Photosensitive resin composition and method for forming fine patterns
with said composition
    3.
    发明授权
    Photosensitive resin composition and method for forming fine patterns with said composition 失效
    光敏树脂组合物和用所述组合物形成精细图案的方法

    公开(公告)号:US4554237A

    公开(公告)日:1985-11-19

    申请号:US452198

    申请日:1982-12-22

    CPC分类号: G03F7/008 Y10S430/128

    摘要: Disclosed are photosensitive resin composition useful for formation of fine patterns on semiconductor devices, magnetic bubble devices, etc. which is highly sensitive and is excellent in developability and which has no problem such as precipitation of azide compounds and remaining azide particles after development and a method for forming fine patterns with said composition.Said photosensitive resin composition comprises (a) at least one polymer compound selected from the group consisting of a novolak resin and a polyhydroxystyrene resin and (b) an azide compound represented by the general formula (1): ##STR1## [wherein X is --N.sub.3 or --SO.sub.2 N.sub.3, Y is ##STR2## R.sup.1 is a lower alkylene such as --CH.sub.2 CH.sub.2 --, --CH.sub.2 CH.sub.2 CH.sub.2 --, or --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 CH.sub.2 --, a hydroxyalkylene or an aminoalkylene such as ##STR3## (wherein R.sup.4 and R.sup.5 are lower alkyl or hydrogen, R.sup.6 -R.sup.8 are lower alkyl groups, R.sup.3 is hydrogen, a lower alkyl group or --CH.sub.2 CH.sub.2 O).sub.n R.sup.9 wherein n is an integer of 3 or less and R.sup.9 is hydrogen or a lower alkyl group)].

    摘要翻译: 公开了用于在半导体器件上形成精细图案的光敏树脂组合物,具有高度敏感性和显影性优异的并且没有问题,例如显影后的叠氮化合物和剩余的叠氮化物颗粒的沉淀,以及方法 用于用所述组合物形成精细图案。 所述光敏树脂组合物包含(a)至少一种选自酚醛清漆树脂和聚羟基苯乙烯树脂的聚合物化合物和(b)由通式(1)表示的叠氮化合物:其中 X是-N3或-SO2N3,Y是低级亚烷基,例如-CH2CH2-,-CH2CH2CH2-或-CH2CH2OCH2CH2CH2-,羟基亚烷基或氨基亚烷基,例如

    Monofunctional monomer-containing photosensitive composition for
photoresist
    4.
    发明授权
    Monofunctional monomer-containing photosensitive composition for photoresist 失效
    用于光刻胶的单官能含单体光敏组合物

    公开(公告)号:US4108666A

    公开(公告)日:1978-08-22

    申请号:US665883

    申请日:1976-03-11

    CPC分类号: G03F7/027

    摘要: A photosensitive composition for a photoresist, which comprises (A) a compound having the following general formula: ##STR1## wherein Z is a cyclic dibasic acid anhydride moiety, R.sup.1 is an alkylene group having 1 to 3 carbon atoms, R.sup.2 is hydrogen or methyl, and R.sup.3 is hydrogen, methyl, ethyl or -CH.sub.2 X in which X is chlorine or bromine, (B) a photopolymerization sensitizer, (C) a polymer being capable of giving a film-forming property, (D) a chain transfer agent and (E) a thermal polymerization inhibitor; and a laminated photosensitive element which has a substantially dry photosensitive layer of the photosensitive composition. The composition and element are capable of giving a minute resist pattern which is excellent as an etching resist or metal plating resist and can be readily removed after etching or metal plating.

    摘要翻译: 一种光致抗蚀剂用光敏组合物,其包含(A)具有以下通式的化合物:其中Z是环状二元酸酐部分,R 1是具有1至3个碳原子的亚烷基,R 2是氢或甲基 ,R 3为氢,甲基,乙基或-CH 2 X,其中X为氯或溴,(B)光聚合增感剂,(C)能够提供成膜性的聚合物,(D)链转移剂和 (E)热聚合抑制剂; 以及具有基本上干燥的光敏组合物感光层的层压感光元件。 组合物和元素能够提供作为抗蚀剂或金属电镀抗蚀剂优异的微小抗蚀剂图案,并且可以在蚀刻或金属电镀之后容易地除去。

    Soldering mask formed from a photosensitive resin composition and a
photosensitive element
    6.
    发明授权
    Soldering mask formed from a photosensitive resin composition and a photosensitive element 失效
    由感光性树脂组合物和光敏元件形成的焊接掩模

    公开(公告)号:US4499163A

    公开(公告)日:1985-02-12

    申请号:US512660

    申请日:1983-07-11

    摘要: A photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate and/or isophorone diisocynate dihydric alcohol and an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.

    摘要翻译: 一种感光性树脂组合物,其含有(a)20〜75重量份通过使三甲基六亚甲基二异氰酸酯和/或异佛尔酮二异氰酸酯二元醇与二元醇的丙烯酸或甲基丙烯酸单酯反应得到的氨基甲酸酯二丙烯酸酯或二甲基丙烯酸酯化合物,(b)20〜75 重量的玻璃化转变温度为约40〜150℃的线性高分子化合物,和(c)由于光化性光而产生自由基的敏化剂和/或敏化剂体系,耐热性优异, 耐热冲击和耐溶剂性,并且适于形成焊接掩模。 此外,通过在支撑体上形成上述组合物层而制造的感光元件形成耐热性,耐热冲击性和耐溶剂性优异的保护涂膜,特别适用于焊接掩模。

    Water-dispersible epoxy modified alkyd resins
    7.
    发明授权
    Water-dispersible epoxy modified alkyd resins 失效
    水分散性环氧改性醇酸树脂

    公开(公告)号:US4154709A

    公开(公告)日:1979-05-15

    申请号:US883706

    申请日:1978-03-06

    CPC分类号: C08G63/66 C09D167/08

    摘要: A water-dispersible epoxy modified alkyd resin produced by reacting (A) 0-50 parts by weight of oil or oil fatty acid, (B) 10-50 parts by weight of polyhydric alcohol, (C) 0-25 parts by weight of monobasic acid having 6 to 18 carbon atoms, (D) 15-70 parts by weight of polybasic acid having 4 to 10 carbon atoms or its anhydride, (E) 5-25 parts by weight of polyoxyalkylene glycol having a molecular weight of 600 to 20,000, and (F) an epoxy compound, wherein the ratio of the hydroxyl groups to the carboxyl groups in the components (A) through (E) is 0.625-1.8 and the amount of the component (F) is 3-50 parts by weight per 100 parts by weight of the total weight of the components (A) through (E), can provide water-dispersible coatings having improved drying characteristics and water resistance as well as corrosion resistance.

    摘要翻译: (A)0-50重量份的油或油脂肪酸,(B)10-50重量份的多元醇,(C)0-25重量份的 具有6至18个碳原子的一元酸,(D)15-70重量份的具有4至10个碳原子的多元酸或其酸酐,(E)5-25重量份的分子量为600至100的聚氧化亚烷基二醇 20,000和(F)环氧化合物,其中组分(A)至(E)中羟基与羧基的比例为0.625-1.8,组分(F)的量为3-50份, (A)至(E)中每100重量份的重量,可以提供具有改进的干燥特性和耐水性以及耐腐蚀性的水分散性涂料。