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    Rotary electric motor and blower that uses the same
    1.
    发明授权
    Rotary electric motor and blower that uses the same 有权
    旋转电动机和鼓风机使用相同

    公开(公告)号：US08648514B2

    公开(公告)日：2014-02-11

    申请号：US12991261

    申请日：2009-04-28

    申请人： Hideaki Arita ,  Masaya Inoue ,  Masahiro Iezawa ,  Hayato Yoshino ,  Kazuhiko Baba ,  Hitoshi Kawaguchi ,  Toshihiko Miyake

    发明人： Hideaki Arita ,  Masaya Inoue ,  Masahiro Iezawa ,  Hayato Yoshino ,  Kazuhiko Baba ,  Hitoshi Kawaguchi ,  Toshihiko Miyake

    IPC分类号： H02K21/28 ,  H02K21/38 ,  H02K37/10 ,  H02K1/17

    CPC分类号： H02K9/06 ,  H02K21/046 ,  H02K21/44

    摘要： In a rotary electric motor a first stator core and a second stator core are disposed coaxially so as to be separated by a predetermined distance axially and such that circumferential positions of teeth are aligned, and a first rotor core and a second rotor core on which salient poles are disposed at a uniform angular pitch circumferentially are fixed coaxially to a rotating shaft so as to be positioned on inner peripheral sides of the first stator core and the second stator core, respectively, and so as to be offset circumferentially by a pitch of half a salient pole from each other. A first permanent magnet that is magnetically oriented such that a direction of magnetization is radially inward is disposed on an outer peripheral surface of a core back of the first stator core, and an outer peripheral surface of the first permanent magnet and the outer peripheral surface of the core back of the second stator core are linked by a frame that is made of a magnetic material.

    摘要翻译： 在旋转电动机中，第一定子铁芯和第二定子铁芯同轴地设置成轴向间隔预定距离，并使得齿的周向位置对齐;以及第一转子铁心和第二转子铁心， 磁极以与圆周同轴的均匀的角度间距设置，以分别位于第一定子铁心和第二定子铁心的内周侧，并且周向地偏移半个间距 一个突出的杆彼此。 磁性取向使得磁化方向径向向内的第一永磁体设置在第一定子铁心的芯背的外周面上，第一永久磁体的外周面和第一永久磁铁的外周面 第二定子铁芯的芯背通过由磁性材料制成的框架连接。

    Epoxy resin composition and semiconductor device
    2.
    发明授权
    Epoxy resin composition and semiconductor device 失效
    环氧树脂组合物和半导体器件

    公开(公告)号：US08470918B2

    公开(公告)日：2013-06-25

    申请号：US12088053

    申请日：2006-09-27

    申请人： Hiroshi Hirose ,  Hideaki Sasajima ,  Hitoshi Kawaguchi

    发明人： Hiroshi Hirose ,  Hideaki Sasajima ,  Hitoshi Kawaguchi

    IPC分类号： C08K3/38 ,  C08L63/00

    CPC分类号： H01L23/293 ,  C08G59/32 ,  C08G59/4014 ,  C08G59/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： There are provided an epoxy resin composition exhibiting less warpage after molding and during a solder treatment process as well as during a low temperature process of, for example, a temperature cycle test, and excellent in flame retardancy, solder crack resistance, and flowability; and a semiconductor device using the same. The epoxy resin composition used in the semiconductor device contains at least one type of epoxy resin (A) selected from a trifunctional epoxy resin and a tetrafunctional epoxy resin, a curing agent (B) having at least two hydroxyl groups per molecule, a compound (C) having at least two cyanate groups per molecule, and an inorganic filler (D), as essential components.

    摘要翻译： 提供了在成型后和焊接处理过程中以及在例如温度循环试验的低温过程中表现出较小的翘曲性，阻燃性，耐焊料龟裂性和流动性优异的环氧树脂组合物。 以及使用该半导体装置的半导体装置。 在半导体装置中使用的环氧树脂组合物含有选自三官能环氧树脂和四官能环氧树脂中的至少一种环氧树脂（A），每分子具有至少两个羟基的固化剂（B），化合物 C）每分子具有至少两个氰酸酯基，和无机填料（D）作为必需组分。

    MULTILAYER CIRCUIT BOARD, INSULATING SHEET, AND SEMICONDUCTOR PACKAGE USING MULTILAYER CIRCUIT BOARD
    3.
    发明申请
    MULTILAYER CIRCUIT BOARD, INSULATING SHEET, AND SEMICONDUCTOR PACKAGE USING MULTILAYER CIRCUIT BOARD 有权
    多层电路板，绝缘片和使用多层电路板的半导体封装

    公开(公告)号：US20110024172A1

    公开(公告)日：2011-02-03

    申请号：US12922688

    申请日：2009-03-25

    申请人： Hironori Maruyama ,  Hitoshi Kawaguchi ,  Hiroyuki Tanaka

    发明人： Hironori Maruyama ,  Hitoshi Kawaguchi ,  Hiroyuki Tanaka

    IPC分类号： H05K1/00

    CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/15174 ,  H05K1/0271 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0195

    摘要： Semiconductor chip mounting yield and semiconductor package reliability deteriorate due to warpage of a multilayer circuit board. A multilayer circuit board (1) using an interlayer insulating layer (6) can suppress warpage of the entire multilayer circuit board (1) by making the interlayer insulating layer (6) serve as a buffer material. In the multilayer circuit board (1) using the interlayer insulating layer (6), conductor circuit layers (11) and interlayer insulating layers (6) are alternately arranged. The interlayer insulating layer (6) to be used in the multilayer circuit board (1) includes a first insulating layer and a second insulating layer having an elastic modulus higher than that of the first insulating layer.

    摘要翻译： 由于多层电路板的翘曲，半导体芯片安装成品率和半导体封装可靠性恶化。 使用层间绝缘层（6）的多层电路板（1）可以通过使层间绝缘层（6）作为缓冲材料来抑制整个多层电路板（1）的翘曲。 在使用层间绝缘层（6）的多层电路基板（1）中，配置导体电路层（11）和层间绝缘层（6）。 在多层电路基板（1）中使用的层间绝缘层（6）具有比第一绝缘层高的弹性模量的第一绝缘层和第二绝缘层。

    Bus system for use with information processing apparatus
    4.
    发明授权
    Bus system for use with information processing apparatus 失效
    与信息处理设备一起使用的总线系统

    公开(公告)号：US07802045B2

    公开(公告)日：2010-09-21

    申请号：US12501684

    申请日：2009-07-13

    申请人： Koichi Okazawa ,  Koichi Kimura ,  Hitoshi Kawaguchi ,  Ichiharu Aburano ,  Kazushi Kobayashi ,  Tetsuya Mochida

    发明人： Koichi Okazawa ,  Koichi Kimura ,  Hitoshi Kawaguchi ,  Ichiharu Aburano ,  Kazushi Kobayashi ,  Tetsuya Mochida

    IPC分类号： G06F13/00

    CPC分类号： G06F13/4022 ,  G06F13/4027

    摘要： A processor bus linked with at least a processor, a memory bus linked with a main memory, and a system bus linked with at least an input/output device are connected to a three-way connection control system. The control system includes a bus-memory connection controller connected to address buses and control buses respectively of the processor, memory, and system buses to transfer address and control signals therebetween. The control system further includes a data path switch connected to data buses respectively of the processor, memory, and system buses to transfer data via the data buses therebetween depending on the data path control signal.

    摘要翻译： 与至少一个处理器连接的处理器总线，与主存储器连接的存储器总线以及与至少一个输入/输出设备链接的系统总线连接到三路连接控制系统。 控制系统包括总线存储器连接控制器，分别连接到处理器，存储器和系统总线的地址总线和控制总线，以在它们之间传送地址和控制信号。 控制系统还包括连接到处理器，存储器和系统总线的数据总线的数据通路开关，以根据数据路径控制信号经由其间的数据总线传输数据。

    Bus system for use with information processing apparatus
    6.
    发明授权
    Bus system for use with information processing apparatus 失效
    与信息处理设备一起使用的总线系统

    公开(公告)号：US07398346B2

    公开(公告)日：2008-07-08

    申请号：US11543878

    申请日：2006-10-06

    申请人： Koichi Okazawa ,  Koichi Kimura ,  Hitoshi Kawaguchi ,  Ichiharu Aburano ,  Kazushi Kobayashi ,  Tetsuya Mochida

    发明人： Koichi Okazawa ,  Koichi Kimura ,  Hitoshi Kawaguchi ,  Ichiharu Aburano ,  Kazushi Kobayashi ,  Tetsuya Mochida

    IPC分类号： G06F13/00

    CPC分类号： G06F13/4022 ,  G06F13/4027

    摘要： A processor bus linked with at least a processor, a memory bus linked with a main memory, and a system bus linked with at least an input/output device are connected to a three-way connection control system. The control system includes a bus-memory connection controller connected to address buses and control buses respectively of the processor, memory, and system buses to transfer address and control signals therebetween. The control system further includes a data path switch connected to data buses respectively of the processor, memory, and system buses to transfer data via the data buses therebetween depending on the data path control signal.

    摘要翻译： 与至少一个处理器连接的处理器总线，与主存储器连接的存储器总线以及与至少一个输入/输出设备链接的系统总线连接到三路连接控制系统。 控制系统包括总线存储器连接控制器，分别连接到处理器，存储器和系统总线的地址总线和控制总线，以在它们之间传送地址和控制信号。 控制系统还包括连接到处理器，存储器和系统总线的数据总线的数据通路开关，以根据数据路径控制信号经由其间的数据总线传输数据。

    Rotor for synchronous induction motor, synchronous induction motor, fan motor, compressor, air conditioner, and refrigerator
    7.
    发明授权
    Rotor for synchronous induction motor, synchronous induction motor, fan motor, compressor, air conditioner, and refrigerator 有权

    公开(公告)号：US07112908B2

    公开(公告)日：2006-09-26

    申请号：US10265697

    申请日：2002-10-08

    申请人： Yoshio Takita ,  Hitoshi Kawaguchi ,  Hayato Yoshino

    发明人： Yoshio Takita ,  Hitoshi Kawaguchi ,  Hayato Yoshino

    IPC分类号： H02K17/16

    CPC分类号： H02K19/14 ,  H02K1/246 ,  H02K21/46

    摘要： There are problems in a rotor having a slit that it is difficult to increase the number of rotations of the rotor, since the centrifugal force is received at both ends of the slit, and if the connection part is made thick to increase the number of rotations, the properties of the motor is deteriorated. According to the present invention, a rotor for a synchronous motor includes a slot for generating induction torque and a slit for generating reluctance torque, the slit is filled with a filler, the slit is provided with at least one of a convex and a concave, so that the convex and the concave are formed so as to receive the centrifugal force which is generated by the rotation of the rotor and acts on a part of the rotor outside the slit and the filler so as to bulge toward the outside from the center side of the rotor by mechanical bondage of the filler and the rotor core.