公开(公告)号：US20140291843A1

公开(公告)日：2014-10-02

申请号：US13853982

申请日：2013-03-29

Applicant: Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

Inventor： Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/1056 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/047 ,  Y10S428/929 ,  Y10T428/12181 ,  Y10T428/12479 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81805

Abstract: Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.

Abstract translation: 描述了用于焊球和填充糊的混合焊料。 焊球可以由较高温度焊料液滴和低温焊料涂层形成。 这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。 焊球和糊剂可用于微电子器件的焊接封装。 可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附着到微电子衬底以形成混合焊料 互连。

公开(公告)号：US07490999B2

公开(公告)日：2009-02-17

申请号：US10916678

申请日：2004-08-11

Applicant: William Freeman ,  Ming Shi ,  Hongjin Jiang

Inventor： William Freeman ,  Ming Shi ,  Hongjin Jiang

IPC: G02B6/36

CPC classification number: G02B27/0006 ,  G02B1/11 ,  G02B6/264 ,  G02B6/4248

Abstract: Methods and structures for reducing the moisture penetration in an optical device such as an isolator, collimator, filters, circulators, and the like. Methods can include placing an optical cover over the opening(s) of the housing of the optical device. The optical cover can be bonded by epoxy or metallic seal. A moisture prevention coating can be placed over the seal line between the optical cover and the housing to further enhance moisture prevention.

Abstract translation: 用于减少诸如隔离器，准直器，过滤器，循环器等的光学装置中的水分渗透的方法和结构。 方法可以包括将光学盖放置在光学装置的壳体的开口上。 光学盖可以通过环氧树脂或金属密封接合。 可以将防潮涂层放置在光学盖和壳体之间的密封线上，以进一步增强防潮性。

公开(公告)号：US20140151096A1

公开(公告)日：2014-06-05

申请号：US13693403

申请日：2012-12-04

Applicant: Hongjin Jiang ,  Patrick N. Stover ,  Arun Kumar C. Nallani ,  Rajen Sidhu ,  Ameya Limaye

Inventor： Hongjin Jiang ,  Patrick N. Stover ,  Arun Kumar C. Nallani ,  Rajen Sidhu ,  Ameya Limaye

IPC: H05K1/11 ,  H05K3/34 ,  H05K1/09

CPC classification number: H05K3/3436 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/131 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/301 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/136 ,  H01L2924/00

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures, wherein a microelectronic package may be attached to a microelectronic substrate with a hybrid solder interconnect. The hybrid solder interconnect may comprise a homogenous mixture of low temperature solder and a high temperature solder extending between at least one bond pad on a microelectronic package and at least one bond pad on a microelectronic substrate, wherein the relatively low reflow temperature used during the formation of the hybrid solder interconnect may prevent solder defects caused by warpage which may occur during the attachment of the microelectronic package to the microelectronic substrate.

Abstract translation: 本说明书的实施例涉及制造微电子结构的领域，其中微电子封装可以用混合焊料互连连接到微电子衬底。 混合焊料互连可以包括低温焊料和在微电子封装上的至少一个焊盘和微电子衬底上的至少一个焊盘之间延伸的高温焊料的均匀混合物，其中在形成期间使用的相对低的回流温度 的混合焊料互连可以防止在微电子封装附着到微电子衬底期间可能发生的翘曲引起的焊料缺陷。

公开(公告)号：US20080272344A1

公开(公告)日：2008-11-06

申请号：US12077812

申请日：2008-03-21

Applicant: HongJin Jiang ,  Kyoung-sik Moon ,  Yi Li ,  Ching Ping Wong

Inventor： HongJin Jiang ,  Kyoung-sik Moon ,  Yi Li ,  Ching Ping Wong

IPC: H01B1/22

CPC classification number: H01B1/22 ,  H01L2224/16 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K3/321 ,  H05K2201/0245 ,  H05K2201/0257

Abstract: The present invention relates generally to conductive polymer composites, electrically conductive adhesives, and methods of producing the same. The conductive polymer composites and electrically conductive adhesives may be used for electronic component interconnects, flip chip interconnections, electrical connections to circuit boards, jumper connections, or similar uses. The method of forming a conductive polymer composite includes mixing conductive metal flakes, functionalized conductive metal nanoparticles, and a polymer precursor and curing the polymer precursor to form a composite. In one embodiment, the conductive polymer composites may be composed of microparticles of silver flake and sintered silver nanoparticles between the silver flakes. The polymer composites have an electrical conductivity of less than 10−5 Ω·cm.

Abstract translation: 本发明一般涉及导电聚合物复合材料，导电粘合剂及其制备方法。 导电聚合物复合物和导电粘合剂可用于电子元件互连，倒装芯片互连，到电路板的电连接，跳线连接或类似用途。 形成导电聚合物复合材料的方法包括混合导电金属薄片，官能化导电金属纳米颗粒和聚合物前体，并固化聚合物前体以形成复合材料。 在一个实施方案中，导电聚合物复合材料可以由银薄片的微粒和银薄片之间的烧结银纳米颗粒组成。 聚合物复合材料具有小于10 -5Ω·cm的电导率。

公开(公告)号：US20050036748A1

公开(公告)日：2005-02-17

申请号：US10916678

申请日：2004-08-11

Applicant: William Freeman ,  Ming Shi ,  Hongjin Jiang

Inventor： William Freeman ,  Ming Shi ,  Hongjin Jiang

IPC: G02B6/26 ,  G02B6/42 ,  G02B27/00 ,  G02B6/36

CPC classification number: G02B27/0006 ,  G02B1/11 ,  G02B6/264 ,  G02B6/4248

Abstract: Methods and structures for reducing the moisture penetration in an optical device such as an isolator, collimator, filters, circulators, and the like. Methods can include placing an optical cover over the opening(s) of the housing of the optical device. The optical cover can be bonded by epoxy or metallic seal. A moisture prevention coating can be placed over the seal line between the optical cover and the housing to further enhance moisture prevention.

Abstract translation: 用于减少诸如隔离器，准直器，过滤器，循环器等的光学装置中的水分渗透的方法和结构。 方法可以包括将光学盖放置在光学装置的壳体的开口上。 光学盖可以通过环氧树脂或金属密封接合。 可以将防潮涂层放置在光学盖和壳体之间的密封线上，以进一步增强防潮性。

公开(公告)号：US08920934B2

公开(公告)日：2014-12-30

申请号：US13853982

申请日：2013-03-29

Applicant: Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

Inventor： Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

IPC: B32B5/18 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/1056 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/047 ,  Y10S428/929 ,  Y10T428/12181 ,  Y10T428/12479 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81805

Abstract: Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.

Abstract translation: 描述了用于焊球和填充糊的混合焊料。 焊球可以由较高温度焊料液滴和低温焊料涂层形成。 这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。 焊球和糊剂可用于微电子器件的焊接封装。 可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附接到微电子衬底以形成混合焊料 互连。

公开(公告)号：US20140091457A1

公开(公告)日：2014-04-03

申请号：US13631939

申请日：2012-09-29

Applicant: Hongjin JIANG ,  Arun Kumar C. NALLANI ,  Wei TAN

Inventor： Hongjin JIANG ,  Arun Kumar C. NALLANI ,  Wei TAN

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/48

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L23/48 ,  H01L23/49816 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00

Abstract: An apparatus comprises a substrate including a surface and a plurality of bonding pads positioned on the surface. The apparatus also includes a material comprising a solder positioned on the bonding pads and extending a distance outward therefrom. A first of the bonding pads in a first location on the substrate surface includes the solder extending a first distance outward therefrom. A second of the bonding pads in a second location on the substrate surface includes the solder extending a second distance outward therefrom. The first distance is different than the second distance. Other embodiments are described and claimed.

Abstract translation: 一种装置包括：基板，其包括表面和位于表面上的多个接合焊盘。 该装置还包括一种材料，其包括位于接合焊盘上的焊料，并从其向外延伸一段距离。 衬底表面上的第一位置中的第一接合焊盘包括从其向外延伸第一距离的焊料。 衬底表面上的第二位置中的第二焊盘包括从其向外延伸第二距离的焊料。 第一距离不同于第二距离。 描述和要求保护其他实施例。

公开(公告)号：US08575539B2

公开(公告)日：2013-11-05

申请号：US12669420

申请日：2008-07-23

Applicant: Alan Mosley ,  Gihan Ryu ,  Hongjin Jiang

Inventor： Alan Mosley ,  Gihan Ryu ,  Hongjin Jiang

IPC: G02F1/01

CPC classification number: G01N21/645

Abstract: A detector apparatus and method for detecting radiation emitted from a target comprising: a first transmissive polarizer (302) for polarizing radiation incident on the target; a second transmissive polarizer (304) for polarizing the radiation emitted from the target (303) and absorbing any remaining light polarized by the first polarizer; and at least one reflective polarizer (306) arranged between the first and second transmissive polarizers.

Abstract translation: 一种用于检测从目标发射的辐射的检测器装置和方法，包括：用于偏振入射在靶上的辐射的第一透射偏振器（302） 第二透射偏振器（304），用于使从所述靶（303）发射的辐射偏振并吸收由所述第一偏振器偏振的剩余光; 以及布置在第一和第二透射偏振器之间的至少一个反射偏振器（306）。

公开(公告)号：US20100264337A1

公开(公告)日：2010-10-21

申请号：US12669420

申请日：2008-07-23

Applicant: Alan Mosley ,  Gihan Ryu ,  Hongjin Jiang

Inventor： Alan Mosley ,  Gihan Ryu ,  Hongjin Jiang

IPC: H01L31/14 ,  G02F1/01 ,  G01N21/64

CPC classification number: G01N21/645

Abstract: A detector apparatus and method for detecting radiation emitted from a target comprising: a first transmissive polariser (302) for polarising radiation incident on the target; a second transmissive polariser (304) for polarising the radiation emitted from the target (303) and absorbing any remaining light polarised by the first polariser; and at least one reflective polariser (306) arranged between the first and second transmissive polarisers.

Abstract translation: 一种用于检测从目标发射的辐射的检测器装置和方法，包括：用于偏振入射在目标上的辐射的第一透射偏振器（302）; 第二透射偏振器（304），用于使从所述靶（303）发射的辐射偏振并吸收由所述第一偏振器偏振的任何剩余光; 以及布置在第一和第二透射偏振器之间的至少一个反射偏振器（306）。