公开(公告)号：US08531021B2

公开(公告)日：2013-09-10

申请号：US13160874

申请日：2011-06-15

Applicant: Chu-Chin Hu ,  Shih-Ping Hsu ,  Yi-Ju Chen

Inventor： Chu-Chin Hu ,  Shih-Ping Hsu ,  Yi-Ju Chen

IPC: H01L23/02

CPC classification number: H01L21/56 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L25/105 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A package stack device includes a first package structure having a plurality of first metal posts and a first electronic element disposed on a surface thereof, a second package structure having a plurality of second metal posts and a second electronic element disposed on opposite surfaces thereof, and an encapsulant formed between the first and second package structures for encapsulating the first electronic element. By connecting the first and second metal posts, the second package structure is stacked on the first package structure with the support of the metal posts and the encapsulant filling the gap therebetween so as to prevent warpage of the substrate.

Abstract translation: 包装堆叠装置包括具有多个第一金属柱和设置在其表面上的第一电子元件的第一封装结构，具有多个第二金属柱的第二封装结构和设置在其相对表面上的第二电子元件， 形成在第一和第二封装结构之间用于封装第一电子元件的密封剂。 通过连接第一和第二金属柱，第二封装结构被堆叠在第一封装结构上，金属柱的支撑件和密封剂填充其间的间隙，以防止基板翘曲。

公开(公告)号：US20110234069A1

公开(公告)日：2011-09-29

申请号：US12868741

申请日：2010-08-26

Applicant: CHIN-HU CHEN ,  CHUN-CHUNG LAI ,  JUI-HSIANG LIN

Inventor： CHIN-HU CHEN ,  CHUN-CHUNG LAI ,  JUI-HSIANG LIN

IPC: A47B81/00

CPC classification number: H04M1/0237

Abstract: A mobile terminal includes a base body, a pair of slidable bodies and a pair of switch mechanisms disposed on the slidable bodies. Each of the switch mechanism includes a housing, a cover, an operating member, a locking member and a spring unit. The operating member includes a coupling portion received in the housing and an operating cap located out of the housing. The coupling portion includes a base bevel. The locking member received in the housing includes a sliding bevel contacting to the base bevel and a locking block passing through the cover and engaging with the base body. The spring unit urges between the locking member and the housing. When the operating cap is pressed towards the housing, the base bevel engages with the sliding bevel to drive the locking member compress the spring unit, thereby the locking block disengaging from the base body.

Abstract translation: 移动终端包括基体，一对可滑动体和设置在滑动体上的一对开关机构。 每个开关机构包括壳体，盖子，操作构件，锁定构件和弹簧单元。 操作构件包括容纳在壳体中的联接部分和位于壳体外部的操作帽。 联接部分包括基座斜面。 容纳在壳体中的锁定构件包括与底部斜面接触的滑动斜面和穿过盖并与基体接合的锁定块。 弹簧单元促使锁定构件和壳体之间。 当操作盖被压向壳体时，底部斜面与滑动斜面接合以驱动锁定构件压缩弹簧单元，从而使锁定块从基体脱离。

公开(公告)号：US20060242573A1

公开(公告)日：2006-10-26

申请号：US11113478

申请日：2005-04-25

Applicant: Chin Hu ,  Meng-Xi Zhuang ,  Chao-Lung Lee ,  Chia-Hoang Lee ,  Yu-Chuan Yang

Inventor： Chin Hu ,  Meng-Xi Zhuang ,  Chao-Lung Lee ,  Chia-Hoang Lee ,  Yu-Chuan Yang

IPC: G06F17/00

CPC classification number: G06F8/38

Abstract: User-defined interface editing methods for mobile electronic devices. Display-related information of an interface is edited as modified information in an interface editor. The modified information is transmitted from the interface editor to the mobile electronic device. The interface is displayed on the mobile electronic device according to the modified information after parsing.

Abstract translation: 移动电子设备用户界面编辑方法。 接口的显示相关信息在接口编辑器中作为修改信息进行编辑。 修改的信息从接口编辑器发送到移动电子设备。 该界面根据解析后的修改信息显示在移动电子设备上。

公开(公告)号：US07112524B2

公开(公告)日：2006-09-26

申请号：US10769451

申请日：2004-01-29

Applicant: Shih-Ping Hsu ,  Chu-Chin Hu

Inventor： Shih-Ping Hsu ,  Chu-Chin Hu

IPC: H01L21/44

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/1607 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2203/054 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such a way that a top surface of each of the conductive pads is exposed. Next, a conductive film and a resist layer are formed in sequence on the insulating layer and the conductive pads, wherein a plurality of openings are formed in the resist layer to expose a part of the conductive film above the conductive pad. Then, a pre-soldering material is deposited over the conductive pad by stencil printing or electroplating process.

Abstract translation: 提出了一种用于预焊材料的衬底和该衬底的制造方法。 提供具有形成有多个导电焊盘的至少一个表面的衬底。 在衬底的表面上形成绝缘层，使得每个导电焊盘的顶表面露出。 接下来，在绝缘层和导电焊盘上依次形成导电膜和抗蚀剂层，其中在抗蚀剂层中形成多个开口以暴露导电膜上方的导电膜的一部分。 然后，通过模板印刷或电镀工艺将预焊材料沉积在导电焊盘上。

公开(公告)号：US20050070084A1

公开(公告)日：2005-03-31

申请号：US10769451

申请日：2004-01-29

Applicant: Shih-Ping Hsu ,  Chu-Chin Hu

Inventor： Shih-Ping Hsu ,  Chu-Chin Hu

IPC: H01L21/44 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/1607 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2203/054 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such a way that a top surface of each of the conductive pads is exposed. Next, a conductive film and a resist layer are formed in sequence on the insulating layer and the conductive pads, wherein a plurality of openings are formed in the resist layer to expose a part of the conductive film above the conductive pad. Then, a pre-soldering material is deposited over the conductive pad by stencil printing or electroplating process.

Abstract translation: 提出了一种用于预焊材料的衬底和该衬底的制造方法。 提供具有形成有多个导电焊盘的至少一个表面的衬底。 在衬底的表面上形成绝缘层，使得每个导电焊盘的顶表面露出。 接下来，在绝缘层和导电焊盘上依次形成导电膜和抗蚀剂层，其中在抗蚀剂层中形成多个开口以暴露导电膜上方的导电膜的一部分。 然后，通过模板印刷或电镀工艺将预焊材料沉积在导电焊盘上。

公开(公告)号：US08107774B2

公开(公告)日：2012-01-31

申请号：US11867696

申请日：2007-10-05

Applicant: Po-Chin Hu ,  Ming-Yu Lin ,  Wei-Chen Tsai

Inventor： Po-Chin Hu ,  Ming-Yu Lin ,  Wei-Chen Tsai

IPC: G06K9/34 ,  G06K9/46 ,  G06K9/66 ,  G06K9/32 ,  G06K1/00 ,  G06K15/02 ,  H04N7/18 ,  H04N9/47 ,  H04N9/04 ,  H04N5/225 ,  H04N5/228 ,  H04N5/262 ,  H04N1/60 ,  H04N1/46 ,  G06F15/00

CPC classification number: G06T3/0056

Abstract: An image data processing method is provided. In this method, a plurality of original pixel values of an image is input. An interpolation position of a target pixel in the image is determined. Whether the interpolation position is in a central region of an object or in a marginal region of an object is determined. A pixel value interpolation with respect to the interpolation position is performed. When the interpolation position is in the central region of an object, the pixel value interpolation is performed in a first calculation mode, and when the interpolation position is in the marginal region of an object, the pixel value interpolation is performed in a second calculation mode, wherein the first calculation mode may be a low pass filtering interpolation mode, and the second calculation mode may be a linear interpolation mode.

Abstract translation: 提供了图像数据处理方法。 在该方法中，输入图像的多个原始像素值。 确定图像中的目标像素的内插位置。 确定内插位置是否在物体的中心区域或物体的边缘区域中。 执行相对于插补位置的像素值插值。 当内插位置在对象的中心区域时，以第一计算模式执行像素值内插，并且当内插位置在对象的边缘区域中时，以第二计算模式执行像素值内插 其中，所述第一计算模式可以是低通滤波插值模式，并且所述第二计算模式可以是线性插值模式。

公开(公告)号：US07417299B2

公开(公告)日：2008-08-26

申请号：US10947358

申请日：2004-09-23

Applicant: Chu-Chin Hu

Inventor： Chu-Chin Hu

IPC: H01L23/58 ,  H01L21/00 ,  H05K7/20

CPC classification number: H01L23/5389 ,  H01L23/36 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips during operation can be dissipated via the heat sink. A circuit structure is extended from the chips to provide direct electrical extension for the chips and improve the electrical performances. And exposed electrical connection terminals can be formed in the circuit structure extended from the chips to be directly electrically connected to an external electronic device.

Abstract translation: 提出了直接连接多芯片半导体元件结构。 多个半导体芯片安装并支撑在金属散热器上，使得在操作期间由芯片产生的热量可以经由散热器消散。 电路结构从芯片延伸，为芯片提供直接电气扩展，并提高电气性能。 暴露的电连接端子可以形成在从芯片延伸的电路结构中，以直接电连接到外部电子设备。

公开(公告)号：US07334842B1

公开(公告)日：2008-02-26

申请号：US11711412

申请日：2007-02-27

Applicant: Chin-Hu Wu

Inventor： Chin-Hu Wu

IPC: A47C1/00

CPC classification number: A47C3/02 ,  A47C1/023 ,  A47C9/005

Abstract: A chair includes a base which includes two facing sides and each of the facing sides has two grooves and both of which extend in a horizontal direction and a vertical direction. A seat has four engaging members which are movably engaged with the four grooves in the two facing sides of the base so that the seat can be moved in horizontal and vertical directions relative to the base.

Abstract translation: 椅子包括一个底座，它包括两个相对的侧面，每个相对的侧面都有两个凹槽，两个凹槽都沿水平方向和垂直方向延伸。 座椅具有四个接合构件，其能够与基座的两个相对的侧面中的四个凹槽可移动地接合，使得座椅可相对于底座在水平和垂直方向上移动。

公开(公告)号：US20080029895A1

公开(公告)日：2008-02-07

申请号：US11831668

申请日：2007-07-31

Applicant: Chu-Chin HU ,  Shang-Wei Chen

Inventor： Chu-Chin HU ,  Shang-Wei Chen

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/18162 ,  H01L2924/19041 ,  H05K3/4644 ,  H05K2201/10674 ,  H05K2203/063

Abstract: A circuit board structure with an embedded semiconductor chip and a fabrication method thereof are provided, including the steps of providing a semiconductor wafer having an active surface with a plurality of electrode pads, a connection metal layer formed on the electrode pads: forming a protective layer on the connection metal layer and the semiconductor wafer, performing a cutting process to form a plurality of semiconductor dies, providing a carrier board having at least on e cavity for receiving the semiconductor chip; and forming sequentially on the protective layer covering the semiconductor chip and the carrier board a dielectric layer and a circuit layer electrically connected to the connection metal layer of the semiconductor chip. The present invention is a simple, in process and low in process cost, due to the connection metal layer covered by the protective layer formed on the semiconductor chip protected from oxidation and contamination.

Abstract translation: 提供具有嵌入式半导体芯片的电路板结构及其制造方法，包括以下步骤：提供具有多个电极焊盘的活性表面的半导体晶片，形成在电极焊盘上的连接金属层：形成保护层 在所述连接金属层和所述半导体晶片上进行切割处理以形成多个半导体管芯，提供至少具有用于接收所述半导体芯片的腔的载体板; 并且在覆盖半导体芯片和载体板的保护层上依次形成介电层和电连接到半导体芯片的连接金属层的电路层。 本发明是由于形成在半导体芯片上的保护层覆盖的连接金属层被保护而免受氧化和污染，因此本发明是一种简单的，过程中的和低的工艺成本。

公开(公告)号：US20060284288A1

公开(公告)日：2006-12-21

申请号：US11449252

申请日：2006-06-07

Applicant: Chu-Chin Hu

Inventor： Chu-Chin Hu

IPC: H01L23/495

CPC classification number: H01L23/525 ,  H01L23/3114 ,  H01L24/12 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/05005 ,  H01L2224/05541 ,  H01L2924/00014

Abstract: A wafer and single chip having a circuit rearranged structure and method for fabricating the same are proposed. A wafer having a plurality of chips is provided. Each of the chip has an active surface having a plurality of electrode pads. A dielectric layer is formed on the active surface. The dielectric layer is thinned to expose the electrode pads. A conducting layer is formed on the dielectric layer and the electrode pads. A first metal layer is formed on the conductive layer by electroplating. A patterned second metal layer is formed on the first metal layer by printing. Using the second metal layer as a protecting layer, the first metal layer and the conducting layer are etched and part uncovered by the second metal layer are removed. The second and the remaining first metal layer form a circuit rearranged structure electrically connected to the electrode pads.

Abstract translation: 提出了具有电路重排结构的晶片和单芯片及其制造方法。 提供具有多个芯片的晶片。 每个芯片具有具有多个电极焊盘的活性表面。 在活性表面上形成介电层。 电介质层变薄以露出电极焊盘。 在电介质层和电极焊盘上形成导电层。 通过电镀在导电层上形成第一金属层。 通过印刷在第一金属层上形成图案化的第二金属层。 使用第二金属层作为保护层，蚀刻第一金属层和导电层，并且除去第二金属层未被第二金属层覆盖的部分。 第二和剩余的第一金属层形成电连接到电极焊盘的电路重排结构。