公开(公告)号：US06225160B1

公开(公告)日：2001-05-01

申请号：US09295067

申请日：1999-04-20

Applicant: Kuo-Chi Lin ,  Kuo-Tai Huang ,  Da-Wen Shia ,  Kun-Chi Lin

Inventor： Kuo-Chi Lin ,  Kuo-Tai Huang ,  Da-Wen Shia ,  Kun-Chi Lin

IPC: H01L218242

CPC classification number: H01L28/60 ,  H01L21/76895 ,  H01L27/10852 ,  H01L28/84

Abstract: A method of manufacturing a bottom electrode of a capacitor. A first dielectric layer is formed on a substrate. A cap layer is formed on the first dielectric layer. A second dielectric layer is formed on the cap layer. A node contact hole is formed to penetrate through the second dielectric layer, the cap layer and the first dielectric layer. A liner layer is formed on a sidewall of the node contact hole. A restraining layer is formed on the second dielectric layer. A patterned conductive layer is formed on a portion of the restraining layer and fills the node contact hole. A selective hemispherical grained layer is formed on the patterned conductive layer.

Abstract translation: 一种制造电容器的底部电极的方法。 在基板上形成第一电介质层。 在第一电介质层上形成覆盖层。 在盖层上形成第二电介质层。 形成节点接触孔以穿透第二介电层，盖层和第一介电层。 衬垫层形成在节点接触孔的侧壁上。 在第二电介质层上形成限制层。 在限制层的一部分上形成有图案的导电层，并填充节点接触孔。 在图案化的导电层上形成选择性半球形纹理层。

公开(公告)号：US06204107B1

公开(公告)日：2001-03-20

申请号：US09208611

申请日：1998-12-08

Applicant: Kuo-Chi Lin ,  Kuen-Yow Lin ,  Chien-Hua Tsai ,  Kun-Chi Lin

Inventor： Kuo-Chi Lin ,  Kuen-Yow Lin ,  Chien-Hua Tsai ,  Kun-Chi Lin

IPC: H01L218234

CPC classification number: H01L21/76831 ,  H01L21/76832

Abstract: A method for forming a multi-layered liner on the sidewalls of a node contact opening includes the steps of providing a substrate having a dielectric layer thereon. The dielectric layer further includes a node contact opening that exposes a portion of the substrate. A first liner layer is then formed on the sidewalls of the node contact opening. Next, a second liner layer is formed over the first liner layer such that the first liner layer and the second liner layer together form a dual-layered liner. The first liner layer in contact with the dielectric layer has good insulation capacity while the second liner layer has good etch-resisting property.

Abstract translation: 在节点接触开口的侧壁上形成多层衬垫的方法包括以下步骤：提供其上具有介电层的衬底。 电介质层还包括暴露基板的一部分的节点接触开口。 然后在节点接触开口的侧壁上形成第一衬垫层。 接下来，在第一衬里层上形成第二衬里层，使得第一衬里层和第二衬里层一起形成双层衬垫。 与电介质层接触的第一衬垫层具有良好的绝缘能力，而第二衬垫层具有良好的抗蚀性能。

公开(公告)号：US6150216A

公开(公告)日：2000-11-21

申请号：US222737

申请日：1998-12-29

Applicant: Kuo-Chi Lin ,  Kun-Chi Lin

Inventor： Kuo-Chi Lin ,  Kun-Chi Lin

IPC: H01L21/02 ,  H01L21/768 ,  H01L21/8242 ,  H01L21/20 ,  H01G4/06 ,  H01G4/30

CPC classification number: H01L28/84 ,  H01L21/76895 ,  H01L27/10855 ,  H01L28/60

Abstract: A method for forming an electrode of semiconductor device capacitor is disclosed. The method comprises forming a dielectric layer on a semiconductor substrate and then using photolithographic method to etch a trench through the dielectric layer to expose specific part of the semiconductor substrate. A polysilicon layer is then formed over the dielectric layer and filled the trench. The polysilicon layer is patterned by a photoresist layer and etched back to the dielectric layer, then a polysilicon rod is formed. A spacer method is used to form an amorphized silicon spacer is sidewall of the polysilicon rod. The polysilicon rod is then implanted to form an amorphized polysilicon layer on top surface of the polysilicon rod. Final hemispherical grain silicon is formed on the spacer and the amorphized polysilicon layer to increase the surface area of the polysilicon rod. Thereby, an electrode of a semiconductor device capacitor is formed, and the capacitance of capacitor is enhanced.

Abstract translation: 公开了一种形成半导体器件电容器的电极的方法。 该方法包括在半导体衬底上形成电介质层，然后使用光刻法蚀刻通过电介质层的沟槽，以露出半导体衬底的特定部分。 然后在电介质层上形成多晶硅层，并填充沟槽。 通过光致抗蚀剂层将多晶硅层图案化并回蚀刻到电介质层，然后形成多晶硅棒。 使用间隔法形成非晶硅衬垫是多晶硅棒的侧壁。 然后植入多晶硅棒以在多晶硅棒的顶表面上形成非晶化多晶硅层。 在间隔物和非晶化多晶硅层上形成最终的半球形晶粒硅以增加多晶硅棒的表面积。 由此，形成半导体器件电容器的电极，提高电容器的电容。

公开(公告)号：US20200368869A1

公开(公告)日：2020-11-26

申请号：US16562988

申请日：2019-09-06

Applicant: Chin-Chi LIN

Inventor： Chin-Chi LIN

IPC: B23Q15/013

Abstract: A feeding device for a machining device includes a support unit, a feeding unit, and a connecting unit. The feeding unit is adapted for feeding a workpiece to be machined by the machining device. The connecting unit is connected between the support unit and the feeding unit, and includes a positioning member pivotally connected to the support unit and extending in a longitudinal direction, an adjusting member telescopically connected to the positioning member and movable relative to the positioning member to adjust a distance between the feeding unit and the support unit in the longitudinal direction, and a locking unit for releaseably locking the adjusting member on the positioning member.

公开(公告)号：US20200086071A1

公开(公告)日：2020-03-19

申请号：US16563966

申请日：2019-09-09

Applicant: Shu-Chi LIN ,  Chih-Tsan CHIEN ,  Chun-Hung CHEN ,  Sheng-Wei LIN ,  Pi-Kai LEE ,  Yu-Chen LIU ,  Chia-Wei HUANG

Inventor： Shu-Chi LIN ,  Chih-Tsan CHIEN ,  Chun-Hung CHEN ,  Sheng-Wei LIN ,  Pi-Kai LEE ,  Yu-Chen LIU ,  Chia-Wei HUANG

IPC: A61M16/06 ,  A61M16/08

Abstract: Herein disclosed is a respiratory mask comprising a nose cushion assembly. The nose cushion assembly comprises a base body and a buffering piece. The base body is defined as having a base intake portion and a base connection portion. The base body comprises an air routing piece disposed at the inside of the base body and having a partitioning wall and a wall connection piece. The inside of the partitioning wall encloses an air intake zone. The wall connection piece is disposed outside the partitioning wall and connects with the base intake portion. Between the partitioning wall and the base intake portion there is defined an air outtake zone. The air intake zone is approximately at the center of the base intake portion. The buffering piece connects with the base connection portion and encloses a nose containing room, which in turn connects with the inside of the base body.

公开(公告)号：US10365695B2

公开(公告)日：2019-07-30

申请号：US16112806

申请日：2018-08-27

Applicant: Chia-Chi Lin ,  Wei-Hao Lan ,  Che-Hsien Lin ,  Po-Jui Chen ,  Han-Sheng Siao ,  Chun-Chieh Chen ,  Cheng-Shiue Jan ,  Chen-Cheng Wang

Inventor： Chia-Chi Lin ,  Wei-Hao Lan ,  Che-Hsien Lin ,  Po-Jui Chen ,  Han-Sheng Siao ,  Chun-Chieh Chen ,  Cheng-Shiue Jan ,  Chen-Cheng Wang

IPC: H05K5/00 ,  H05K7/00 ,  G06F1/16 ,  E05D11/06 ,  H05K5/02 ,  E05D3/18 ,  E05D3/16

Abstract: An electronic device and a hinge assembly thereof are provided. The hinge assembly includes a first and a second fixed block, a first and a second polyline rod, a damper rod and a fastener. The first fixed block has a first and a second end, the second fixed block has a third and a fourth end, and the first polyline rod has a fifth and a sixth end, wherein the fifth end is connected to the second end, and the sixth end is connected to the fourth end. The second polyline rod has a seventh connected to the fourth end, and an eighth end, connected to the second end and the sixth end. The damper rod is slidably disposed on the first fixed block, the fastener is fixed to the first fixed block, and a distal end of the damper rod is fastened into the fastener.

公开(公告)号：US10278409B1

公开(公告)日：2019-05-07

申请号：US16024740

申请日：2018-06-30

Applicant: Avery Yo-Chi Lin

Inventor： Avery Yo-Chi Lin

IPC: A47F5/00 ,  A23G9/50

Abstract: A rotational ice cream holder apparatus is provided. The rotational ice cream holder includes a dish that catches dripping ice cream. The dish has an opening or aperture for holding an ice cream cone. The dish can be rotated with respect to a handle such that a person using the rotational ice cream holder can enjoy different parts of the ice cream by simply using his hand to turn the dish.

公开(公告)号：US20190090682A1

公开(公告)日：2019-03-28

申请号：US15906220

申请日：2018-02-27

Applicant: Tzu-Chi LIN

Inventor： Tzu-Chi LIN

IPC: A47J31/06

Abstract: The present invention provides an anti-overflow brewing filter and a spiral hanging-ear structure coupled thereto, comprising: a filtering container which is a filter screen-based structure having a bottom portion and an surrounding wall extending upward from the bottom portion and forming with an opening; and a waterproof enclosure coupled to the opening. It may be further combined a spiral hanging-ear structure. With the practice of the present invention, It can make the infused liquid to be brewed beverage fully interact, without the problems brewing liquid spills.

公开(公告)号：US20180009606A1

公开(公告)日：2018-01-11

申请号：US15204149

申请日：2016-07-07

Applicant: Chin-Chi Lin

Inventor： Chin-Chi Lin

IPC: B65G13/07 ,  B65G13/04

CPC classification number: B27B25/02 ,  B23Q3/002 ,  B23Q7/055 ,  B27B25/08 ,  B27C1/12 ,  B65G13/07 ,  B65G39/12

Abstract: A feeding device includes a plurality of driving modules, a plurality of feeding modules and a plurality of couplers. Each driving module has a driving shaft pivotally mounted on a housing and driven by a power module to be rotated about an axis. Each feeding module includes a pivoting shaft substantially coaxial with the driving shaft, a suspending unit journalled on the pivoting shaft to be pivotable and having a bearing portion which is disposed to be biased downwardly by a spring member, a driven shaft mounted rotatably on the bearing portion, and a feeding roller driven by the driven shaft. Each coupler includes a transmitting shaft having two ends connected to the driving shaft and driven shaft by universal joints, respectively.

公开(公告)号：US09112007B2

公开(公告)日：2015-08-18

申请号：US13619233

申请日：2012-09-14

Applicant: Yung-Chi Lin ,  Hsin-Yu Chen ,  Lin-Chih Huang ,  Tsang-Jiuh Wu ,  Wen-Chih Chiou

Inventor： Yung-Chi Lin ,  Hsin-Yu Chen ,  Lin-Chih Huang ,  Tsang-Jiuh Wu ,  Wen-Chih Chiou

IPC: H01L21/44 ,  H01L21/768 ,  H01L23/31 ,  H01L23/48 ,  H01L23/525 ,  H01L23/532 ,  H01L23/00

CPC classification number: H01L23/528 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/525 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/53271 ,  H01L24/05 ,  H01L24/13 ,  H01L27/088 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An apparatus comprises a through via formed in a substrate. The through via is coupled between a first side and a second side of the substrate. The through via comprises a bottom portion adjacent to the second side of the substrate, wherein the bottom portion is formed of a conductive material. The through via further comprises sidewall portions formed of the conductive material and a middle portion formed between the sidewall portions, wherein the middle portion is formed of a dielectric material.

Abstract translation: 一种装置包括形成在基板中的通孔。 通孔连接在基板的第一侧和第二侧之间。 通孔包括与基板的第二侧相邻的底部，其中底部由导电材料形成。 通孔还包括由导电材料形成的侧壁部分和形成在侧壁部分之间的中间部分，其中中间部分由电介质材料形成。