公开(公告)号：US09107329B2

公开(公告)日：2015-08-11

申请号：US13232220

申请日：2011-09-14

Applicant: Chang Bo Lee ,  Dae Jo Hong ,  Cheol Ho Choi

Inventor： Chang Bo Lee ,  Dae Jo Hong ,  Cheol Ho Choi

IPC: H05K3/00 ,  H05K3/24 ,  H05K3/34 ,  H01L23/00

CPC classification number: H05K3/243 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/12042 ,  H05K3/3452 ,  H05K2203/1383 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: Disclosed herein is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes: preparing a base substrate having first connection pads and second connection pads; forming a solder resist layer on the base substrate, the solder resist layer having a first opening for exposing the first connection pads; forming a first surface treatment layer on the first connection pads; forming a protective film on the solder resist layer; forming a second opening for exposing the second connection pads in the protective film and the solder resist layer; and forming a second surface treatment layer on the second connection pads.

Abstract translation: 这里公开了一种印刷电路板的制造方法。 制造印刷电路板的方法包括：制备具有第一连接焊盘和第二连接焊盘的基底基板; 在所述基底基板上形成阻焊层，所述阻焊层具有用于暴露所述第一连接焊盘的第一开口; 在所述第一连接焊盘上形成第一表面处理层; 在阻焊层上形成保护膜; 形成用于暴露所述保护膜和阻焊层中的第二连接焊盘的第二开口; 以及在所述第二连接焊盘上形成第二表面处理层。

公开(公告)号：US20130175238A1

公开(公告)日：2013-07-11

申请号：US13474335

申请日：2012-05-17

Applicant: Dae Jo HONG ,  Chang Bo LEE ,  Cheol Ho CHOI ,  Chang Sup RYU ,  Sung Pyo HONG ,  Jong Hoon JEON ,  Akira HOSOMI ,  Hiroshi TAKAMIYA

Inventor： Dae Jo HONG ,  Chang Bo LEE ,  Cheol Ho CHOI ,  Chang Sup RYU ,  Sung Pyo HONG ,  Jong Hoon JEON ,  Akira HOSOMI ,  Hiroshi TAKAMIYA

IPC: C09K13/06 ,  H05K3/00

CPC classification number: C09K13/06 ,  H05K3/067 ,  H05K3/383

Abstract: This invention relates to an etching solution including hydrogen peroxide, sulfuric acid, chlorine ions, benzotriazole and pyrazole, and to a method of manufacturing a printed wiring substrate wherein the surface of the metal wiring of the printed wiring substrate is treated with an alkali solution, roughened using the etching solution and then subjected to anti-rust treatment, thus forming porous surface irregularities and micro anchors even with a small etching amount of the metal (Cu) to thereby obtain a high force of adhesion between the metal and an insulating material.

Abstract translation: 本发明涉及包括过氧化氢，硫酸，氯离子，苯并三唑和吡唑的蚀刻溶液，以及印刷线路基板的金属布线的表面用碱溶液处理的印刷布线基板的制造方法， 使用蚀刻溶液进行粗糙化，然后进行防锈处理，从而即使用小的蚀刻量的金属（Cu）也形成多孔表面凹凸和微锚，从而获得金属和绝缘材料之间的高粘合力。

公开(公告)号：US20130026626A1

公开(公告)日：2013-01-31

申请号：US13487926

申请日：2012-06-04

Applicant: Cheol Ho CHOI ,  Chang Bo LEE ,  Chang Sup RYU

Inventor： Cheol Ho CHOI ,  Chang Bo LEE ,  Chang Sup RYU

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/381 ,  H05K2203/041 ,  H05K2203/043 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: Disclosed herein are a method for forming bumps and a substrate including the bumps. The method includes: coating a solder resist on a substrate and electrodes formed on the substrate: performing laser etching treatment on the solder resist to form openings for forming bumps; printing a composition for forming bumps in the openings for forming bumps; and performing a reflowing process.The present invention can decrease the number of processes and realize a fine bump pitch of 90 μm or less at the time of forming bumps. Further, the present invention can also decrease the number of times that alignment is performed, due to the decrease in the number of processes.

Abstract translation: 本文公开了一种用于形成凸块的方法和包括该凸块的基板。 该方法包括：在基板上形成阻焊剂和在基板上形成的电极：对阻焊剂进行激光蚀刻处理，形成用于形成凸块的开口; 在用于形成凸块的开口中印刷用于形成凸块的组合物; 并进行回流处理。 本发明可以减少处理次数，并且在形成凸块时实现90μm以下的微小凸点间距。 此外，由于处理次数的减少，本发明还可以减少对准的次数。

公开(公告)号：US20120285924A1

公开(公告)日：2012-11-15

申请号：US13232220

申请日：2011-09-14

Applicant: Chang Bo LEE ,  Dae Jo HONG ,  Cheol Ho CHOI

Inventor： Chang Bo LEE ,  Dae Jo HONG ,  Cheol Ho CHOI

IPC: H05K3/10 ,  H05K3/00

CPC classification number: H05K3/243 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/12042 ,  H05K3/3452 ,  H05K2203/1383 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: Disclosed herein is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes: preparing a base substrate having first connection pads and second connection pads; forming a solder resist layer on the base substrate, the solder resist layer having a first opening for exposing the first connection pads; forming a first surface treatment layer on the first connection pads; forming a protective film on the solder resist layer; forming a second opening for exposing the second connection pads in the protective film and the solder resist layer; and forming a second surface treatment layer on the second connection pads.

Abstract translation: 这里公开了一种印刷电路板的制造方法。 制造印刷电路板的方法包括：制备具有第一连接焊盘和第二连接焊盘的基底基板; 在所述基底基板上形成阻焊层，所述阻焊层具有用于暴露所述第一连接焊盘的第一开口; 在所述第一连接焊盘上形成第一表面处理层; 在阻焊层上形成保护膜; 形成用于暴露所述保护膜和阻焊层中的第二连接焊盘的第二开口; 以及在所述第二连接焊盘上形成第二表面处理层。

公开(公告)号：US20120103662A1

公开(公告)日：2012-05-03

申请号：US13064331

申请日：2011-03-18

Applicant: Chang Bo Lee ,  Cheol Ho Choi ,  Yoong Oh

Inventor： Chang Bo Lee ,  Cheol Ho Choi ,  Yoong Oh

IPC: H05K1/02 ,  B05D5/00 ,  H05K3/10 ,  H05K3/22

CPC classification number: H05K3/3452 ,  H05K3/3436 ,  H05K2203/0278 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T156/10

Abstract: Disclosed herein are a printed circuit board including a first low-viscosity solder resist layer formed on one surface of a substrate having circuit patterns formed thereon and a second high-viscosity solder resist layer stacked on the first solder resist layer, thereby being advantageous in controlling the deviation in application thickness of solder resist (SR), while having excellent adhesion to the substrate, and a manufacturing method thereof.

Abstract translation: 这里公开了一种印刷电路板，其包括形成在其上形成有电路图案的基板的一个表面上的第一低粘度阻焊层和堆叠在第一阻焊层上的第二高粘度阻焊层，由此有利于控制 阻焊剂（SR）的应用厚度的偏差，同时对基板具有优异的粘附性及其制造方法。

公开(公告)号：US20120266463A1

公开(公告)日：2012-10-25

申请号：US13252815

申请日：2011-10-04

Applicant: Chang Bo LEE ,  Cheol Ho CHOI ,  Jin Ho KIM ,  Jee Soo MOK

Inventor： Chang Bo LEE ,  Cheol Ho CHOI ,  Jin Ho KIM ,  Jee Soo MOK

IPC: H05K3/10

CPC classification number: H05K3/242 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/0577 ,  H05K2203/107 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Disclosed herein is a method for manufacturing a printed circuit board, including: forming a complex solder resist layer including a solder resist having an open part for forming a metal post and a cover film contacting the solder resist on a base substrate having an outer-layer circuit including a plating lead line; forming a metal post on the open part for forming the metal post by performing electroplating; removing the plating lead line; and exposing the metal post by removing the cover film.

Abstract translation: 本文公开了一种制造印刷电路板的方法，包括：形成复合阻焊层，其包括具有用于形成金属柱的开口部分的阻焊剂和在具有外层的基底基板上与阻焊剂接触的覆盖膜 电路包括电镀引线; 通过进行电镀在开口部上形成金属柱，形成金属柱; 去除电镀引线; 并通过去除覆盖膜来暴露金属柱。

公开(公告)号：US20120055901A1

公开(公告)日：2012-03-08

申请号：US12987812

申请日：2011-01-10

Applicant: Chang Bo Lee ,  Cheol Ho Choi ,  Dae Jo Hong

Inventor： Chang Bo Lee ,  Cheol Ho Choi ,  Dae Jo Hong

IPC: H01L21/306

CPC classification number: H05K3/383 ,  H05K3/0085 ,  H05K3/3452 ,  H05K2203/1476

Abstract: Disclosed herein are a substrate fabricating apparatus and a substrate fabricating method. The substrate fabricating apparatus includes: a first injector that injects a first etchant to a circuit layer formed as an outermost layer of a base substrate to form first type of ruggedness; and a second injector that injects a second etchant to the circuit layer formed with the first type of ruggedness to form second type of ruggedness. The present invention provides the substrate fabricating apparatus and the substrate fabricating method that inject different etchants to the circuit layer to form different ruggedness, thereby making it possible to widen the specific surface area of the circuit layer to improve adhesion between the circuit layer and the protective layer.

Abstract translation: 本文公开了一种基板制造装置和基板制造方法。 基板制造装置包括：第一注入器，其将第一蚀刻剂注入形成为基底基板的最外层的电路层，以形成第一类型的凹凸; 以及第二喷射器，其将第二蚀刻剂喷射到形成有第一类型的凹凸的电路层，以形成第二类型的凹凸。 本发明提供了一种衬底制造装置和衬底制造方法，其将不同的蚀刻剂注入电路层以形成不同的粗糙度，从而可以拓宽电路层的比表面积，从而提高电路层与保护层之间的粘附性 层。