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    Packaging technique for the fabrication of polarized light emitting diodes
    3.
    发明授权
    Packaging technique for the fabrication of polarized light emitting diodes 有权
    用于制造偏振发光二极管的封装技术

    公开(公告)号：US07723746B2

    公开(公告)日：2010-05-25

    申请号：US12272588

    申请日：2008-11-17

    申请人： Hisashi Masui ,  Shuji Nakamura ,  Steven P. DenBaars

    发明人： Hisashi Masui ,  Shuji Nakamura ,  Steven P. DenBaars

    IPC分类号： H01L29/22 ,  H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/16 ,  G02F1/133603 ,  G02F1/13362 ,  H01L23/544 ,  H01L33/20 ,  H01L33/483 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A polarized light emitting diode (LED) includes a marker indicating a polarization direction. A package for the LED also includes a marker indicating the polarization direction. The markers on the LED and package are used for mutual alignment, wherein the LED is attached in a favorable orientation with respect to a package, so that the polarization direction of emitted light from the package is apparent. The marker is placed on the LED before die separation and the marker is placed on the package before alignment. The marker on the LED comprises a photolithographic pattern, an asymmetric die shape, a notch on the die, or a scratch on the die, while the marker on the package comprises an electrode shape or pattern, an asymmetric package shape, a notch on the package, or a scratch on the package. Finally, the LED or package may be installed in an external circuit or system that also indicates the polarization direction.

    摘要翻译： 偏振发光二极管（LED）包括指示极化方向的标记。 用于LED的封装还包括指示极化方向的标记。 LED和封装上的标记用于相互对准，其中LED以相对于封装的有利取向附接，使得来自封装的发射光的偏振方向是明显的。 标记物在芯片分离之前放置在LED上，并且在对准之前将标记物放置在包装上。 LED上的标记包括光刻图案，不对称模具形状，裸片上的凹口或裸片上的划痕，而封装上的标记包括电极形状或图案，非对称封装形状， 包装或包装上的划痕。 最后，LED或封装可以安装在也指示极化方向的外部电路或系统中。