公开(公告)号：US20070238202A1

公开(公告)日：2007-10-11

申请号：US11393423

申请日：2006-03-30

申请人： Joseph Ranish ,  Tarpan Dixit ,  Dean Jennings ,  Balasubramanian Ramachandran ,  Aaron Hunter ,  Wolfgang Aderhold ,  Bruce Adams ,  Wen Chang

发明人： Joseph Ranish ,  Tarpan Dixit ,  Dean Jennings ,  Balasubramanian Ramachandran ,  Aaron Hunter ,  Wolfgang Aderhold ,  Bruce Adams ,  Wen Chang

IPC分类号： H01L21/66 ,  G01R31/26

CPC分类号： H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention generally relates to methods for the rapid thermal processing (RTP) of a substrate. Embodiments of the invention include controlling a thermal process using either a real-time adaptive control algorithm or by using a control algorithm that is selected from a suite of fixed control algorithms designed for a variety of substrate types. Selection of the control algorithm is based on optical properties of the substrate measured during the thermal process. In one embodiment, a combination of control algorithms are used, wherein the majority of lamp groupings are controlled with a fixed control algorithm and a substantially smaller number of lamp zones are controlled by an adaptive control algorithm.

摘要翻译： 本发明一般涉及用于衬底的快速热处理（RTP）的方法。 本发明的实施例包括使用实时自适应控制算法或通过使用从针对各种基板类型设计的一套固定控制算法中选择的控制算法来控制热处理。 控制算法的选择基于在热处理期间测量的衬底的光学性质。 在一个实施例中，使用控制算法的组合，其中大多数灯分组由固定控制算法控制，并且通过自适应控制算法来控制基本上较少数量的灯区。

公开(公告)号：US08222574B2

公开(公告)日：2012-07-17

申请号：US12055045

申请日：2008-03-25

申请人： Khurshed Sorabji ,  Alexander Lerner ,  Joseph Ranish ,  Aaron Hunter ,  Bruce Adams ,  Mehran Behdjat ,  Rajesh Ramanujam

发明人： Khurshed Sorabji ,  Alexander Lerner ,  Joseph Ranish ,  Aaron Hunter ,  Bruce Adams ,  Mehran Behdjat ,  Rajesh Ramanujam

IPC分类号： H05B3/68 ,  F26B3/30 ,  C23C16/00

CPC分类号： H01L21/67109 ,  H01L21/67115 ,  H01L21/67248

摘要： Apparatus and methods for achieving uniform heating or cooling of a substrate during a rapid thermal process are disclosed. More particularly, apparatus and methods for controlling the temperature of an edge ring supporting a substrate and/or a reflector plate during a rapid thermal process to improve temperature uniformity across the substrate are disclosed, which include a thermal mass or plate adjacent the edge ring to heat or cool the edge ring.

摘要翻译： 公开了用于在快速热处理期间实现基板的均匀加热或冷却的装置和方法。 更具体地，公开了用于在快速热处理期间控制支撑衬底和/或反射板的边缘环的温度以改善衬底上的温度均匀性的装置和方法，其包括邻近边缘环到 加热或冷却边缘环。

公开(公告)号：US20100068898A1

公开(公告)日：2010-03-18

申请号：US12212157

申请日：2008-09-17

申请人： STEPHEN MOFFATT ,  Abhilash J. Mayur ,  Sundar Ramamurthy ,  Joseph Ranish ,  Aaron Hunter

发明人： STEPHEN MOFFATT ,  Abhilash J. Mayur ,  Sundar Ramamurthy ,  Joseph Ranish ,  Aaron Hunter

IPC分类号： H01L21/00 ,  F27D11/00

CPC分类号： H01L21/67115 ,  B23K26/0042 ,  B23K26/064 ,  B23K26/08 ,  B23K26/127 ,  F27B17/0025 ,  H01L21/67248

摘要： A method and apparatus are provided for treating a substrate. The substrate is positioned on a support in a thermal treatment chamber. Electromagnetic radiation is directed toward the substrate to anneal a portion of the substrate. Other electromagnetic radiation is directed toward the substrate to preheat a portion of the substrate. The preheating reduces thermal stresses at the boundary between the preheat region and the anneal region. Any number of anneal and preheat regions are contemplated, with varying shapes and temperature profiles, as needed for specific embodiments. Any convenient source of electromagnetic radiation may be used, such as lasers, heat lamps, white light lamps, or flash lamps.

摘要翻译： 提供了一种处理基板的方法和装置。 衬底位于热处理室中的支撑件上。 电磁辐射被引向衬底以退火衬底的一部分。 其他电磁辐射被引向衬底以预热衬底的一部分。 预热减少了预热区域和退火区域之间的边界处的热应力。 根据具体实施方案的需要，预期任何数量的退火和预热区域具有变化的形状和温度曲线。 可以使用任何方便的电磁辐射源，例如激光器，加热灯，白光灯或闪光灯。

公开(公告)号：US20060286776A1

公开(公告)日：2006-12-21

申请号：US11425346

申请日：2006-06-20

申请人： Joseph Ranish ,  Kaushal Singh

发明人： Joseph Ranish ,  Kaushal Singh

IPC分类号： H01L21/20

CPC分类号： C23C16/308 ,  C23C16/0227 ,  C23C16/345 ,  C23C16/45519 ,  C23C16/45591 ,  C23C16/482 ,  C23C16/488 ,  C23C16/52 ,  C30B25/02 ,  C30B29/06 ,  H01L21/02126 ,  H01L21/0214 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02219 ,  H01L21/02277 ,  H01L21/02301 ,  H01L21/0231 ,  H01L21/02348 ,  H01L21/02378 ,  H01L21/02381 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/02576 ,  H01L21/02579 ,  H01L21/0262 ,  H01L21/02661 ,  H01L21/3121 ,  H01L21/3143 ,  H01L21/31612 ,  H01L21/3185 ,  Y10S438/905

摘要： Embodiments of the invention generally provide a method for depositing films or layers using a UV source during a photoexcitation process. The films are deposited on a substrate and usually contain a material, such as silicon (e.g., epitaxy, crystalline, microcrystalline, polysilicon, or amorphous), silicon oxide, silicon nitride, silicon oxynitride, or other silicon-containing materials. The photoexcitation process may expose the substrate and/or gases to an energy beam or flux prior to, during, or subsequent a deposition process. Therefore, the photoexcitation process may be used to pre-treat or post-treat the substrate or material, to deposit the silicon-containing material, and to enhance chamber cleaning processes. Attributes of the method that are enhanced by the UV photoexcitation process include removing native oxides prior to deposition, removing volatiles from deposited films, increasing surface energy of the deposited films, increasing the excitation energy of precursors, reducing deposition time, and reducing deposition temperature.

公开(公告)号：US20060066193A1

公开(公告)日：2006-03-30

申请号：US11195395

申请日：2005-08-02

申请人： Joseph Ranish ,  Corina Tanasa ,  Sundar Ramamurthy ,  Claudia Lai ,  Ravi Jallepally ,  Ramachandran Balasubramanian ,  Aaron Hunter ,  Agus Tjandra ,  Norman Tam

发明人： Joseph Ranish ,  Corina Tanasa ,  Sundar Ramamurthy ,  Claudia Lai ,  Ravi Jallepally ,  Ramachandran Balasubramanian ,  Aaron Hunter ,  Agus Tjandra ,  Norman Tam

IPC分类号： H01K1/30 ,  H01K1/26

CPC分类号： H01L21/67115 ,  H05B3/0047

摘要： A thermal processing chamber includes a substrate support rotating about a center axis and a lamphead of plural lamps in an array having a predetermined difference in radiance pattern between them. The radiance pattern includes a variation in diffuseness or collimation. In one embodiment, the center lines of all of the lamps are disposed away from the center axis. The array can be an hexagonal array, in which the center axis is located at a predetermined position between neighboring lamps.

公开(公告)号：US20050286243A1

公开(公告)日：2005-12-29

申请号：US10877246

申请日：2004-06-25

申请人： Joseph Ranish ,  Abhijit Desai ,  Apollo Havelind

发明人： Joseph Ranish ,  Abhijit Desai ,  Apollo Havelind

IPC分类号： F21V33/00 ,  F27B17/00 ,  F27D99/00 ,  H01L21/00

CPC分类号： H01L21/67115 ,  F27B17/0025 ,  F27D99/0006 ,  F27D2099/0026

摘要： A lamp assembly for a substrate processing chamber is described. The lamp assembly comprises a tubular body having first and second ends, a lamp element at least partially seated in the first end having a filament and first electrical connectors, transmission wires attached to the first electrical connectors, and a rigid plug flexibly positioned relative to the second end of the tubular body having second electrical connectors attached to the transmission wires. The flexibly positioned rigid plug is generally capable of a range movement in directions both perpendicular and parallel to a longitudinal axis of the tubular body. In one version, the rigid plug comprises first and second plug elements.

摘要翻译： 描述了用于基板处理室的灯组件。 灯组件包括具有第一和第二端的管状主体，至少部分地位于第一端中的灯元件具有灯丝和第一电连接器，连接到第一电连接器的传输线以及相对于第一端柔性定位的刚性插头 管体的第二端具有连接到传输线的第二电连接器。 柔性定位的刚性塞通常能够在垂直于和平行于管状体的纵向轴线的方向上的范围移动。 在一个版本中，刚性插头包括第一和第二插头元件。

公开(公告)号：US20050102108A1

公开(公告)日：2005-05-12

申请号：US10950145

申请日：2004-09-24

申请人： Balasubramanian Ramachandran ,  Joseph Ranish ,  Ravi Jallepally ,  Sundar Ramamurthy ,  Raman Achutharaman ,  Brian Haas ,  Aaron Hunter

发明人： Balasubramanian Ramachandran ,  Joseph Ranish ,  Ravi Jallepally ,  Sundar Ramamurthy ,  Raman Achutharaman ,  Brian Haas ,  Aaron Hunter

IPC分类号： H01L21/00 ,  G01N31/00

CPC分类号： H01L21/67103

摘要： Method and apparatus for obtaining a tailored heat transfer profile in a chamber housing a microprocessor manufacturing process, including estimating heat transfer properties of the chamber; estimating heat absorptive properties of a wafer; adjusting the physical characteristics of the chamber to correct the heat transfer properties; and utilizing the chamber for manufacturing microprocessors.

摘要翻译： 用于在容纳微处理器制造过程的腔室中获得定制的传热轮廓的方法和装置，包括估计腔室的传热特性; 估计晶片的吸热性能; 调整室的物理特性以校正传热性能; 并利用该腔室制造微处理器。

公开(公告)号：US07813895B2

公开(公告)日：2010-10-12

申请号：US11829762

申请日：2007-07-27

申请人： Sairaju Tallavarjula ,  Aaron Hunter ,  Joseph Ranish ,  Johanes Swenberg ,  Robert M. Haney

发明人： Sairaju Tallavarjula ,  Aaron Hunter ,  Joseph Ranish ,  Johanes Swenberg ,  Robert M. Haney

IPC分类号： G06F11/30

CPC分类号： G01N21/73 ,  G01J3/443 ,  G01J2003/2866 ,  G01N21/274

摘要： Methods for matching semiconductor plasma processing chambers using a calibrated spectrometer are disclosed. In one embodiment, plasma attributes are measured for a process in a reference chamber and a process in a sample chamber. Measuring the plasma attributes during process perturbations allows for the correlation of process parameters to the plasma optical emission spectra. The process parameters can then be adjusted to yield a processed substrate which matches that of the reference chamber. Methods for monitoring the stability of a plasma processing chamber using a calibrated spectrometer are also disclosed.

摘要翻译： 公开了使用校准的光谱仪来匹配半导体等离子体处理室的方法。 在一个实施例中，测量参考室中的过程和样品室中的过程的等离子体属性。 在处理扰动期间测量等离子体属性允许工艺参数与等离子体发射光谱的相关性。 然后可以调整工艺参数以产生与参考室的处理参数相匹配的经处理的衬底。 还公开了使用校准的光谱仪监测等离子体处理室的稳定性的方法。

公开(公告)号：US20100065547A1

公开(公告)日：2010-03-18

申请号：US12212214

申请日：2008-09-17

申请人： STEPHEN MOFFATT ,  Abhilash J. Mayur ,  Sundar Ramamurthy ,  Joseph Ranish ,  Aaron Hunter

发明人： STEPHEN MOFFATT ,  Abhilash J. Mayur ,  Sundar Ramamurthy ,  Joseph Ranish ,  Aaron Hunter

IPC分类号： H05B3/02

CPC分类号： H01L21/67109 ,  H01L21/67115

摘要： A method and apparatus are provided for treating a substrate. The substrate is positioned on a support in a thermal treatment chamber. Electromagnetic radiation is directed toward the substrate to anneal a portion of the substrate. Other electromagnetic radiation is directed toward the substrate to preheat a portion of the substrate. The preheating reduces thermal stresses at the boundary between the preheat region and the anneal region. Any number of anneal and preheat regions are contemplated, with varying shapes and temperature profiles, as needed for specific embodiments. Any convenient source of electromagnetic radiation may be used, such as lasers, heat lamps, white light lamps, or flash lamps.

公开(公告)号：US20080090309A1

公开(公告)日：2008-04-17

申请号：US11751027

申请日：2007-05-20

申请人： JOSEPH RANISH ,  Balasubramanian Ramachandran ,  Ravi Jallepally ,  Sundar Ramamurthy ,  Vedapuram Achutharaman ,  Brian Haas ,  Aaron Hunter ,  Wolfgang Aderhold

发明人： JOSEPH RANISH ,  Balasubramanian Ramachandran ,  Ravi Jallepally ,  Sundar Ramamurthy ,  Vedapuram Achutharaman ,  Brian Haas ,  Aaron Hunter ,  Wolfgang Aderhold

IPC分类号： H01L21/324

CPC分类号： H01L21/67248 ,  H01L21/324 ,  H01L21/67115

摘要： A method for rapid thermal annealing is disclosed. As the substrate is inserted into an annealing chamber, it begins to heat due to the heat radiating from chamber components that were heated when a previous substrate was annealed. Thus, the leading edge of the substrate may be at an elevated temperature while the trailing edge of the substrate may be at room temperature while the substrate is inserted causing a temperature gradient is present across the substrate. Once the substrate is completely inserted into the annealing chamber, the temperature gradient may still be present. By compensating for the temperature gradient across the substrate, the substrate may be annealed uniformly.

摘要翻译： 公开了一种快速热退火的方法。 当衬底被插入退火室时，由于从先前的衬底退火时被加热的腔室部件散发的热量开始加热。 因此，衬底的前缘可能处于升高的温度，而衬底的后缘可能在室温下而衬底被插入，导致衬底上存在温度梯度。 一旦基板完全插入退火室，温度梯度可能仍然存在。 通过补偿跨越衬底的温度梯度，衬底可以均匀退火。