公开(公告)号：US20080173792A1

公开(公告)日：2008-07-24

申请号：US11656410

申请日：2007-01-23

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-chuan Wang ,  Chihwei Lin ,  Hsien-Wen Hsu

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Tung-chuan Wang ,  Chihwei Lin ,  Hsien-Wen Hsu

IPC分类号： H01L27/00

CPC分类号： H01L27/14618 ,  H01L24/24 ,  H01L24/82 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19105 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00

摘要： The present invention provides an image sensor module structure comprising a substrate with a die receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate and a die having a micro lens disposed within the die receiving cavity. A dielectric layer is formed on the die and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

摘要翻译： 本发明提供了一种图像传感器模块结构，其包括具有形成在基板的上表面内的模具接收空腔的基板和基板内的导电迹线以及具有设置在模具接收腔内的微透镜的模具。 在管芯和衬底上形成电介质层，在电介质层上形成再分配导电层（RDL），其中RDL耦合到管芯，并且导电迹线和电介质层具有露出 微透镜。 透镜保持器附接在基板上，并且透镜保持器具有安装在透镜保持器的上部的透镜。 滤光片安装在透镜和微透镜之间。 该结构还包括在透镜保持器内的衬底的上表面上的无源器件。

公开(公告)号：US20080191333A1

公开(公告)日：2008-08-14

申请号：US11703663

申请日：2007-02-08

申请人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-chuan Wang ,  Hsien-Wen Hsu

发明人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-chuan Wang ,  Hsien-Wen Hsu

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L21/6835 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. A protective layer is formed to cover the wire bonding. A transparent cover is disposed on the die within the die through hole by adhesion to expose the micro lens area. Conductive bumps are coupled to the terminal pads.

摘要翻译： 本发明提供一种封装结构，其包括具有通孔的基板和在其上形成的接触通孔结构，其中端子焊盘形成在接触通孔结构下方，并且接触焊盘形成在 基质。 具有微透镜区域的模具通过粘附设置在模具通孔内。 在芯片和基板上形成引线接合，其中引线接合耦合到管芯和接触焊盘。 形成保护层以覆盖引线接合。 通过粘合将透明盖设置在模具通孔内的模具上，以露出微透镜区域。 导电凸块耦合到端子焊盘。

公开(公告)号：US20080029877A1

公开(公告)日：2008-02-07

申请号：US11869154

申请日：2007-10-09

申请人： Wen-Kun Yang ,  Chun Hui Yu ,  Jui-Hsien Chang ,  Hsien-Wen Hsu

发明人： Wen-Kun Yang ,  Chun Hui Yu ,  Jui-Hsien Chang ,  Hsien-Wen Hsu

IPC分类号： H01L23/48

CPC分类号： H01L23/562 ,  H01L21/78 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00

摘要： The present invention provides a semiconductor device package singulation method. The method comprises printing a photo epoxy layer on the back surface of a substrate of a wafer for marking the scribe lines to be diced. Then etching is performed through the substrate along the marks in the photo epoxy layer. Dicing the panel into individual package with a typical art designing knife, the step not only avoids the roughness on the edge of each die, but also decrease the cost of singulation process.

摘要翻译： 本发明提供一种半导体器件封装分割方法。 该方法包括在晶片的基板的背面上印刷光环氧树脂层，以标记要切割的划线。 然后沿着光环氧树脂层中的标记通过基板进行蚀刻。 通过典型的美术设计刀将面板切割成单独的包装，该步骤不仅避免了每个模具边缘的粗糙度，而且降低了切割过程的成本。

公开(公告)号：US20070072338A1

公开(公告)日：2007-03-29

申请号：US11235484

申请日：2005-09-26

申请人： Wen-Kun Yang ,  Chun Yu ,  Jui-Hsien Chang ,  Hsien-Wen Hsu

发明人： Wen-Kun Yang ,  Chun Yu ,  Jui-Hsien Chang ,  Hsien-Wen Hsu

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L23/562 ,  H01L21/78 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00

摘要： The present invention provides a semiconductor device package singulation method. The method comprises printing a photo epoxy layer on the back surface of a substrate of a wafer for marking the scribe lines to be diced. Then etching is performed through the substrate along the marks in the photo epoxy layer. Dicing the panel into individual package with a typical art designing knife, the step not only avoids the roughness on the edge of each die, but also decrease the cost of singulation process.

摘要翻译： 本发明提供一种半导体器件封装分割方法。 该方法包括在晶片的基板的背面上印刷光环氧树脂层，以标记要切割的划线。 然后沿着光环氧树脂层中的标记通过基板进行蚀刻。 通过典型的美术设计刀将面板切割成单独的包装，该步骤不仅避免了每个模具边缘的粗糙度，而且降低了切割过程的成本。

公开(公告)号：US20080211075A1

公开(公告)日：2008-09-04

申请号：US11950921

申请日：2007-12-05

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

IPC分类号： H01L23/04 ,  H01L21/71

CPC分类号： H01L27/14618 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/148 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01028

摘要： A structure of semiconductor device package having inter-adhesion with gap comprising: a chip with bonding pads and a sensor area embedded into a substrate with die window and inter-connecting through holes, wherein a RDL is formed over the substrate for coupling between the bonding pads and the inter-connecting through holes; a multiple rings (dam bar) formed over the substrate, the RDL, and the bonding pads area except the sensor area; an adhesive glues fill into the space of the multiple ring except the sensor area; and a transparency material bonded on the top of the multiple ring and the adhesive glues, wherein the adhesive glues adhesion between the transparency material and the multiple rings.

摘要翻译： 一种具有间隙的粘合性的半导体器件封装的结构，包括：具有接合焊盘的芯片和嵌入到具有模具窗口和互连通孔的衬底中的传感器区域，其中，RDL形成在衬底上，用于在接合 垫和相互连接的通孔; 形成在基板上的多个环（阻挡条），RDL和除了传感器区域之外的接合焊盘区域; 粘合剂胶水填充到除了传感器区域之外的多个环的空间中; 以及粘合在多个环的顶部上的透明材料和胶粘剂，其中粘合剂胶合透明材料和多个环之间的粘附。

公开(公告)号：US20080191335A1

公开(公告)日：2008-08-14

申请号：US11755293

申请日：2007-05-30

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L21/6835 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/16235 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A thick dielectric layer is formed on the die and the substrate except the micro lens, bonding pads and contact pads. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. And core paste is filled into the gap between the die edge and the sidewall of the die through hole of the substrate. A transparent cover is disposed on the die and the thick dielectric layer by adhesion to create a gap between the transparent cover.

摘要翻译： 本发明提供一种封装结构，其包括具有通孔的基板和在其上形成的接触通孔结构，其中端子焊盘形成在接触通孔结构下方，并且接触焊盘形成在 基质。 具有微透镜区域的模具通过粘附设置在模具通孔内。 除了微透镜，接合焊盘和接触焊盘之外，在裸片和基板上形成厚的电介质层。 在芯片和基板上形成引线接合，其中引线接合耦合到管芯和接触焊盘。 并且核芯浆料填充到芯片边缘和基板的管芯通孔的侧壁之间的间隙中。 通过粘合将透明盖设置在模具和厚介电层上，以在透明盖之间产生间隙。

公开(公告)号：US07335870B1

公开(公告)日：2008-02-26

申请号：US11539215

申请日：2006-10-06

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu

IPC分类号： H01L21/00 ,  H01L27/00

CPC分类号： H01L27/14618 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/148 ,  H01L2224/48463 ,  H01L2924/16235

摘要： The method of forming image sensor protection comprises attaching a glass on a tape and scribing the glass with lines to define cover zones on the glass, the glass is then break by a rubber puncher followed by forming glue on the edge of the cover zones. The glass is bonded on a wafer with an image sensor to align the cover zones to a micron lens area of the image sensor, and then the tape is removed from the wafer, thereby forming glass with cover zones on the image sensor.

摘要翻译： 形成图像传感器保护的方法包括将玻璃附着在带上并用线划线玻璃以限定玻璃上的覆盖区域，然后玻璃被橡胶冲孔机打破，然后在覆盖区域的边缘上形成胶水。 将玻璃用图像传感器粘合在晶片上，以将覆盖区域对准图像传感器的微米透镜区域，然后将胶带从晶片上移除，从而在图像传感器上形成具有覆盖区域的玻璃。

公开(公告)号：US20080083980A1

公开(公告)日：2008-04-10

申请号：US11753006

申请日：2007-05-24

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

IPC分类号： H01L23/12 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L24/13 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/148 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/013

摘要： The present invention discloses a structure of package comprising: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure; and a transparent base formed on the protection layer.

摘要翻译： 本发明公开了一种包装结构，包括：具有模具接收通孔的基板，连接通孔结构和第一接触垫; 具有设置在模具接收通孔内的微透镜区域的模具; 透明盖覆盖微透镜区域; 形成在模具下方并填充在模具和模具的侧壁之间的间隙中的周围材料; 形成在所述管芯和所述基板上的电介质层; 形成在电介质层上并耦合到第一接触焊盘的再分布层（RDL）; 形成在RDL上的保护层; 第二接触焊盘，其形成在所述基板的下表面并且在所述连接通孔结构下方; 以及形成在保护层上的透明基底。

公开(公告)号：US07525185B2

公开(公告)日：2009-04-28

申请号：US11725827

申请日：2007-03-19

申请人： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu ,  Chih-Ming Chen

发明人： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu ,  Chih-Ming Chen

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a semiconductor device package having multi-chips with side-by-side configuration comprising a substrate with die receiving through holes, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A first die having first bonding pads and a second die having second bonding pads are respectively disposed within the die receiving through holes. The first adhesion material is formed under the first and second die and the substrate, and the second adhesion material is filled in the gap between the first and second die and sidewall of the die receiving though holes of the substrate. Further, bonding wires are formed to couple between the first bonding pads and the first contact pads, between the second bonding pads and the first contact pads. A dielectric layer is formed on the bonding wires, the first and second die and the substrate. A build up layer is form on the lower surface of substrate and the back side of first and second die.

摘要翻译： 本发明提供一种具有并排配置的多芯片的半导体器件封装，包括：具有通孔的基板，其中，所述基板具有通孔，连接通孔结构和上表面上的第一接触焊盘;以及第二接触焊盘， 基质。 具有第一接合焊盘的第一管芯和具有第二接合焊盘的第二管芯分别设置在管芯接收通孔内。 第一粘合材料形成在第一模具和第二模具和基板之下，并且第二粘合材料填充在第一和第二模具之间的间隙中以及接收基板的贯穿孔的模具的侧壁。 此外，形成接合线以在第二接合焊盘和第一接触焊盘之间在第一接合焊盘和第一接触焊盘之间耦合。 在接合线，第一和第二管芯和基板上形成介电层。 在基板的下表面和第一和第二模具的背面上形成堆积层。

公开(公告)号：US20080230884A1

公开(公告)日：2008-09-25

申请号：US11725827

申请日：2007-03-19

申请人： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu ,  Chih-Ming Chen

发明人： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu ,  Chih-Ming Chen

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/04 ,  H01L23/52

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a semiconductor device package having multi-chips with side-by-side configuration comprising a substrate with die receiving through holes, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A first die having first bonding pads and a second die having second bonding pads are respectively disposed within the die receiving through holes. The first adhesion material is formed under the first and second die and the substrate, and the second adhesion material is filled in the gap between the first and second die and sidewall of the die receiving though holes of the substrate. Further, bonding wires are formed to couple between the first bonding pads and the first contact pads, between the second bonding pads and the first contact pads. A dielectric layer is formed on the bonding wires, the first and second die and the substrate. A build up layer is form on the lower surface of substrate and the back side of first and second die.

摘要翻译： 本发明提供一种具有并排配置的多芯片的半导体器件封装，包括：具有通孔的基板，其中，所述基板具有通孔，连接通孔结构和上表面上的第一接触焊盘;以及第二接触焊盘， 基质。 具有第一接合焊盘的第一管芯和具有第二接合焊盘的第二管芯分别设置在管芯接收通孔内。 第一粘合材料形成在第一模具和第二模具和基板之下，并且第二粘合材料填充在第一和第二模具之间的间隙中以及接收基板的贯穿孔的模具的侧壁。 此外，形成接合线以在第二接合焊盘和第一接触焊盘之间在第一接合焊盘和第一接触焊盘之间耦合。 在接合线，第一和第二管芯和基板上形成介电层。 在基板的下表面和第一和第二模具的背面上形成堆积层。