公开(公告)号：US20120015886A1

公开(公告)日：2012-01-19

申请号：US12907475

申请日：2010-10-19

Applicant: UhTaek OH ,  Byung Moon Kim ,  Seung Pyo Park ,  Heung Sik Na

Inventor： UhTaek OH ,  Byung Moon Kim ,  Seung Pyo Park ,  Heung Sik Na

IPC: A61K38/17 ,  A61P29/00

CPC classification number: C07K14/43518 ,  C12N15/815

Abstract: The present invention relates to a method for producing a recombinant, spider toxin peptide and analgesic compositions containing said peptide. More specifically, the present invention relates to a method in which the gene for GsMTx4 is subcloned into a vector, so that it is linked to a secretion signal sequence of the alpha factor and under the control of methanol-inducible alcohol oxidase (AOX) promoter to construct a recombinant yeast expression plasmid. Yeast cells are transformed with this plasmid to produce the GsMTx4 peptide and analgesic compositions containing said peptide. The recombinant yeast expression system of the present invention affords a more stable method for producing GsMTx4 than its natural route. Thus the GsMTx4 peptide and its derivatives produced by the method of this invention can be used in the cure of related diseases such as heart failure as the peptide specifically inhibits mechanosensitive ion channels.

Abstract translation: 本发明涉及一种生产含有所述肽的重组蜘蛛毒素肽和镇痛组合物的方法。 更具体地，本发明涉及将GsMTx4的基因亚克隆到载体中的方法，使其与α因子的分泌信号序列连接并在甲醇诱导型醇氧化酶（AOX）启动子的控制下 构建重组酵母表达质粒。 用该质粒转化酵母细胞以产生含有所述肽的GsMTx4肽和镇痛组合物。 本发明的重组酵母表达系统提供比其自然途径更稳定的产生GsMTx4的方法。 因此，通过本发明方法产生的GsMTx4肽及其衍生物可用于治疗诸如心力衰竭等相关疾病，因为该肽特异性抑制机械敏感离子通道。

公开(公告)号：US20110048786A1

公开(公告)日：2011-03-03

申请号：US12870137

申请日：2010-08-27

Applicant: Suk Hyeon Cho ,  Jin Yong Ahn ,  Soon Oh Jung ,  Dong Ju Jeon ,  Ki Hwan Kim ,  Byung Moon Kim

Inventor： Suk Hyeon Cho ,  Jin Yong Ahn ,  Soon Oh Jung ,  Dong Ju Jeon ,  Ki Hwan Kim ,  Byung Moon Kim

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K3/4015 ,  H05K3/007 ,  H05K3/20 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10242 ,  H05K2203/0338 ,  Y10T29/49155

Abstract: Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.

Abstract translation: 这里公开了具有凹凸的印刷电路板及其制造方法。 具有凸块的印刷电路板包括绝缘层，内部电路层被浸渍到该绝缘层中; 形成在所述绝缘层之下并具有暴露所述内部电路层的焊盘单元的开口的保护层; 以及与所述垫单元一体形成并从所述保护层的内侧通过所述开口突出到所述保护层的外侧的凸块。 凸块与焊盘单元一体地形成，从而提高凸块和印刷电路板之间的接合强度，并且凸块的表面积形成为宽，从而提高焊球和印刷电路板之间的接合强度。

公开(公告)号：US20090023183A1

公开(公告)日：2009-01-22

申请号：US12090664

申请日：2006-10-18

Applicant: UhTaek Oh ,  Byung Moon Kim ,  Seung Pyo Park ,  Heung Sik Na

Inventor： UhTaek Oh ,  Byung Moon Kim ,  Seung Pyo Park ,  Heung Sik Na

IPC: C12P21/02 ,  C07H21/04 ,  C07K14/435

CPC classification number: C07K14/43518 ,  C12N15/815

Abstract: The present invention relates to a method for producing a recombinant, spider toxin peptide and analgesic compositions containing said peptide. More specifically, the present invention relates to a method in which the gene for GsMTx4 is subcloned into a vector, so that it is linked to a secretion signal sequence of the alpha factor and under the control of methanol-inducible alcohol oxidase (AOX) promoter to construct a recombinant yeast expression plasmid. Yeast cells are transformed with this plasmid to produce the GsMTx4 peptide and analgesic compositions containing said peptide. The recombinant yeast expression system of the present invention affords a more stable method for producing GsMTx4 than its natural route. Thus the GsMTx4 peptide and its derivatives produced by the method of this invention can be used in the cure of related diseases such as heart failure as the peptide specifically inhibits mechanosensitive ion channels.

Abstract translation: 本发明涉及一种生产含有所述肽的重组蜘蛛毒素肽和镇痛组合物的方法。 更具体地，本发明涉及将GsMTx4的基因亚克隆到载体中的方法，使其与α因子的分泌信号序列连接并在甲醇诱导型醇氧化酶（AOX）启动子的控制下 构建重组酵母表达质粒。 用该质粒转化酵母细胞以产生含有所述肽的GsMTx4肽和镇痛组合物。 本发明的重组酵母表达系统提供比其自然途径更稳定的产生GsMTx4的方法。 因此，通过本发明方法产生的GsMTx4肽及其衍生物可用于治疗诸如心力衰竭等相关疾病，因为该肽特异性抑制机械敏感离子通道。

公开(公告)号：US20080055863A1

公开(公告)日：2008-03-06

申请号：US11896769

申请日：2007-09-05

Applicant: Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

Inventor： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

IPC: H05K7/00 ,  H05K3/44 ,  H05K7/20

CPC classification number: H05K1/185 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H05K1/056 ,  H05K1/181 ,  H05K1/186 ,  H05K3/108 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/0401

Abstract: A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component, provides a thin printed circuit board having a superb heat releasing effect.

Abstract translation: 公开了一种制造光学元件嵌入式印刷电路板的方法。 一种光学部件嵌入式印刷电路板，包括其中形成有至少一个空腔的金属芯，嵌入在所述空腔中的光学部件，堆叠在所述金属芯的一侧的第一绝缘层，在另一个上堆叠的第二绝缘层 并且形成在第一绝缘层上并且与光学部件电连接的电路图案提供了具有优良散热效果的薄印刷电路板。

公开(公告)号：US08064217B2

公开(公告)日：2011-11-22

申请号：US11896769

申请日：2007-09-05

Applicant: Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

Inventor： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

IPC: H05K1/16

CPC classification number: H05K1/185 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H05K1/056 ,  H05K1/181 ,  H05K1/186 ,  H05K3/108 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/0401

Abstract: A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component.

Abstract translation: 公开了一种制造光学元件嵌入式印刷电路板的方法。 一种光学部件嵌入式印刷电路板，包括其中形成有至少一个空腔的金属芯，嵌入在所述空腔中的光学部件，堆叠在所述金属芯的一侧的第一绝缘层，在另一个上堆叠的第二绝缘层 金属芯的侧面，以及形成在第一绝缘层上并与光学部件电连接的电路图案。

公开(公告)号：US20120324723A1

公开(公告)日：2012-12-27

申请号：US13448869

申请日：2012-04-17

Applicant: Myeong Ho Hong ,  Byung Moon Kim ,  Hyun Hee Ku ,  Soon Oh Jung ,  Jae Joon Lee

Inventor： Myeong Ho Hong ,  Byung Moon Kim ,  Hyun Hee Ku ,  Soon Oh Jung ,  Jae Joon Lee

IPC: H05K3/00

CPC classification number: H05K3/0097 ,  H05K3/4682 ,  H05K2203/308 ,  Y10T29/49124

Abstract: The present invention has been made in an effort to provide a method of manufacturing a coreless substrate that forms an opening by patterning a dry film for forming the opening onto one surface of a carrier, separating the carrier from the substrate, and removing only the dry film for forming the opening. In the present invention, since the pad can be exposed by removing only the dry film for forming the opening, a process time for forming the opening can be reduced and since a process is simple, a cost is saved.

Abstract translation: 本发明的目的在于提供一种制造无芯基板的方法，该无芯基板通过在载体的一个表面上形成开口的干膜图案化而形成开口，将载体与基板分离，并且仅去除干燥的 用于形成开口的胶片。 在本发明中，由于仅通过除去用于形成开口的干膜来露出垫，所以可以减少形成开口的处理时间，并且由于处理简单，因此节约了成本。

公开(公告)号：US08683684B2

公开(公告)日：2014-04-01

申请号：US13200920

申请日：2011-10-05

Applicant: Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

Inventor： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

IPC: H05K3/30

CPC classification number: H05K1/185 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H05K1/056 ,  H05K1/181 ,  H05K1/186 ,  H05K3/108 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/0401

Abstract: A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.

Abstract translation: 一种制造光学部件嵌入式印刷电路板的方法，所述方法包括：在金属芯的一侧上堆叠第一绝缘层; 将光学部件嵌入形成在所述金属芯中的空腔中; 在金属芯的另一侧堆叠透明材料的第二绝缘层; 以及在所述第一绝缘层上形成电路图案，所述电路图案与所述光学部件电连接。

公开(公告)号：US08435376B2

公开(公告)日：2013-05-07

申请号：US12787300

申请日：2010-05-25

Applicant: Jin Ho Kim ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

Inventor： Jin Ho Kim ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

IPC: B29C65/02 ,  B29C65/52 ,  B29C63/26 ,  B32B37/26 ,  B32B38/10

CPC classification number: H05K13/04 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T156/1043 ,  Y10T156/1142 ,  Y10T428/2804

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

Abstract translation: 本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。 载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以 更稳定地进行。

公开(公告)号：US20110159282A1

公开(公告)日：2011-06-30

申请号：US12787300

申请日：2010-05-25

Applicant: Jin Ho KIM ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

Inventor： Jin Ho KIM ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

IPC: B32B7/12 ,  B32B38/10 ,  B32B38/00 ,  B32B37/02

CPC classification number: H05K13/04 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T156/1043 ,  Y10T156/1142 ,  Y10T428/2804

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

Abstract translation: 本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。 载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以 更稳定地进行。

公开(公告)号：US20110079349A1

公开(公告)日：2011-04-07

申请号：US12654360

申请日：2009-12-17

Applicant: Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Yong An ,  Soon Oh Jung ,  Sung Won Jeong ,  Byung Moon Kim ,  Dong Ju Jeon ,  Seok Kyu Lee ,  Jin Ho Kim

Inventor： Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Yong An ,  Soon Oh Jung ,  Sung Won Jeong ,  Byung Moon Kim ,  Dong Ju Jeon ,  Seok Kyu Lee ,  Jin Ho Kim

IPC: B32B38/10 ,  B32B38/04

CPC classification number: H05K3/4682 ,  H05K3/0035 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/28 ,  H05K2203/066 ,  H05K2203/1536

Abstract: The present invention provides a method of manufacturing a printed circuit board including the steps of: preparing a pair of raw materials, each formed by sequentially stacking a release film and a first insulating layer, and an adhesive layer, respectively; embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer; forming a second insulating layer, which has a via formed therethrough and a circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer; cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer; and removing the release film from the first insulating layer.

Abstract translation: 本发明提供一种制造印刷电路板的方法，包括以下步骤：制备分别通过依次堆叠隔离膜和第一绝缘层而形成的一对原材料和粘合剂层; 在粘合剂层中嵌入彼此相对的一对原料，同时将释放膜设置在内层上; 在所述第一绝缘层上形成第二绝缘层，所述第二绝缘层具有穿过其形成的通孔和形成在与所述通孔连接的上表面上的电路图案; 第二和第一绝缘层，剥离膜和粘合剂层的切割边缘部分; 以及从所述第一绝缘层移除所述脱模膜。