公开(公告)号：US07309994B2

公开(公告)日：2007-12-18

申请号：US11071670

申请日：2005-03-01

申请人： Eric R. Ehlers ,  Craig Hutchinson ,  Richard L. Rhymes ,  Timothy E. Shirley ,  Bobby Y. Wong

发明人： Eric R. Ehlers ,  Craig Hutchinson ,  Richard L. Rhymes ,  Timothy E. Shirley ,  Bobby Y. Wong

IPC分类号： G01R27/02 ,  H01P5/18

CPC分类号： G01R27/28 ,  G01R27/04

摘要： A directional bridge for measuring propagated signals to and from a source device to a load device where both the source device and load device are in signal communication with the directional bridge is disclosed. The directional bridge may include a first bridge circuit network and a first sensing element in signal communication with the first bridge circuit network. The first sensing element may produce a first measured signal that is proportional to the propagated signals.

摘要翻译： 公开了用于测量来自源设备的传播信号到负载设备的定向桥，其中源设备和负载设备都与定向桥信号通信。 定向桥可以包括第一桥接电路网络和与第一桥接电路网络信号通信的第一感测元件。 第一感测元件可产生与传播信号成比例的第一测量信号。

公开(公告)号：US07187249B2

公开(公告)日：2007-03-06

申请号：US10950131

申请日：2004-09-24

申请人： Dean B. Nicholson ,  Reto Zingg ,  Keith W. Howell ,  Eric R. Ehlers

发明人： Dean B. Nicholson ,  Reto Zingg ,  Keith W. Howell ,  Eric R. Ehlers

IPC分类号： H01P5/00

CPC分类号： H01L23/66 ,  H01L23/04 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01P1/20 ,  H05K1/0243 ,  H05K2201/10666 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： In one aspect, a signal path is described. The signal path has a nominal impedance over a specified bandwidth and interconnects a port of a microwave circuit package and a microwave component mounted in the microwave circuit package. The signal path includes an inductive transition and first and second capacitive structures. The inductive transition extends from a first point on the signal path to a second point on the signal path and has an excess impedance above the nominal impedance. The first and second capacitive structures respectively shunt the first and second points on the signal path to compensate the excess impedance of the inductive transition. The inductive transition and the first and second capacitive structures approximate a filter having an impedance substantially matching the nominal impedance over the specified bandwidth. In other aspects, a microwave circuit package that incorporates the above-described signal path and an interconnection method that includes forming the above-described signal path are described.

摘要翻译： 在一个方面，描述信号路径。 信号路径具有指定带宽上的标称阻抗，并且互连微波电路封装的端口和安装在微波电路封装中的微波元件。 信号路径包括电感转换和第一和第二电容结构。 电感转换从信号路径上的第一点延伸到信号路径上的第二个点，并具有超过标称阻抗的过量阻抗。 第一和第二电容结构分别分流信号路径上的第一和第二点以补偿电感转变的过量阻抗。 感应跃迁以及第一和第二电容结构近似于具有与指定带宽上的标称阻抗基本匹配的阻抗的滤波器。 在其他方面，描述了结合上述信号路径的微波电路封装以及包括形成上述信号路径的互连方法。

公开(公告)号：US07564663B2

公开(公告)日：2009-07-21

申请号：US11139853

申请日：2005-05-26

申请人： Dean Nicholson ,  Eric R. Ehlers ,  Stephen Westerman

发明人： Dean Nicholson ,  Eric R. Ehlers ,  Stephen Westerman

IPC分类号： H02H9/00 ,  H02H3/20 ,  H02H9/04 ,  H02H3/22 ,  H02H1/04 ,  H02H9/06 ,  H02H7/12

CPC分类号： H02H9/046 ,  H03F1/52 ,  H03F3/45475 ,  H03F2200/372 ,  H03K17/76

摘要： An integrated circuit includes a first RF port and a second RF port. A limiter section is disposed between the first RF port and the second RF port and a detector section coupled to an RF signal path between the first RF port and the second RF port configured to detect a power level of an input signal, and coupled to the limiter section.

摘要翻译： 集成电路包括第一RF端口和第二RF端口。 限制器部分设置在第一RF端口和第二RF端口之间，检测器部分耦合到第一RF端口和第二RF端口之间的RF信号路径，被配置为检测输入信号的功率电平，并耦合到 限制器部分。

公开(公告)号：US06884950B1

公开(公告)日：2005-04-26

申请号：US10941494

申请日：2004-09-15

申请人： Dean B. Nicholson ,  Eric R. Ehlers

发明人： Dean B. Nicholson ,  Eric R. Ehlers

IPC分类号： H01H59/00 ,  H01H57/00

CPC分类号： H01H59/0009

摘要： A MEMS switching system includes a power diverter interposed between a signal source and a bank of MEMS switches. The power diverter has an activated state wherein signal power from the signal source is diverted from the bank of MEMS switches, and a deactivated state wherein signal power from the signal source is not diverted from the bank of MEMS switches. A control signal selects between the activated state and the deactivated state of the power diverter.

摘要翻译： MEMS开关系统包括插入在信号源和一组MEMS开关之间的功率分流器。 功率分配器具有激活状态，其中来自信号源的信号功率从MEMS开关的组转移，以及去激活状态，其中来自信号源的信号功率不从MEMS开关组转移。 控制信号在功率分配器的激活状态和停用状态之间进行选择。

公开(公告)号：US20090272634A1

公开(公告)日：2009-11-05

申请号：US12114696

申请日：2008-05-02

申请人： Eric R. Ehlers ,  Dean B. Nicholson

发明人： Eric R. Ehlers ,  Dean B. Nicholson

IPC分类号： H01H59/00

CPC分类号： H01H59/0009

摘要： A power diverter has a first terminal for interposition between a signal input and a signal output. A MEMS switch is coupled to the first terminal and has a MEMS switch control input. A MEMS protection switch is coupled to the MEMS switch and has a protection switch control input. The switch control inputs are configured to receive control signals for selectively placing the power diverter in i) an ON state in which signal power at the signal input is diverted from the signal output via the MEMS switch and the MEMS protection switch, ii) an OFF state in which signal power at the signal input is not diverted from the signal output, and in which the MEMS switch mitigates an insertion loss and distortion imparted by the MEMS protection switch to a signal path between the signal input and the signal output, and iii) an intermediary state in which the MEMS protection switch reduces current flow through the MEMS switch.

摘要翻译： 功率分配器具有用于插入信号输入和信号输出之间的第一端子。 MEMS开关耦合到第一端子并具有MEMS开关控制输入。 MEMS保护开关耦合到MEMS开关，并具有保护开关控制输入。 开关控制输入被配置为接收用于选择性地放置功率分流器的控制信号，i）处于ON状态，其中信号输入端的信号功率经由MEMS开关和MEMS保护开关从信号输出转向，ii）OFF 信号输入的信号功率不从信号输出转移的状态，其中MEMS开关减轻由MEMS保护开关施加到信号输入和信号输出之间的信号路径的插入损耗和失真，以及iii ）中间状态，其中MEMS保护开关减少通过MEMS开关的电流。

公开(公告)号：US20090057872A1

公开(公告)日：2009-03-05

申请号：US11847239

申请日：2007-08-29

申请人： Eric R. Ehlers ,  Jim Clatterbaugh ,  Mathias Bonse ,  Timothy E. Shirley ,  Jerry R. Orr

发明人： Eric R. Ehlers ,  Jim Clatterbaugh ,  Mathias Bonse ,  Timothy E. Shirley ,  Jerry R. Orr

IPC分类号： H01L23/52 ,  H01L21/00 ,  H01L23/04

CPC分类号： H01L25/0657 ,  H01L23/3677 ,  H01L23/481 ,  H01L23/492 ,  H01L23/66 ,  H01L24/06 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29015 ,  H01L2224/29036 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00012

摘要： A stacked IC structure has an integrated circuit (IC) having a front IC side, a back IC side, and a first conductive feature formed on the front IC side. A through-chip via connects to the first conductive feature on the front IC side. A substrate has an external circuit formed on a front surface. The IC attaches to the front surface of the substrate and the through-chip via forms a connection between the first conductive feature and the external circuit.

摘要翻译： 叠层IC结构具有集成电路（IC），其具有形成在前IC侧的前IC侧，背IC侧和第一导电特性。 通芯片通孔连接到前IC侧的第一导电特征。 基板具有形成在前表面上的外部电路。 IC连接到基板的前表面，并且贯通芯片通孔在第一导电特征和外部电路之间形成连接。

公开(公告)号：US07911066B2

公开(公告)日：2011-03-22

申请号：US11847239

申请日：2007-08-29

申请人： Eric R Ehlers ,  Jim Clatterbaugh ,  Mathias Bonse ,  Timothy E Shirley ,  Jerry R Orr

发明人： Eric R Ehlers ,  Jim Clatterbaugh ,  Mathias Bonse ,  Timothy E Shirley ,  Jerry R Orr

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L23/3677 ,  H01L23/481 ,  H01L23/492 ,  H01L23/66 ,  H01L24/06 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29015 ,  H01L2224/29036 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00012

摘要： A stacked IC structure has an integrated circuit (IC) having a front IC side, a back IC side, and a first conductive feature formed on the front IC side. A through-chip via connects to the first conductive feature on the front IC side. A substrate has an external circuit formed on a front surface. The IC attaches to the front surface of the substrate and the through-chip via forms a connection between the first conductive feature and the external circuit.

摘要翻译： 叠层IC结构具有集成电路（IC），其具有形成在前IC侧的前IC侧，背IC侧和第一导电特性。 通芯片通孔连接到前IC侧的第一导电特征。 基板具有形成在前表面上的外部电路。 IC连接到基板的前表面，并且贯通芯片通孔在第一导电特征和外部电路之间形成连接。

公开(公告)号：US20090219102A1

公开(公告)日：2009-09-03

申请号：US12040197

申请日：2008-02-29

申请人： ERIC R. EHLERS

发明人： ERIC R. EHLERS

IPC分类号： H03B7/00

CPC分类号： H03B5/1231 ,  H03B5/1212 ,  H03B5/1221 ,  H03B5/1293

摘要： An electrical oscillator includes a first oscillating transistor and a second oscillating transistor. The electrical oscillator also includes a first non-linear load connected to a terminal of the first oscillating transistor, and a second non-linear load connected to a terminal of the second oscillating transistor. The electrical oscillator also includes a negative resistance generated between the terminal of the first oscillating transistor and the terminal of the second oscillating transistor. The electrical oscillator does not include a tunable resonator.

摘要翻译： 电振荡器包括第一振荡晶体管和第二振荡晶体管。 电气振荡器还包括连接到第一振荡晶体管的端子的第一非线性负载和连接到第二振荡晶体管的端子的第二非线性负载。 电振荡器还包括在第一振荡晶体管的端子和第二振荡晶体管的端子之间产生的负电阻。 电振荡器不包括可调谐谐振器。

公开(公告)号：US07355491B2

公开(公告)日：2008-04-08

申请号：US11626715

申请日：2007-01-24

申请人： Dean B. Nicholson ,  Reto Zingg ,  Keith W. Howell ,  Eric R. Ehlers

发明人： Dean B. Nicholson ,  Reto Zingg ,  Keith W. Howell ,  Eric R. Ehlers

IPC分类号： H01P5/00

CPC分类号： H01L23/66 ,  H01L23/04 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01P1/20 ,  H05K1/0243 ,  H05K2201/10666 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： In one aspect, a signal path is described. The signal path has a nominal impedance over a specified bandwidth and interconnects a port of a microwave circuit package and a microwave component mounted in the microwave circuit package. The signal path includes an inductive transition and first and second capacitive structures. The inductive transition extends from a first point on the signal path to a second point on the signal path and has an excess impedance above the nominal impedance. The first and second capacitive structures respectively shunt the first and second points on the signal path to compensate the excess impedance of the inductive transition. The inductive transition and the first and second capacitive structures approximate a filter having an impedance substantially matching the nominal impedance over the specified bandwidth. In other aspects, a microwave circuit package that incorporates the above-described signal path and an interconnection method that includes forming the above-described signal path are described.

摘要翻译： 在一个方面，描述信号路径。 信号路径具有指定带宽上的标称阻抗，并且互连微波电路封装的端口和安装在微波电路封装中的微波元件。 信号路径包括电感转换和第一和第二电容结构。 电感转换从信号路径上的第一点延伸到信号路径上的第二个点，并具有超过标称阻抗的过量阻抗。 第一和第二电容结构分别分流信号路径上的第一和第二点以补偿电感转变的过量阻抗。 感应跃迁以及第一和第二电容结构近似于具有与指定带宽上的标称阻抗基本匹配的阻抗的滤波器。 在其他方面，描述了结合上述信号路径的微波电路封装以及包括形成上述信号路径的互连方法。

公开(公告)号：US5808322A

公开(公告)日：1998-09-15

申请号：US829924

申请日：1997-04-01

申请人： Dean B. Nicholson ,  Eric R. Ehlers

发明人： Dean B. Nicholson ,  Eric R. Ehlers

IPC分类号： H01L29/80 ,  H01L31/167 ,  H01P1/22 ,  H03H7/25 ,  H03H11/24 ,  H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L31/167

摘要： The present invention relates to GaAs FET switches for use in microwave test equipment. For many microwave applications, particularly GSM (Global System for Mobile Telecommunications) basestation testing, accurate, reliable switching of microwave signals is desirable. GaAs FET switches are widely used to switch microwave signals in many applications because of their small size and high reliability. However, GaAs FET switches have a significant drawback called the "slow tail" effect. This effect causes the final amplitude of the microwave signal to only be reached gradually after a 10 to 20 millisecond interval. The present invention integrates high intensity LEDs above GaAs IC switches to decrease the absolute magnitude of the slow tail effect, and to shorten its length for faster, more accurate switching.

摘要翻译： 本发明涉及用于微波测试设备的GaAs FET开关。 对于许多微波应用，特别是GSM（全球移动电信系统）基站测试，微波信号的准确可靠的切换是可取的。 GaAs FET开关广泛用于许多应用中的微波信号切换，因为它们体积小，可靠性高。 然而，GaAs FET开关具有称为“慢尾”效应的显着缺点。 这种效应使得微波信号的最终幅度仅在10至20毫秒间隔之后逐渐达到。 本发明将高强度LED集成在GaAs IC开关上方，以减小缓慢尾部效应的绝对值，并缩短其长度以实现更快，更准确的切换。