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1.发明申请System, method and program for determining a qualified support team to handle a security violation within a computer 审中-公开用于确定合格支持小组来处理计算机内的安全违规的系统，方法和程序公开(公告)号：US20070061874A1
公开(公告)日：2007-03-15
申请号：US11227806
申请日：2005-09-15
申请人： Gregory Coppola , Jeffrey Schaefer , Brian Singer
发明人： Gregory Coppola , Jeffrey Schaefer , Brian Singer
IPC分类号： H04L9/32
摘要： Computer system, method and program for determining which support team to assign a security problem. Two or more of the following determinations are made: (a) determining if the support team has responsibility for a security policy for a computer system in which the security problem resides, (b) determining if the support team has responsibility for a subsystem in which the security problem resides within the computer system, (c) determining if the support team has responsibility for a TCP or UDP port for an application associated with the security problem within the computer system, and (d) determining if the support team has responsibility for a type of the security problem by checking for predetermined key words or phrase within a text description of the security problem. The security problem can be a security policy violation or a network based vulnerability.
摘要翻译： 用于确定哪个支持小组分配安全问题的计算机系统，方法和程序。 做出以下两个或更多的确定：（a）确定支持团队是否负责安全问题所在的计算机系统的安全策略，（b）确定支持团队是否对其中的子系统负责 安全问题存在于计算机系统内，（c）确定支持团队是否对与计算机系统内的安全问题相关联的应用程序的TCP或UDP端口负责，以及（d）确定支持团队是否负责 通过检查安全问题的文本描述中的预定关键词或短语来确定安全问题的一种类型。 安全问题可能是违反安全策略或基于网络的漏洞。
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2.发明授权Materials and structure for a high reliability bga connection between LTCC and PB boards 有权LTCC和PB板之间的高可靠性bga连接的材料和结构公开(公告)号：US06800815B1
公开(公告)日：2004-10-05
申请号：US10051984
申请日：2002-01-15
IPC分类号： H05K111
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49822 , H01L2224/0401 , H01L2224/05571 , H01L2224/10126 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/113 , H05K3/248 , H05K3/3452 , H05K3/3457 , H05K3/4061 , H05K2201/017 , H05K2201/035 , H05K2201/09909 , Y10T29/49149 , Y10T29/49165 , H01L2924/00012 , H01L2224/05552
摘要： A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers is a via that passes through the ceramic layer. A contact pad is formed on a surface of the ceramic layer. A barrier cap is formed between the via and the contact pad. A dielectric ring covers a peripheral portion of the contact pad and an adjacent portion of the dielectric material layer surface immediately surrounding the contact pad, such that any solder that is applied to the contact does not contact the peripheral portion of the contact pad or the ceramic material.
摘要翻译： 一种陶瓷电路结构，包括多个陶瓷层和至少一个嵌入在所述多个陶瓷层内的电子部件。 在第一陶瓷层之中的是通过陶瓷层的通孔。 在陶瓷层的表面上形成接触垫。 在通孔和接触垫之间形成阻挡帽。 介电环覆盖接触焊盘的周边部分和电介质材料层表面的相邻部分，其紧邻围绕接触焊盘，使得施加到接触件的任何焊料不接触接触焊盘或陶瓷的周边部分 材料。
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3.发明授权Radar-field-of-view enhancement method and apparatus for matching field-of-view to desired detection zone 有权雷达视野增强方法和装置，用于将视野匹配到所需的检测区域公开(公告)号：US06509863B2
公开(公告)日：2003-01-21
申请号：US10207328
申请日：2002-07-29
IPC分类号： G01S1393
CPC分类号： G01S13/87 , G01S13/931 , G01S2013/9332 , G01S2013/9385
摘要： A radar field-of-view enhancement method particularly adapted for vehicle radar detection systems having a specified detection zone. In accordance with the invention, a pair of discrete radar beams are employed having differing arc widths. Return signals from the discrete beams are compared and related to the area of a desired detection zone. This approach increases the reliability of detection in the detection zone while minimizing false alarms and missed detection areas. The beams are alternately switched on using discrete sources or by implementing a discrete phase shifting element interposed between the sources.
摘要翻译： 一种特别适用于具有指定检测区域的车辆雷达检测系统的雷达视野增强方法。 根据本发明，采用具有不同电弧宽度的一对离散雷达波束。 将离散光束的返回信号进行比较，并与所需检测区域的区域相关。 这种方法提高了检测区域的检测可靠性，同时最大限度地减少了错误的报警和错误的检测区域。 使用离散源或通过实现插入在源之间的离散相移元件来交替地接通光束。
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公开(公告)号：US06175162B1
公开(公告)日：2001-01-16
申请号：US09391854
申请日：1999-09-08
IPC分类号： H01L2328
CPC分类号： H01L23/562 , H01L21/56 , H01L23/3157 , H01L23/544 , H01L2223/54473 , H01L2223/5448 , H01L2224/16 , H01L2224/274 , H01L2924/01068
摘要： Disclosed is a packaged integrated circuit device. The device includes a die having a plurality of electrical contacts on a first surface of the die and a protective film adhered directly to a back surface of the die, the protective film being thick enough to allow laser marking of the protective film without the laser penetrating to the die. In one preferred embodiment, the protective film of the device is a thick film formed by screen printing. In a preferred embodiment, the protective film has a thickness of between about 1.5 and 5 mils. Also, disclosed is a method of fabricating a semiconductor wafer having a wafer substrate with a top surface and a bottom surface and a plurality of dies. In this embodiment, the method includes providing a plurality of dies on the top surface of the wafer substrate, applying a thick film over the bottom surface of the wafer substrate, adhering the thick film to a mounting tape that is not ultraviolet curable, and dicing the wafer to separate the dies. The thick film reduces chipping along edges of the separated dies.
摘要翻译： 公开了一种封装的集成电路器件。 该装置包括在模具的第一表面上具有多个电触头的模具和直接粘附在模具背面上的保护膜，保护膜足够厚以允许保护膜的激光标记而不激光穿透 去死 在一个优选实施例中，装置的保护膜是通过丝网印刷形成的厚膜。 在优选的实施方案中，保护膜的厚度为约1.5至5密耳。 此外，公开了一种制造具有具有顶表面和底表面以及多个管芯的晶片衬底的半导体晶片的方法。 在本实施例中，该方法包括在晶片衬底的顶表面上提供多个管芯，在晶片衬底的底表面上施加厚膜，将厚膜粘附到不可紫外线固化的安装带上， 晶片分离模具。 厚膜沿着分离的模具的边缘减小了切屑。
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5.发明授权Materials and structure for a high reliability BGA connection between LTCC and PB boards 有权LTCC和PB板之间的高可靠性BGA连接的材料和结构公开(公告)号：US07287323B1
公开(公告)日：2007-10-30
申请号：US10837015
申请日：2004-04-30
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49822 , H01L2224/0401 , H01L2224/05571 , H01L2224/10126 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/113 , H05K3/248 , H05K3/3452 , H05K3/3457 , H05K3/4061 , H05K2201/017 , H05K2201/035 , H05K2201/09909 , Y10T29/49149 , Y10T29/49165 , H01L2924/00012 , H01L2224/05552
摘要： A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers is a via that passes through the ceramic layer. A contact pad is formed on a surface of the ceramic layer. A barrier cap is formed between the via and the contact pad. A dielectric ring covers a peripheral portion of the contact pad and an adjacent portion of the dielectric material layer surface immediately surrounding the contact pad, such that any solder that is applied to the contact does not contact the peripheral portion of the contact pad or the ceramic material.
摘要翻译： 一种陶瓷电路结构，包括多个陶瓷层和至少一个嵌入在所述多个陶瓷层内的电子部件。 在第一陶瓷层之中的是通过陶瓷层的通孔。 在陶瓷层的表面上形成接触垫。 在通孔和接触垫之间形成阻挡帽。 介电环覆盖接触焊盘的周边部分和电介质材料层表面的相邻部分，其紧邻围绕接触焊盘，使得施加到接触件的任何焊料不接触接触焊盘或陶瓷的周边部分 材料。
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公开(公告)号：USRE38789E1
公开(公告)日：2005-09-06
申请号：US10022683
申请日：2001-12-17
IPC分类号： H01L21/56 , H01L23/00 , H01L23/31 , H01L23/544 , H01L23/58
CPC分类号： H01L23/562 , H01L21/56 , H01L23/3157 , H01L23/544 , H01L2223/54473 , H01L2223/5448 , H01L2224/16 , H01L2224/274 , H01L2924/01068
摘要： Disclosed is a packaged integrated circuit device. The device includes a die having a plurality of electrical contacts on a first surface of the die and a protective film adhered directly to a back surface of the die, the protective film being thick enough to allow laser marking of the protective film without the laser penetrating to the die. In one preferred embodiment, the protective film of the device is a thick film formed by screen printing. In a preferred embodiment, the protective film has a thickness of between about 1.5 and 5 mils. Also, disclosed is a method of fabricating a semiconductor wafer having a wafer substrate with a top surface and a bottom surface and a plurality of dies. In this embodiment, the method includes providing a plurality of dies on the top surface of the wafer substrate, applying a thick film over the bottom surface of the wafer substrate, adhering the thick film to a mounting tape that is not ultraviolet curable, and dicing the wafer to separate the dies. The thick film reduces chipping along edges of the separated dies.
摘要翻译： 公开了一种封装的集成电路器件。 该装置包括在模具的第一表面上具有多个电触头的模具和直接粘附在模具背面上的保护膜，保护膜足够厚以允许保护膜的激光标记而不激光穿透 去死 在一个优选实施例中，装置的保护膜是通过丝网印刷形成的厚膜。 在优选的实施方案中，保护膜的厚度为约1.5至5密耳。 此外，公开了一种制造具有具有顶表面和底表面以及多个管芯的晶片衬底的半导体晶片的方法。 在本实施例中，该方法包括在晶片衬底的顶表面上提供多个管芯，在晶片衬底的底表面上施加厚膜，将厚膜粘附到不可紫外线固化的安装带上， 晶片分开模具。 厚膜沿着分离的模具的边缘减小了切屑。
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7.发明授权Radar field-of-view enhancement method and apparatus for matching field-of-view to desired detection zone 有权雷达视野增强方法和用于将视野匹配到所需检测区域的装置公开(公告)号：US06452534B1
公开(公告)日：2002-09-17
申请号：US09806964
申请日：2001-04-06
IPC分类号： G01S1393
CPC分类号： G01S13/87 , G01S13/931 , G01S2013/9332 , G01S2013/9385
摘要： A radar field-of-view enhancement method particularly adapted for vehicle radar detection systems having a specified detection zone. In accordance with the invention, a pair of discrete radar beams are employed having differing arc widths. Return signals from the discrete beams are compared and related to the area of a desired detection zone. This approach increases the reliability of detection in the detection zone while minimizing false alarms and missed detection areas. The beams are alternately switched on using discrete sources or by implementing a discrete phase shifting element interposed between the sources.
摘要翻译： 一种特别适用于具有指定检测区域的车辆雷达检测系统的雷达视野增强方法。 根据本发明，采用具有不同电弧宽度的一对离散雷达波束。 将离散光束的返回信号进行比较，并与所需检测区域的区域相关。 这种方法提高了检测区域的检测可靠性，同时最大限度地减少了错误的报警和错误的检测区域。 使用离散源或通过实现插入在源之间的离散相移元件来交替地接通光束。
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公开(公告)号：US6075290A
公开(公告)日：2000-06-13
申请号：US31167
申请日：1998-02-26
IPC分类号： H01L23/31 , H01L23/485 , H01L23/48
CPC分类号： H01L23/3171 , H01L23/3192 , H01L2224/0401 , H01L2224/05022 , H01L2224/05558 , H01L2224/05572 , H01L2224/13022 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L24/05 , H01L24/13 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/13091 , H01L2924/14
摘要： Disclosed is an IC package. The IC package includes a die having a plurality of conductive pads. A passivation layer is formed over the conductive pads such that the passivation layer has a plurality of passivation vias. Each passivation via is positioned over an associated one of the conductive pads. A resilient protective layer is formed over the passivation layer. The resilient protective layer has a plurality of resilient vias, wherein each resilient via is associated with an associated passivation via. A plurality of under bump pads are in electrical contact with the conductive pads, and each under bump pad is associated with one of the resilient vias. A plurality of contact bumps are formed over the plurality of under bump pads such that each one of the contact bumps is electrically coupled with a selected one of the under bump pads and such that each contact bump is electrically coupled with a selected one of the conductive pads. The resilient protective layer is arranged to absorb stresses introduced at the contact bumps when the IC package is attached to an external substrate; the contact bumps are formed from a material that facilitates absorption of stresses by the resilient protective layer, and the resilient protective layer is further arranged to protect the die. In one preferred embodiment, each under bump pad includes a lip that extends over a portion of the resilient layer. In another preferred embodiment, the contact bumps are formed from a eutectic tin-lead alloy. In another embodiment, a circuit board is disclosed. The circuit board includes a substrate having a plurality of board contacts and the IC package as recited above. In this embodiment, the IC package is attached to the substrate such that each of the contact bumps is coupled with an associated one of the board contacts. In a preferred embodiment, the resilient protective layer of the IC package absorbs stresses introduced at the contact bumps such that an underfill layer is not required between the IC package and the substrate.
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公开(公告)号：US6023094A
公开(公告)日：2000-02-08
申请号：US6759
申请日：1998-01-14
IPC分类号： H01L21/56 , H01L23/00 , H01L23/31 , H01L23/544 , H01L23/58
CPC分类号： H01L23/562 , H01L21/56 , H01L23/3157 , H01L23/544 , H01L2223/54473 , H01L2223/5448 , H01L2224/16 , H01L2224/274 , H01L2924/01068
摘要： Disclosed is a packaged integrated circuit device. The device includes a die having a plurality of electrical contacts on a first surface of the die and a protective film adhered directly to a back surface of the die, the protective film being thick enough to allow laser marking of the protective film without the laser penetrating to the die. In one preferred embodiment, the protective film of the device is a thick film formed by screen printing. In a preferred embodiment, the protective film has a thickness of between about 1.5 and 5 mils. Also, disclosed is a method of fabricating a semiconductor wafer having a wafer substrate with a top surface and a bottom surface and a plurality of dies. In this embodiment, the method includes providing a plurality of dies on the top surface of the wafer substrate, applying a thick film over the bottom surface of the wafer substrate, adhering the thick film to a mounting tape that is not ultraviolet curable, and dicing the wafer to separate the dies. The thick film reduces chipping along edges of the separated dies.
摘要翻译： 公开了一种封装的集成电路器件。 该装置包括在模具的第一表面上具有多个电触头的模具和直接粘附在模具背面上的保护膜，保护膜足够厚以允许保护膜的激光标记而不激光穿透 去死 在一个优选实施例中，装置的保护膜是通过丝网印刷形成的厚膜。 在优选的实施方案中，保护膜的厚度为约1.5至5密耳。 此外，公开了一种制造具有具有顶表面和底表面以及多个管芯的晶片衬底的半导体晶片的方法。 在本实施例中，该方法包括在晶片衬底的顶表面上提供多个管芯，在晶片衬底的底表面上施加厚膜，将厚膜粘附到不可紫外线固化的安装带上， 晶片分离模具。 厚膜沿着分离的模具的边缘减小了切屑。
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