公开(公告)号：US20120068317A1

公开(公告)日：2012-03-22

申请号：US12883556

申请日：2010-09-16

申请人： Belgacem Haba ,  Brian Marcucci

发明人： Belgacem Haba ,  Brian Marcucci

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L24/89 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49589 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/49109 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor device of an illustrative embodiment includes a die, a lead frame including a plurality of leads having substantial portions arranged in a lead plane and electrically connected to the die. Most preferably, the package includes at least a substantial portion of one conductive element arranged in a plane positioned adjacent the lead frame and substantially parallel to the lead plane, the conductive element being capacitively coupled to the leads such that the conductive element and at least one of the leads cooperatively define a controlled-impedance conduction path, and an encapsulant which encapsulates the leads and the conductive element. The leads and, desirably, the conductive element have respective connection regions which are not covered by the encapsulant.

摘要翻译： 示例性实施例的半导体器件包括管芯，引线框架，其包括多个引线，其具有布置在引线平面中并且电连接到管芯的实质部分。 最优选地，封装包括布置在邻近引线框架并且基本上平行于引线平面的平面中的一个导电元件的至少大部分，导电元件电容耦合到引线，使得导电元件和至少一个 引线协调地限定受控阻抗传导路径，以及密封剂，其封装引线和导电元件。 引线和理想的导电元件具有不被密封剂覆盖的各自的连接区域。

公开(公告)号：US20110101535A1

公开(公告)日：2011-05-05

申请号：US12986601

申请日：2011-01-07

申请人： Belgacem Haba ,  Brian Marcucci

发明人： Belgacem Haba ,  Brian Marcucci

IPC分类号： H01L23/49

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48505 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49052 ,  H01L2224/49095 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/85045 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/4569 ,  H01L2224/05644 ,  H01L2224/45184 ,  H01L2224/05647 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer has a conductive surface disposed at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material can have first and second dimensions in first and second horizontal directions which are smaller than first and second corresponding dimensions of the microelectronic device. The conductive material is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

公开(公告)号：US08624407B2

公开(公告)日：2014-01-07

申请号：US13589558

申请日：2012-08-20

申请人： Belgacem Haba ,  Brian Marcucci

发明人： Belgacem Haba ,  Brian Marcucci

IPC分类号： H01L21/306

CPC分类号： B81B7/0006 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/49052 ,  H01L2224/49174 ,  H01L2224/49176 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00011 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic device, e.g., semiconductor chip, is connected with an interconnection element having signal contacts and reference contacts, the reference contacts being connectable to a reference potential such as ground or power. Signal conductors, e.g., signal wirebonds can be connected to device contacts of the microelectronic device, and at least one reference conductor, e.g., reference wirebond can be connected with two reference contacts. The reference wirebond can have a run extending at an at least substantially uniform spacing from an at least a substantial portion of a length of a signal conductor, e.g., signal wirebond. In such manner a desired impedance may be achieved for the signal conductor.

摘要翻译： 诸如半导体芯片的微电子器件与具有信号触点和参考触点的互连元件连接，该参考触点可连接到参考电位，例如地或功率。 诸如信号引线键的信号导体可以连接到微电子器件的器件触点，并且至少一个参考导体，例如参考引线键可以与两个参考触点连接。 参考引线键可以具有从与信号导体的长度的至少大部分的至少基本均匀的间隔延伸的行程，例如信号引线键。 以这种方式，可以为信号导体实现期望的阻抗。

公开(公告)号：US08575766B2

公开(公告)日：2013-11-05

申请号：US12986556

申请日：2011-01-07

申请人： Belgacem Haba ,  Brian Marcucci

发明人： Belgacem Haba ,  Brian Marcucci

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48505 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49052 ,  H01L2224/49095 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/85045 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/4569 ,  H01L2224/05644 ,  H01L2224/45184 ,  H01L2224/05647 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer has a conductive surface disposed at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material can have first and second dimensions in first and second horizontal directions which are smaller than first and second corresponding dimensions of the microelectronic device. The conductive material is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

摘要翻译： 微电子组件可以包括具有在其表面处暴露的器件触点的微电子器件和具有元件触点并具有与微电子器件相邻的面的互连元件。 导电元件例如引线将器件触点与元件触点连接，并具有在微电子器件的表面上方延伸的部分。 导电层具有在多个导电元件的行程之上或之下至少设置至少基本均匀的距离的导电表面。 在一些情况下，导电材料可以在第一和第二水平方向上具有小于微电子器件的第一和第二对应尺寸的第一和第二尺寸。 导电材料可连接到参考电位源，以便实现导电元件所需的阻抗。

公开(公告)号：US20110095408A1

公开(公告)日：2011-04-28

申请号：US12986556

申请日：2011-01-07

申请人： Belgacem Haba ,  Brian Marcucci

发明人： Belgacem Haba ,  Brian Marcucci

IPC分类号： H01L23/495

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48505 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49052 ,  H01L2224/49095 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/85045 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/4569 ,  H01L2224/05644 ,  H01L2224/45184 ,  H01L2224/05647 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer has a conductive surface disposed at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material can have first and second dimensions in first and second horizontal directions which are smaller than first and second corresponding dimensions of the microelectronic device. The conductive material is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

摘要翻译： 微电子组件可以包括具有在其表面处暴露的器件触点的微电子器件和具有元件触点并具有与微电子器件相邻的面的互连元件。 导电元件例如引线将器件触点与元件触点连接，并具有在微电子器件的表面上方延伸的部分。 导电层具有在多个导电元件的行程之上或之下至少设置至少基本均匀的距离的导电表面。 在一些情况下，导电材料可以在第一和第二水平方向上具有小于微电子器件的第一和第二对应尺寸的第一和第二尺寸。 导电材料可连接到参考电位源，以便实现导电元件所需的阻抗。

公开(公告)号：US20100232128A1

公开(公告)日：2010-09-16

申请号：US12722799

申请日：2010-03-12

申请人： Belgacem Haba ,  Brian Marcucci

发明人： Belgacem Haba ,  Brian Marcucci

IPC分类号： H05K7/00

CPC分类号： B81B7/0006 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/49052 ,  H01L2224/49174 ,  H01L2224/49176 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00011 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly can include a microelectronic device, e.g., semiconductor chip, connected together with an interconnection element, e.g., substrate, the latter having signal contacts and reference contacts. The reference contacts can be connectable to a source of reference potential such as ground or a voltage source other than ground such as a voltage source used for power. Signal conductors, e.g., signal wirebonds can be connected to device contacts exposed at a surface of the microelectronic device. Reference conductors, e.g., reference wirebonds can be provided, at least one of which can be connected with two reference contacts of the interconnection element. The reference wirebond can have a run which extends at an at least substantially uniform spacing from a signal conductor, e.g., signal wirebond that is connected to the microelectronic device over at least a substantial portion of the length of the signal conductor. In such manner a desired impedance may be achieved for the signal conductor.

摘要翻译： 微电子组件可以包括与互连元件例如衬底连接在一起的微电子器件，例如半导体芯片，衬底具有信号触点和参考触点。 参考触点可以连接到参考电位源，例如接地或除接地之外的电压源，例如用于电源的电压源。 信号导体，例如，信号引线键可以连接到暴露在微电子器件表面处的器件触点。 可以提供参考导体，例如参考导线键，其中的至少一个可以与互连元件的两个参考触点连接。 参考引线键可以具有以与信号导体（例如，在信号导体的至少大部分长度上连接到微电子器件）的信号引线接合至少基本均匀的间隔延伸的延伸。 以这种方式，可以为信号导体实现期望的阻抗。

公开(公告)号：US20130140716A1

公开(公告)日：2013-06-06

申请号：US13589558

申请日：2012-08-20

申请人： Belgacem Haba ,  Brian Marcucci

发明人： Belgacem Haba ,  Brian Marcucci

IPC分类号： B81B7/00

CPC分类号： B81B7/0006 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/49052 ,  H01L2224/49174 ,  H01L2224/49176 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00011 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic device, e.g., semiconductor chip, is connected with an interconnection element having signal contacts and reference contacts, the reference contacts being connectable to a reference potential such as ground or power. Signal conductors, e.g., signal wirebonds can be connected to device contacts of the microelectronic device, and at least one reference conductor, e.g., reference wirebond can be connected with two reference contacts. The reference wirebond can have a run extending at an at least substantially uniform spacing from an at least a substantial portion of a length of a signal conductor, e.g., signal wirebond. In such manner a desired impedance may be achieved for the signal conductor.

摘要翻译： 诸如半导体芯片的微电子器件与具有信号触点和参考触点的互连元件连接，该参考触点可连接到参考电位，例如地或功率。 诸如信号引线键的信号导体可以连接到微电子器件的器件触点，并且至少一个参考导体，例如参考引线键可以与两个参考触点连接。 参考引线键可以具有从与信号导体的长度的至少大部分的至少基本均匀的间隔延伸的行程，例如信号引线键。 以这种方式，可以为信号导体实现期望的阻抗。

公开(公告)号：US08269357B2

公开(公告)日：2012-09-18

申请号：US12986601

申请日：2011-01-07

申请人： Belgacem Haba ,  Brian Marcucci

发明人： Belgacem Haba ,  Brian Marcucci

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48505 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49052 ,  H01L2224/49095 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/85045 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/4569 ,  H01L2224/05644 ,  H01L2224/45184 ,  H01L2224/05647 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer has a conductive surface disposed at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material can have first and second dimensions in first and second horizontal directions which are smaller than first and second corresponding dimensions of the microelectronic device. The conductive material is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

摘要翻译： 微电子组件可以包括具有在其表面处暴露的器件触点的微电子器件和具有元件触点并具有与微电子器件相邻的面的互连元件。 导电元件例如引线将器件触点与元件触点连接，并具有在微电子器件的表面上方延伸的部分。 导电层具有在多个导电元件的行程之上或之下至少设置至少基本均匀的距离的导电表面。 在一些情况下，导电材料可以在第一和第二水平方向上具有小于微电子器件的第一和第二对应尺寸的第一和第二尺寸。 导电材料可连接到参考电位源，以便实现导电元件所需的阻抗。

公开(公告)号：US08253259B2

公开(公告)日：2012-08-28

申请号：US12722799

申请日：2010-03-12

申请人： Belgacem Haba ,  Brian Marcucci

发明人： Belgacem Haba ,  Brian Marcucci

IPC分类号： H01L21/306

CPC分类号： B81B7/0006 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/49052 ,  H01L2224/49174 ,  H01L2224/49176 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00011 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly can include a microelectronic device, e.g., semiconductor chip, connected together with an interconnection element, e.g., substrate, the latter having signal contacts and reference contacts. The reference contacts can be connectable to a source of reference potential such as ground or a voltage source other than ground such as a voltage source used for power. Signal conductors, e.g., signal wirebonds can be connected to device contacts exposed at a surface of the microelectronic device. Reference conductors, e.g., reference wirebonds can be provided, at least one of which can be connected with two reference contacts of the interconnection element. The reference wirebond can have a run which extends at an at least substantially uniform spacing from a signal conductor, e.g., signal wirebond that is connected to the microelectronic device over at least a substantial portion of the length of the signal conductor. In such manner a desired impedance may be achieved for the signal conductor.

摘要翻译： 微电子组件可以包括与互连元件例如衬底连接在一起的微电子器件，例如半导体芯片，衬底具有信号触点和参考触点。 参考触点可以连接到参考电位源，例如接地或除接地之外的电压源，例如用于电源的电压源。 信号导体，例如，信号引线键可以连接到暴露在微电子器件表面处的器件触点。 可以提供参考导体，例如参考导线键，其中的至少一个可以与互连元件的两个参考触点连接。 参考引线键可以具有以与信号导体（例如，在信号导体的至少大部分长度上连接到微电子器件）的信号引线接合至少基本均匀的间隔延伸的延伸。 以这种方式，可以为信号导体实现期望的阻抗。

公开(公告)号：US20100230828A1

公开(公告)日：2010-09-16

申请号：US12722784

申请日：2010-03-12

申请人： Belgacem Haba ,  Brian Marcucci

发明人： Belgacem Haba ,  Brian Marcucci

IPC分类号： H01L23/49

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48505 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49052 ,  H01L2224/49095 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/85045 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/4569 ,  H01L2224/05644 ,  H01L2224/45184 ,  H01L2224/05647 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer has a conductive surface disposed at at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material can have first and second dimensions in first and second horizontal directions which are smaller than first and second corresponding dimensions of the microelectronic device. The conductive material is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

摘要翻译： 微电子组件可以包括具有在其表面处暴露的器件触点的微电子器件和具有元件触点并具有与微电子器件相邻的面的互连元件。 导电元件例如引线将器件触点与元件触点连接，并具有在微电子器件的表面上方延伸的部分。 导电层具有导电表面，该导电表面设置成在多个导电元件的行程之上或之下至少基本均匀的距离。 在一些情况下，导电材料可以在第一和第二水平方向上具有小于微电子器件的第一和第二对应尺寸的第一和第二尺寸。 导电材料可连接到参考电位源，以便实现导电元件所需的阻抗。