合到初始结构的正面。 然后沿着弱化区从第二有用层分离第一有用层，以获得一对具有第一结构的半导体结构，该第一结构包括加强衬底和第一有用层，以及包括支撑衬底和第二有用层的第二结构 。 所获得的结构可用于电子学，光电子学或光学领域。
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公开(公告)号：US08501026B2
公开(公告)日：2013-08-06
申请号：US13377319
申请日：2010-06-17
申请人： Christophe Constancias , Bernard Dalzotto , Frank Fournel , Philippe Michallon , Hubert Moriceau , Valerie Pouteau
发明人： Christophe Constancias , Bernard Dalzotto , Frank Fournel , Philippe Michallon , Hubert Moriceau , Valerie Pouteau
CPC分类号： B81C1/00158 , B81B2201/0264 , B81B2201/047 , B81C2201/017
摘要： A method for determining a minimum tension compensation stress which will have a membrane of a thickness of less than or equal to one micrometer, secured to a frame, having, in the absence of any external stress, a desired deflection. The membrane can be made as planar as possible in absence of any external stress, and its thickness can be less than or equal to one micrometer.
摘要翻译： 一种用于确定最小张力补偿应力的方法，其将具有小于或等于1微米厚度的膜，固定到框架，在没有任何外部应力的情况下具有期望的偏转。 膜可以在没有任何外部应力的情况下制成尽可能平坦的，并且其厚度可以小于或等于1微米。
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10.发明申请PHOTOVOLTAIC CELL, INCLUDING A CRYSTALLINE SILICON OXIDE PASSIVATION THIN FILM, AND METHOD FOR PRODUCING SAME 审中-公开包括晶体氧化硅钝化薄膜的光电池及其制造方法公开(公告)号：US20120291861A1
公开(公告)日：2012-11-22
申请号：US13522901
申请日：2011-01-26
IPC分类号： H01L31/077 , H01L31/0352 , H01L31/18 , H01L31/075
CPC分类号： H01L31/0745 , H01L31/0747 , H01L31/1868 , Y02E10/50 , Y02P70/521
摘要： A heterojunction photovoltaic cell includes at least one crystalline silicon oxide film directly placed onto one of the front or rear faces of a crystalline silicon substrate, between said substrate and a layer of amorphous or microcrystalline silicon. The thin film is intended to enable the passivation of said face of the substrate. The thin film is more particularly obtained by radically oxidizing a surface portion of the substrate, before depositing the layer of amorphous silicon. Moreover, a thin layer of intrinsic or microdoped amorphous silicon can be placed between said think film and the layer of amorphous or microcrystalline silicon.
摘要翻译： 异质结光伏电池包括直接放置在晶体硅衬底的前表面或后表面之一上的至少一个晶体氧化硅膜，位于所述衬底和非晶或微晶硅层之间。 薄膜旨在使得能够钝化基底的所述面。 在沉积非晶硅层之前，更特别地通过对衬底的表面部分进行自由基氧化来获得薄膜。 此外，可以在所述思维膜和非晶或微晶硅层之间放置本征或微掺杂非晶硅的薄层。
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