Light emitting diode
    1.
    发明授权
    Light emitting diode 有权
    发光二极管

    公开(公告)号:US09041029B2

    公开(公告)日:2015-05-26

    申请号:US13340627

    申请日:2011-12-29

    摘要: A light emitting diode including a substrate, a first semiconductor layer, an active layer, and a second semiconductor layer is provided. The substrate includes a first surface and a second surface, and the second surface is a light emitting surface of the LED. The first semiconductor layer, the active layer, and the second semiconductor layer are stacked on the first surface in that order. A first electrode electrically is connected with the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer. A number of three-dimensional nano-structures are located on at least one surface of the substrate and aligned side by side, and a cross section of each of the three-dimensional nano-structure is M-shaped.

    摘要翻译: 提供了包括基板,第一半导体层,有源层和第二半导体层的发光二极管。 基板包括第一表面和第二表面,并且第二表面是LED的发光表面。 第一半导体层,有源层和第二半导体层以该顺序堆叠在第一表面上。 第一电极与第一半导体层电连接。 第二电极与第二半导体层电连接。 多个三维纳米结构位于基板的至少一个表面上并排排列,并且每个三维纳米结构的横截面为M形。

    Light emitting diode
    2.
    发明授权
    Light emitting diode 有权
    发光二极管

    公开(公告)号:US09029889B2

    公开(公告)日:2015-05-12

    申请号:US13340661

    申请日:2011-12-29

    摘要: A light emitting diode is provided. The light emitting diode includes a first semiconductor layer, an active layer, a second semiconductor layer, a first electrode and a second electrode. The active layer is sandwiched between the first semiconductor layer and the second semiconductor layer, and a surface of the second semiconductor layer which is away from the active layer is a light extraction surface of the LED. The first electrode is electrically connected with the first semiconductor layer. The second electrode electrically connected with the second semiconductor layer. A number of three-dimensional nano-structures are formed on the light extraction surface of LED, the number of the three-dimensional nano-structures are aligned side by side, and a cross section of each three-dimensional nano-structure is M-shaped.

    摘要翻译: 提供发光二极管。 发光二极管包括第一半导体层,有源层,第二半导体层,第一电极和第二电极。 有源层夹在第一半导体层和第二半导体层之间,并且远离有源层的第二半导体层的表面是LED的光提取表面。 第一电极与第一半导体层电连接。 第二电极与第二半导体层电连接。 在LED的光提取面上形成多个三维纳米结构,三维纳米结构的数量并排排列,每个三维纳米结构的截面为M- 成形。

    Light emitting diode
    4.
    发明授权
    Light emitting diode 有权
    发光二极管

    公开(公告)号:US08785955B2

    公开(公告)日:2014-07-22

    申请号:US13477273

    申请日:2012-05-22

    IPC分类号: H01L33/00

    CPC分类号: H01L33/24 H01L33/32

    摘要: A light emitting diode including a substrate, a first semiconductor layer, an active layer, and a second semiconductor layer is provided. The first semiconductor layer includes a first surface and a second surface, and the first surface is connected to the substrate. The active layer and the second semiconductor layer are stacked on the second surface in that order, and a surface of the second semiconductor layer away from the active layer is configured as the light emitting surface. A first electrode electrically is connected with the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer. A number of three-dimensional nano-structures are located on the surface of the first surface of the first semiconductor layer and aligned side by side, and a cross section of each of the three-dimensional nano-structure is M-shaped.

    摘要翻译: 提供了包括基板,第一半导体层,有源层和第二半导体层的发光二极管。 第一半导体层包括第一表面和第二表面,并且第一表面连接到基板。 有源层和第二半导体层以该顺序堆叠在第二表面上,并且第二半导体层远离有源层的表面被配置为发光表面。 第一电极与第一半导体层电连接。 第二电极与第二半导体层电连接。 多个三维纳米结构位于第一半导体层的第一表面的表面上并排排列,并且每个三维纳米结构的横截面是M形的。

    Method for making light emitting diode
    5.
    发明授权
    Method for making light emitting diode 有权
    制造发光二极管的方法

    公开(公告)号:US08785221B2

    公开(公告)日:2014-07-22

    申请号:US13479234

    申请日:2012-05-23

    IPC分类号: H01L21/00 H01L33/00

    摘要: A method for making light emitting diode is provided. The method includes following steps. A substrate is provided. A first semiconductor layer is grown on a surface of the substrate. A patterned mask layer is located on a surface of the first semiconductor layer, and the patterned mask layer includes a number of bar-shaped protruding structures, a slot is defined between each two adjacent protruding structures to expose a portion of the first semiconductor layer. The exposed first semiconductor layer is etched to form a protruding pair. A number of three-dimensional nano-structures are formed by removing the patterned mask layer. An active layer and a second semiconductor layers are grown on the number of three-dimensional nano-structures in that order. A first electrode is electrically connected with the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer.

    摘要翻译: 提供一种制造发光二极管的方法。 该方法包括以下步骤。 提供基板。 在衬底的表面上生长第一半导体层。 图案化的掩模层位于第一半导体层的表面上,并且图案化掩模层包括多个棒状突出结构,在每个两个相邻的突出结构之间限定狭缝以暴露第一半导体层的一部分。 暴露的第一半导体层被蚀刻以形成突出的一对。 通过去除图案化掩模层形成多个三维纳米结构。 在三维纳米结构的数量上依次生长有源层和第二半导体层。 第一电极与第一半导体层电连接。 第二电极与第二半导体层电连接。

    Light emitting diode
    6.
    发明授权
    Light emitting diode 有权
    发光二极管

    公开(公告)号:US08759857B2

    公开(公告)日:2014-06-24

    申请号:US13479223

    申请日:2012-05-23

    IPC分类号: H01L33/00

    摘要: A light emitting diode including a substrate, a first semiconductor layer, an active layer, and a second semiconductor layer is provided. A surface of the substrate away from the active layer is configured as the light emitting surface. The first semiconductor layer includes a first surface and a second surface, and the first surface is connected to the substrate. The active layer and the second semiconductor layer are stacked on the second surface in that order. A first electrode electrically is connected with the first semiconductor layer. A second electrode is electrically connected with and covers a surface of the second semiconductor layer. A number of three-dimensional nano-structures are located on the surface of the first surface of the first semiconductor layer and the light emitting surface, and a cross section of each of the three-dimensional nano-structure is M-shaped.

    摘要翻译: 提供了包括基板,第一半导体层,有源层和第二半导体层的发光二极管。 远离有源层的衬底的表面被配置为发光表面。 第一半导体层包括第一表面和第二表面,并且第一表面连接到基板。 有源层和第二半导体层以该顺序堆叠在第二表面上。 第一电极与第一半导体层电连接。 第二电极与第二半导体层的表面电连接并覆盖其表面。 多个三维纳米结构位于第一半导体层和发光面的第一表面的表面上,并且每个三维纳米结构的横截面为M形。

    Light emitting diode with three-dimensional nano-structures
    7.
    发明授权
    Light emitting diode with three-dimensional nano-structures 有权
    具有三维纳米结构的发光二极管

    公开(公告)号:US08624285B2

    公开(公告)日:2014-01-07

    申请号:US13479225

    申请日:2012-05-23

    IPC分类号: H01L33/00

    摘要: A light emitting diode including a first semiconductor layer, an active layer, and a second semiconductor layer is provided. The first semiconductor layer includes a first surface and a second surface. The active layer and the second semiconductor layer are stacked on the second surface in that order, and a surface of the second semiconductor layer away from the active layer is configured as the light emitting surface. A first electrode is electrically connected with and covers the first surface of the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer. A number of three-dimensional nano-structures are located on the surface of the first surface of the first semiconductor layer and the light emitting surface, and a cross section of each of the three-dimensional nano-structure is M-shaped.

    摘要翻译: 提供了包括第一半导体层,有源层和第二半导体层的发光二极管。 第一半导体层包括第一表面和第二表面。 有源层和第二半导体层以该顺序堆叠在第二表面上,并且第二半导体层远离有源层的表面被配置为发光表面。 第一电极与第一半导体层的第一表面电连接并覆盖第一半导体层的第一表面。 第二电极与第二半导体层电连接。 多个三维纳米结构位于第一半导体层和发光面的第一表面的表面上,并且每个三维纳米结构的横截面为M形。

    OPTICAL-ELECTRICAL CONNECTOR ASSEMBLY HAVING A SECURING MEMBER
    9.
    发明申请
    OPTICAL-ELECTRICAL CONNECTOR ASSEMBLY HAVING A SECURING MEMBER 有权
    具有安全会员的光电连接器总成

    公开(公告)号:US20130183009A1

    公开(公告)日:2013-07-18

    申请号:US13740476

    申请日:2013-01-14

    IPC分类号: G02B6/42

    摘要: An optical-electrical connector assembly comprises a housing, a printed circuit board received in the housing and including a number of converting elements, a lens member, a ferrule aligned with the lens member and having a resisting portion, an integrated securing member, a coiled spring received in the securing member, and an optical cable having a number of optical fibers. The ferrule has a first engaging portion and a second engaging portion engaged with the housing. The coiled spring is compressed between the resisting portion and the first engaging portion.

    摘要翻译: 光电连接器组件包括壳体,容纳在壳体中并包括多个转换元件的印刷电路板,透镜构件,与透镜构件对准并具有阻挡部分的套圈,集成固定构件,卷绕 弹簧被容纳在固定构件中,并且具有多根光纤的光缆。 套圈具有与壳体接合的第一接合部分和第二接合部分。 螺旋弹簧在阻力部分和第一接合部分之间被压缩。