Semiconductor device and method of fabricating the same
    2.
    发明授权
    Semiconductor device and method of fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US09461148B2

    公开(公告)日:2016-10-04

    申请号:US13799291

    申请日:2013-03-13

    IPC分类号: H01L21/8234 H01L29/66

    CPC分类号: H01L29/66795

    摘要: A method of fabricating a semiconductor device is described. The method of fabricating a semiconductor device comprises providing a fin formed to protrude from a substrate and a plurality of gate electrodes formed on the fin to intersect the fin; forming first recesses in the fin on at least one side of the respective gate electrodes; forming an oxide layer on the surfaces of the first recesses; and expanding the first recesses into second recesses by removing the oxide layer. Related devices are also disclosed.

    摘要翻译: 描述制造半导体器件的方法。 制造半导体器件的方法包括提供形成为从基板突出的翅片和形成在鳍片上的与栅极相交的多个栅电极; 在所述翅片的至少一个侧面上形成第一凹部; 在所述第一凹部的表面上形成氧化物层; 并且通过去除氧化物层将第一凹槽膨胀成第二凹陷。 还公开了相关设备。

    Multilayer ceramic electronic component
    4.
    发明授权
    Multilayer ceramic electronic component 有权
    多层陶瓷电子元件

    公开(公告)号:US08792223B2

    公开(公告)日:2014-07-29

    申请号:US13620614

    申请日:2012-09-14

    IPC分类号: H01G4/005 H01G4/00

    CPC分类号: H01G4/12

    摘要: There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 μm or less, the external electrodes include a conductive metal and glass portions, and when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls≦10 μm is satisfied.

    摘要翻译: 提供了一种多层陶瓷电子部件,其包括:陶瓷体,其包括电介质层; 设置在所述陶瓷体内的多个内部电极,其彼此面对,具有介电层; 电连接到所述多个内部电极的外部电极,其中所述陶瓷体包括对应于电容形成部分的有源层和形成在所述有源层的上表面和下表面中的至少一个上的覆盖层,并且对应于 非电容形成部,覆盖层的平均厚度为15μm以下,外部电极包括导电性金属和玻璃部,当外部电极的长度方向的玻璃部的平均长度为Ls ,Ls≦̸满足10μm。

    Preparation Method of Low Temperature Sintering Active Electrode Paste for Dye Sensitized Solar Cell
    5.
    发明申请
    Preparation Method of Low Temperature Sintering Active Electrode Paste for Dye Sensitized Solar Cell 有权
    用于染料敏化太阳能电池的低温烧结活性电极浆料的制备方法

    公开(公告)号:US20130333757A1

    公开(公告)日:2013-12-19

    申请号:US13788912

    申请日:2013-03-07

    IPC分类号: H01G9/20

    摘要: The present invention relates to a method for preparing titanium dioxide paste for dye sensitized solar cell, and more specifically a method for preparing titanium dioxide paste fir dye sensitized solar cell, which is curable at a low temperature and is able to form a uniform coating layer and exhibits relatively high energy conversion efficiency. The present invention also relates to a method for preparing low temperature curable paste which requires no separate dye adsorption process or can improve energy conversion efficiency by adding dye or metal precursor in advance.

    摘要翻译: 本发明涉及一种制备用于染料敏化太阳能电池的二氧化钛糊料的方法,更具体地说,一种制备二氧化钛糊冷杉染料敏化太阳能电池的方法,其可在低温下固化并且能够形成均匀的涂层 并表现出较高的能量转换效率。 本发明还涉及一种制备低温可固化糊剂的方法,其不需要单独的染料吸附方法,或者可以通过预先加入染料或金属前体来提高能量转换效率。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    6.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号:US20130120898A1

    公开(公告)日:2013-05-16

    申请号:US13572407

    申请日:2012-08-10

    IPC分类号: H01G4/30 H01B1/02 H01G13/00

    摘要: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.

    摘要翻译: 提供了一种多层陶瓷电子部件及其制造方法。 多层陶瓷电子部件包括:陶瓷体,其包括电介质层; 第一和第二内部电极设置在陶瓷体内以彼此面对,同时介于其间的电介质层; 以及第一外部电极,电连接到形成在第一外部电极上的第一和第二内部电极和第二外部电极,其中第一和第二外部电极包括导电金属和玻璃,并且当第二外部电极被分成三个相等部分 在厚度方向上,中央部分的玻璃的面积相对于中央部的面积为30〜80%。 因此,提高了芯片的密封性,可以实现具有提高的可靠性的多层陶瓷电子部件。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME
    7.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20130050896A1

    公开(公告)日:2013-02-28

    申请号:US13569738

    申请日:2012-08-08

    IPC分类号: H01G4/12

    摘要: There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.

    摘要翻译: 提供了一种多层陶瓷电子部件及其制造方法。 多层陶瓷电子部件包括:陶瓷主体,其包括电介质层; 第一和第二内部电极,其设置成在陶瓷主体内彼此面对; 以及第一外部电极和第二外部电极,其中所述第一和第二外部电极包括导电金属和玻璃,并且当所述第一外部电极和第二外部电极中的至少一个在厚度方向上被分成三个相等的部分时, 的中心部分的玻璃的总面积的35%至80%。 具有提高的可靠性的多层陶瓷电子部件可以通过提高芯片气密性来实现。

    FIELD EMISSION DISPLAY DEVICE
    9.
    发明申请
    FIELD EMISSION DISPLAY DEVICE 失效
    场发射显示装置

    公开(公告)号:US20110285272A1

    公开(公告)日:2011-11-24

    申请号:US12786398

    申请日:2010-05-24

    IPC分类号: H01J1/62

    摘要: A field emission display device (FED) is provided. The FED includes a first substrate, a phosphor layer being in contact with the first substrate, and an anode electrode on the phosphor layer. The FED further includes a second substrate facing the first substrate and including a cathode electrode and an emitter disposed toward the anode electrode.

    摘要翻译: 提供场致发射显示装置(FED)。 FED包括第一衬底,与第一衬底接触的荧光体层和磷光体层上的阳极电极。 FED还包括面向第一基板的第二基板,并且包括阴极电极和朝向阳极电极设置的发射极。

    Storage electrode of a capacitor and a method of forming the same
    10.
    发明授权
    Storage electrode of a capacitor and a method of forming the same 有权
    电容器的存储电极及其形成方法

    公开(公告)号:US07723182B2

    公开(公告)日:2010-05-25

    申请号:US11291798

    申请日:2005-11-30

    IPC分类号: H01L21/8242

    CPC分类号: H01L28/91 H01L27/10852

    摘要: In an embodiment, a storage electrode of a capacitor in a semiconductor device is resistant to inadvertent etching during its manufacturing processes. A method of forming the storage electrode of the capacitor is described. The storage electrode of the capacitor may include a first metal layer electrically connected with a source region of a transistor through a contact plug penetrating an insulating layer on a semiconductor substrate. A polysilicon layer may then be formed on the first metal layer. A second metal layer is formed on the polysilicon layer.

    摘要翻译: 在一个实施例中,半导体器件中的电容器的存储电极在其制造工艺期间耐受无意的蚀刻。 描述形成电容器的存储电极的方法。 电容器的存储电极可以包括通过穿过半导体衬底上的绝缘层的接触插塞与晶体管的源极区域电连接的第一金属层。 然后可以在第一金属层上形成多晶硅层。 在多晶硅层上形成第二金属层。