公开(公告)号：US20050051895A1

公开(公告)日：2005-03-10

申请号：US10720484

申请日：2003-11-25

Applicant: Byoung-Chan Kim ,  Young-Hwan Shin ,  Kyoung-Ro Yoon

Inventor： Byoung-Chan Kim ,  Young-Hwan Shin ,  Kyoung-Ro Yoon

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/525 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L23/48 ,  H01L21/44

CPC classification number: H01L23/525 ,  H01L23/3128 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/4911 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: The present invention relates to a BGA package having center-bonding type semiconductor chips with edge-bonding metal patterns formed thereon wherein the edge-bonding metal patterns are formed on the semiconductor chips in a wafer level, and wire bonding is carried out in the shape of edge bonding so that a plurality of semiconductor chips are stacked, whereby high-density memory performance is obtained, and a method of manufacturing the same.

Abstract translation: 本发明涉及一种具有形成在其上形成有边缘焊接金属图案的中心接合型半导体芯片的BGA封装，其中在半导体芯片上以晶片级形成边缘焊接金属图案，并且引线接合以形状 的边缘接合，从而堆叠多个半导体芯片，从而获得高密度存储器性能及其制造方法。

公开(公告)号：US20130280125A1

公开(公告)日：2013-10-24

申请号：US13672399

申请日：2012-11-08

Applicant: Byoung Chan KIM ,  Jon Soo JURNG ,  Min Young SONG

Inventor： Byoung Chan KIM ,  Jon Soo JURNG ,  Min Young SONG

IPC: A61L2/10

CPC classification number: A61L2/10 ,  A61L2/088

Abstract: Disclosed is an antibacterial composition comprising titanium oxide particles immobilized with an antibody having affinity and cognitive power to a microorganism of interest, and a method for sterilizing the microorganism by using the same. In particular, the present invention relates to a method for preparing functional titanium oxide particles capable of recognizing a microorganism or a virus of interest, and a method for selectively and efficiently sterilizing the same by using the functional titanium oxide particles, and not for randomly sterilizing microorganisms or viruses by using conventional titanium oxide particles having no recognition power to a microorganism or a virus of interest.

Abstract translation: 公开了一种抗菌组合物，其包含固定有对感兴趣的微生物具有亲和力和认知能力的抗体的氧化钛颗粒，以及使用该微生物的方法。 特别地，本发明涉及一种能够识别感兴趣的微生物或感兴趣的病毒的功能性氧化钛粒子的方法，以及通过使用所述功能性氧化钛粒子选择性且有效地对其消毒的方法，而不是用于随机灭菌 通过使用对感兴趣的微生物或感兴趣的病毒不具有识别能力的常规氧化钛颗粒的微生物或病毒。

公开(公告)号：US08201324B2

公开(公告)日：2012-06-19

申请号：US12359416

申请日：2009-01-26

Applicant: Byoung-Chan Kim ,  Young-Hwan Shin ,  Jong-Jin Lee

Inventor： Byoung-Chan Kim ,  Young-Hwan Shin ,  Jong-Jin Lee

IPC: H05K3/36

CPC classification number: H01L24/91 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/18162 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4602 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2203/0376 ,  H05K2203/1469 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/82 ,  H01L2224/0401

Abstract: An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.

Abstract translation: 公开了电子部件嵌入式印刷电路板及其制造方法。 该方法包括：提供具有形成在其一个表面上的第一电路图案的第一载体; 提供具有形成在其一个表面上的第二电路图案的第二载体; 将电子部件倒装成第一电路图案; 将绝缘体的一侧堆叠在第一载体的一侧以覆盖电子部件; 在绝缘体的另一侧上压制在其一个表面上形成有第二电路图案的第二载体; 以及去除所述第一载体和所述第二载体。 该方法可以通过使用倒装芯片接合方法嵌入电子部件来提高电气部件的构造程度，并且可以通过简化制造工艺来提高成品率。

公开(公告)号：US20120134125A1

公开(公告)日：2012-05-31

申请号：US13364104

申请日：2012-02-01

Applicant: Byoung-Chan Kim ,  Young-Hwan Shin ,  Jong-Jin Lee

Inventor： Byoung-Chan Kim ,  Young-Hwan Shin ,  Jong-Jin Lee

IPC: H05K1/18

CPC classification number: H01L24/91 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/18162 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4602 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2203/0376 ,  H05K2203/1469 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/82 ,  H01L2224/0401

Abstract: An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.

Abstract translation: 公开了电子部件嵌入式印刷电路板及其制造方法。 该方法包括：提供具有形成在其一个表面上的第一电路图案的第一载体; 提供具有形成在其一个表面上的第二电路图案的第二载体; 将电子部件倒装成第一电路图案; 将绝缘体的一侧堆叠在第一载体的一侧以覆盖电子部件; 在绝缘体的另一侧上压制在其一个表面上形成有第二电路图案的第二载体; 以及去除所述第一载体和所述第二载体。 该方法可以通过使用倒装芯片接合方法嵌入电子部件来提高电气部件的构造程度，并且可以通过简化制造工艺来提高成品率。

公开(公告)号：US20080066296A1

公开(公告)日：2008-03-20

申请号：US11984272

申请日：2007-11-15

Applicant: Chung-kyun Shin ,  Byoung-chan Kim ,  Jae-joon Ryou

Inventor： Chung-kyun Shin ,  Byoung-chan Kim ,  Jae-joon Ryou

IPC: H05B3/84 ,  H05K3/10

CPC classification number: H05B3/84 ,  H05B3/845 ,  H05B2203/017 ,  Y10T29/49083 ,  Y10T29/49155 ,  Y10T29/49174

Abstract: There are provided a method for manufacturing an electric heating mirror and the mirror thereof. An electrode pattern is printed on a metal-coated surface of the mirror in which the metal-coated surface is formed on a rear surface of a glass plate, or printed on a rear surface of the glass plate of the mirror in which the metal-coated surface is formed on a front surface of the glass plate using a conductive paste. Thereafter, a current input terminal is connected to the electrode pattern in parallel after protecting the electrode pattern by a PTC paste. Alternatively, the current input terminal is connected to the electrode pattern in series after forming a passivation layer on the electrode pattern by any of printing, coating, and deposition process. According to the method, the manufacturing process is simplified and the manufacturing cost decreases. In addition, environmental pollutants are not produced at all and the durability of the plane heater is enhanced. Further, the electrode pattern is not damaged and thus, there is no flame during the heating operation of the plane heater.

Abstract translation: 提供了一种用于制造电加热镜及其反射镜的方法。 将电极图案印刷在反射镜的金属涂覆表面上，其中金属涂覆表面形成在玻璃板的后表面上，或印刷在反射镜的玻璃板的后表面上， 使用导电浆料在玻璃板的前表面上形成涂布表面。 此后，电流输入端子在通过PTC糊料保护电极图案之后并联连接到电极图案。 或者，电流输入端子通过印刷，涂布和沉积工艺中的任何一种在电极图案上形成钝化层之后串联连接到电极图案。 根据该方法，制造工序简化，制造成本降低。 此外，根本不产生环境污染物，平面加热器的耐久性得到提高。 此外，电极图案不被损坏，因此在平面加热器的加热操作期间不存在火焰。

公开(公告)号：US07971448B2

公开(公告)日：2011-07-05

申请号：US12649389

申请日：2009-12-30

Applicant: Seung Yup Kim ,  Byoung Chan Kim ,  Hyung Tae Kim ,  Dong Soo Lee

Inventor： Seung Yup Kim ,  Byoung Chan Kim ,  Hyung Tae Kim ,  Dong Soo Lee

IPC: F25D21/14

CPC classification number: F24F1/38 ,  F04D29/541 ,  F04D29/601 ,  F24F1/40 ,  F24F1/50 ,  F24F1/56

Abstract: An air conditioner includes a heat-exchanger positioned in an outdoor unit and configured to conduct heat-exchange between air provided from outside of the outdoor unit and a refrigerant. The air conditioner also includes a fan configured to generate a flow of the air that is from the heat-exchanger to an outlet of the outdoor unit. The air conditioner further includes a driving unit configured to provide a driving force to the fan. In addition, the air conditioner includes a first member positioned in the flow of the air generated by the fan and a second member configured to guide a flow of the air to reduce collision between the air and the first member when the fan is operated.

Abstract translation: 一种空调装置，其具有：设置在室外机中的热交换器，其构造为在从室外机外部供给的空气与制冷剂之间进行热交换。 空调还包括风扇，其被配置为产生从热交换器到室外单元的出口的空气流。 空调器还包括驱动单元，其构造成向风扇提供驱动力。 另外，空调机包括位于风扇产生的空气流中的第一构件和被构造成引导空气流的第二构件，以在风扇运转时减少空气与第一构件之间的碰撞。

公开(公告)号：US20100012364A1

公开(公告)日：2010-01-21

申请号：US12359416

申请日：2009-01-26

Applicant: Byoung-Chan KIM ,  Young-Hwan Shin ,  Jong-Jin Lee

Inventor： Byoung-Chan KIM ,  Young-Hwan Shin ,  Jong-Jin Lee

IPC: H05K1/16 ,  H05K3/36

CPC classification number: H01L24/91 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/18162 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4602 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2203/0376 ,  H05K2203/1469 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/82 ,  H01L2224/0401

Abstract: An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.

Abstract translation: 公开了电子部件嵌入式印刷电路板及其制造方法。 该方法包括：提供具有形成在其一个表面上的第一电路图案的第一载体; 提供具有形成在其一个表面上的第二电路图案的第二载体; 将电子部件倒装成第一电路图案; 将绝缘体的一侧堆叠在第一载体的一侧以覆盖电子部件; 在绝缘体的另一侧上压制在其一个表面上形成有第二电路图案的第二载体; 以及去除所述第一载体和所述第二载体。 该方法可以通过使用倒装芯片接合方法嵌入电子部件来提高电气部件的构造程度，并且可以通过简化制造工艺来提高成品率。

公开(公告)号：US20090277673A1

公开(公告)日：2009-11-12

申请号：US12215414

申请日：2008-06-27

Applicant: Seung Hyun Sohn ,  Yul Kyo Chung ,  Byoung Chan Kim ,  Moon Il Kim ,  Kwan Kyu Kim ,  Yee Na Shin

Inventor： Seung Hyun Sohn ,  Yul Kyo Chung ,  Byoung Chan Kim ,  Moon Il Kim ,  Kwan Kyu Kim ,  Yee Na Shin

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/025 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/063 ,  H05K2203/1152 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Provided is a PCB having electronic components embedded therein, the PCB including a core layer having electronic components embedded therein and a resin layer formed thereon and thereunder; internal layer circuits formed on the resin layer and being electrically connected to the electronic components; an insulating layer formed on the internal layer circuits; and external layer circuits formed on the insulating layer and being electrically connected to the internal layer circuits.

Abstract translation: 本发明提供一种嵌入其中的电子部件的PCB，该PCB包括嵌入其中的电子部件的芯层和在其上形成的树脂层。 形成在树脂层上并与电子部件电连接的内层电路; 形成在所述内层电路上的绝缘层; 以及形成在绝缘层上并与内部层电路电连接的外部层电路。

公开(公告)号：US20110286191A1

公开(公告)日：2011-11-24

申请号：US12926337

申请日：2010-11-10

Applicant: Byoung Chan Kim ,  Young Hwan Shin ,  Chin Kwan Kim ,  Dong Won Kim ,  Kui Won Kang

Inventor： Byoung Chan Kim ,  Young Hwan Shin ,  Chin Kwan Kim ,  Dong Won Kim ,  Kui Won Kang

IPC: H05K7/06

CPC classification number: H01L23/49816 ,  H01L21/563 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.

Abstract translation: 这里公开了一种印刷电路板。 印刷电路板包括：基底基板，其包括安装有半导体芯片的第一区域和位于第一区域外部的第二区域;覆盖基底基板并且包括形成在第二区域上的沟槽的第一绝缘图案，以及第二绝缘图案突出 从第二区域上的第一绝缘图案。 在形成底部填充剂的过程中，沟槽和第二绝缘图案可以用作限定形成预处理形状的底部填充材料的结构。

公开(公告)号：US20100175407A1

公开(公告)日：2010-07-15

申请号：US12649389

申请日：2009-12-30

Applicant: Seung Yup Kim ,  Byoung Chan Kim ,  Hyung Tae Kim ,  Dong Soo Lee

Inventor： Seung Yup Kim ,  Byoung Chan Kim ,  Hyung Tae Kim ,  Dong Soo Lee

IPC: F25D21/14 ,  F25B41/00 ,  F25D17/06

CPC classification number: F24F1/38 ,  F04D29/541 ,  F04D29/601 ,  F24F1/40 ,  F24F1/50 ,  F24F1/56

Abstract: An air conditioner includes a heat-exchanger positioned in an outdoor unit and configured to conduct heat-exchange between air provided from outside of the outdoor unit and a refrigerant. The air conditioner also includes a fan configured to generate a flow of the air that is from the heat-exchanger to an outlet of the outdoor unit. The air conditioner further includes a driving unit configured to provide a driving force to the fan. In addition, the air conditioner includes a first member positioned in the flow of the air generated by the fan and a second member configured to guide a flow of the air to reduce collision between the air and the first member when the fan is operated.

Abstract translation: 一种空调装置，其具有：设置在室外机中的热交换器，其构造为在从室外机外部供给的空气与制冷剂之间进行热交换。 空调还包括风扇，其被配置为产生从热交换器到室外单元的出口的空气流。 空调器还包括驱动单元，其构造成向风扇提供驱动力。 另外，空调机包括位于风扇产生的空气流中的第一构件和被构造成引导空气流的第二构件，以在风扇运转时减少空气与第一构件之间的碰撞。