Method for manufacturing semiconductor thin film
    2.
    发明授权
    Method for manufacturing semiconductor thin film 有权
    制造半导体薄膜的方法

    公开(公告)号:US07713812B2

    公开(公告)日:2010-05-11

    申请号:US11330213

    申请日:2006-01-12

    IPC分类号: H01L21/00

    摘要: A substrate with a second semiconductor layer and a second mask film formed thereon is subjected to a heat treatment in an oxidizing atmosphere. Thus, second oxidized regions are formed through oxidization of the second semiconductor layer in regions of the second semiconductor layer that are not covered by the second mask film. At the same time, a second base layer is formed in each region that is interposed by the second oxidized regions. Then, the second mask film is removed, and a third semiconductor layer is selectively grown on the surface of the second base layer that is exposed between the second oxidized regions so as to cover the second oxidized regions, after which the first oxidized regions and the second oxidized regions covering the entire upper surface of the substrate are removed.

    摘要翻译: 在其上形成有第二半导体层和第二掩模膜的衬底在氧化气氛中进行热处理。 因此,通过在第二半导体层的未被第二掩模膜覆盖的区域中氧化第二半导体层来形成第二氧化区。 同时,在由第二氧化区插入的每个区域中形成第二基层。 然后,去除第二掩模膜,并且在暴露在第二氧化区域之间的第二基底层的表面上选择性地生长第三半导体层以覆盖第二氧化区域,之后第一氧化区域和 去除覆盖基板的整个上表面的第二氧化区域。

    Semiconductor device with oxidized regions and method for fabricating the same
    9.
    发明授权
    Semiconductor device with oxidized regions and method for fabricating the same 有权
    具有氧化区域的半导体器件及其制造方法

    公开(公告)号:US07795630B2

    公开(公告)日:2010-09-14

    申请号:US10912142

    申请日:2004-08-06

    IPC分类号: H01L33/00

    CPC分类号: H01L33/08

    摘要: A semiconductor device, which includes an active layer made of a first semiconductor layer formed on a substrate, is designed so that a first oxidized area made of an oxide layer is formed on the active layer. The first oxidized area further aids in reducing a reactive current so that it becomes possible to achieve a semiconductor device having superior device characteristics.

    摘要翻译: 包括由形成在基板上的第一半导体层构成的有源层的半导体器件被设计成使得在有源层上形成由氧化物层形成的第一氧化区域。 第一氧化区进一步有助于降低无功电流,使得可以实现具有优异的器件特性的半导体器件。