公开(公告)号：US06429537B2

公开(公告)日：2002-08-06

申请号：US09816931

申请日：2001-03-23

申请人： Christian Hauser ,  Martin Neumayer ,  Johann Winderl ,  Achim Neu ,  Martin Reiss

发明人： Christian Hauser ,  Martin Neumayer ,  Johann Winderl ,  Achim Neu ,  Martin Reiss

IPC分类号： H01L2331

CPC分类号： H01L23/3107 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor component includes a semiconductor chip having contact pads on its main face, and a wiring foil, in which are recesses for the contact pads, applied to the main face. The foil has conductor tracks on a side facing away from the main side. The conductor tracks connect the contact pads to solder contacts. The contact pads located in the recess are electrically connected via wire connections to adjacent conductor track ends. Each wire connection is surrounded with a sealing compound of a first and a second layer. A method for manufacturing a semiconductor component includes applying wiring foil to a main side of the chip, producing the wire connection between contact pads and adjacent conductor track ends, applying sealing compound to locations on the recess to completely cover the wire connection with the sealing compound, and only curing the surface of the sealing compound.

摘要翻译： 半导体部件包括在其主面上具有接触焊盘的半导体芯片，以及配置在主面上的用于接触焊盘的凹部的布线箔。 箔片在远离主体侧的一侧具有导体轨迹。 导体轨道将接触焊盘连接到焊接触点。 位于凹槽中的接触垫通过导线连接电连接到相邻的导体轨道端。 每个电线连接被第一和第二层的密封化合物包围。 一种制造半导体部件的方法，包括将布线箔施加到芯片的主侧，产生接触焊盘和相邻导体导轨端之间的导线连接，将密封化合物施加到凹部上的位置，以完全覆盖与密封化合物的电线连接 只能固化密封剂的表面。

公开(公告)号：US07036216B2

公开(公告)日：2006-05-02

申请号：US10252453

申请日：2002-09-23

申请人： Christian Hauser ,  Martin Reiss ,  Johann Winderl

发明人： Christian Hauser ,  Martin Reiss ,  Johann Winderl

IPC分类号： H05K3/34

CPC分类号： H01L24/80 ,  H01L23/3107 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/53174

摘要： An electrically conductive connection is produced between a chip and an external wiring configuration that is kept at a distance from the chip by spacers. Electrically conductive contact material is introduced into recesses in the external wiring configuration in order to produce the electrically conductive connection. This can be carried out economically, and allows a mechanically very robust electrical connection from the chip pads to the external wiring planes.

公开(公告)号：US07008493B2

公开(公告)日：2006-03-07

申请号：US10685065

申请日：2003-10-14

申请人： Johann Winderl ,  Christian Hauser ,  Martin Reiss

发明人： Johann Winderl ,  Christian Hauser ,  Martin Reiss

IPC分类号： B32B21/60

CPC分类号： H01L24/80 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A method is described for applying an integrated circuit to a carrier element. In which a curable compensating layer of initially paste-like consistency is coated substantially with full coverage onto a lower contact area of the integrated circuit. Whereupon the integrated circuit is joined together, by the compensating layer, with the carrier element after a relative alignment in order then to produce an electrical connection between the integrated circuit and conductor tracks of the carrier element via electrical lines surmounting the thickness of the compensating layer. Whereupon the compensating layer is cured resulting in an increased volume of the compensating layer.

摘要翻译： 描述了一种将集成电路应用于载体元件的方法。 其中初始糊状稠度的可固化补偿层基本上以完全覆盖涂覆在集成电路的下接触区域上。 于是，集成电路通过补偿层与载体元件在相对对准之后连接在一起，以便通过经过补偿层的厚度的电线产生载体元件的集成电路和导体轨迹之间的电连接 。 于是补偿层被固化，导致补偿层的体积增加。

公开(公告)号：US06525416B2

公开(公告)日：2003-02-25

申请号：US09970979

申请日：2001-10-04

申请人： Christian Hauser ,  Johann Winderl ,  Martin Reiss

发明人： Christian Hauser ,  Johann Winderl ,  Martin Reiss

IPC分类号： H01L2322

CPC分类号： H01L23/057 ,  B29C33/06 ,  H01L23/08 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device is described that has a sheet strip for packaging bonding wire connections of the electronic device and a method for producing it. To that end, the sheet strip, has at least two preformed, opposite edge regions which cover the edge regions of the bonding channel in an overlapping manner. Furthermore, the sheet strip has a preformed central region situated between the edge regions, which central region has a bulge and thickened portion and has two convexly curved contour lines in cross section.

公开(公告)号：US06664648B2

公开(公告)日：2003-12-16

申请号：US09809860

申请日：2001-03-16

申请人： Johann Winderl ,  Christian Hauser ,  Martin Reiss

发明人： Johann Winderl ,  Christian Hauser ,  Martin Reiss

IPC分类号： H01L2329

CPC分类号： H01L24/80 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A method and an apparatus are described for applying an integrated circuit to a carrier element. In which a curable compensating layer of initially paste-like consistency is coated substantially with full coverage onto a lower contact area of the integrated circuit. Whereupon the integrated circuit is joined together, by the compensating layer, with the carrier element after a relative alignment in order then to produce an electrical connection between the integrated circuit and conductor tracks of the carrier element via electrical lines surmounting the thickness of the compensating layer. Whereupon the compensating layer is cured resulting in an increased volume of the compensating layer.

摘要翻译： 描述了一种将集成电路应用于载体元件的方法和装置。 其中初始糊状稠度的可固化补偿层基本上以完全覆盖涂覆在集成电路的下接触区域上。 于是，集成电路通过补偿层与载体元件在相对对准之后连接在一起，以便通过经过补偿层的厚度的电线产生载体元件的集成电路和导体轨迹之间的电连接 。 于是补偿层被固化，导致补偿层的体积增加。

公开(公告)号：US06614100B1

公开(公告)日：2003-09-02

申请号：US09220745

申请日：1998-12-23

申请人： Christian Hauser ,  Helge Schmidt ,  Johann Winderl

发明人： Christian Hauser ,  Helge Schmidt ,  Johann Winderl

IPC分类号： H05K720

CPC分类号： G06K19/07724 ,  G06K19/07743 ,  G06K19/07745 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00

摘要： The lead frame has a spring element, which can be compressed during the injection molding of the package by an injection mold. The resultant resilience has the effect that a contact surface of the lead is pressed against an inside wall of the injection mold. The biasing of the contact surface against the inside wall prevents polymer flash from forming on the contact surface. Also, the spring element fixes the lead during the injection operation and anchors the lead in the completed package. Hold-down pins within the injection mold are thus obviated.

摘要翻译： 引线框架具有弹簧元件，其可以通过注射模具在包装的注射成型期间被压缩。 所得到的弹性具有将引线的接触表面压在注射模具的内壁上的作用。 接触表面抵靠内壁的偏置防止聚合物闪光在接触表面上形成。 此外，弹簧元件在注射操作期间固定引线，并将引线固定在完成的封装中。 因此避免了注射模具内的压紧销。

公开(公告)号：US06521988B2

公开(公告)日：2003-02-18

申请号：US09816929

申请日：2001-03-23

申请人： Christian Hauser ,  Johann Winderl ,  Jens Pohl

发明人： Christian Hauser ,  Johann Winderl ,  Jens Pohl

IPC分类号： H01L2348

CPC分类号： H01L24/97 ,  H01L21/56 ,  H01L21/561 ,  H01L23/24 ,  H01L2924/01005 ,  H01L2924/01082

摘要： The invention relates to a device and a method for packaging electronic components (11) having semiconductor chips (5) by means of a mounting frame (1), which is additionally provided with a plastic grid (6) that is disposed on a plastic intermediate substrate (2), which surrounds each semiconductor chip (5) in framelike fashion and which for packaging the plurality of semiconductor chips (5) with a plastic casting composition (7) between semiconductor chips (5) and the plastic grid (6).

摘要翻译： 本发明涉及一种用于通过安装框架（1）封装具有半导体芯片（5）的电子部件（11）的装置和方法，该安装框架（1）另外设置有设置在塑料中间件上的塑料格栅（6） 基板（2），其以框架方式围绕每个半导体芯片（5），并且用于在半导体芯片（5）和塑料栅格（6）之间用塑料铸造组合物（7）封装多个半导体芯片（5）。

公开(公告)号：US06906928B2

公开(公告)日：2005-06-14

申请号：US10114794

申请日：2002-04-02

申请人： Christian Hauser ,  Martin Reiss

发明人： Christian Hauser ,  Martin Reiss

IPC分类号： H01L23/10 ,  H01L23/31 ,  H01L23/498 ,  H05K1/18

CPC分类号： H01L23/10 ,  H01L23/3114 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753

摘要： The electronic component has a semiconductor chip mounted to a wiring board. The chip is bonded to the wiring board with adhesive strips that leave free a through-cutout, an additional cutout, and separating joints. The additional cutout provides for a plastic reservoir from which the separating joint between the adhesive strips is filled with plastic material.

摘要翻译： 电子部件具有安装到布线板的半导体芯片。 芯片通过粘合带粘合到布线板上，该条带留下空缺的通孔，另外的切口和分离接头。 附加的切口提供了塑料储存器，粘合剂条之间的分离接头从该塑料储存器填充有塑料材料。

公开(公告)号：US20110077843A1

公开(公告)日：2011-03-31

申请号：US12993841

申请日：2009-03-23

申请人： Christian Hauser

发明人： Christian Hauser

IPC分类号： F02D41/26

CPC分类号： F02D41/008 ,  F02D41/2432 ,  F02D41/2467 ,  F02D2041/1423

摘要： A method for the injector-individual adaption of the injection time of motor vehicles is based on linking the IIC method and the MFMA method. Before starting to drive, the IIC method is carried out, and while driving MFMA measurements are carried out. The measurement points obtained are used as subsequent measurement points for the IIC function. Thus injector-individual characteristic fields can be determined, in which deviations due to manufacturing and also aging and wear of the components during the service life are considered.

摘要翻译： 一种注射器单独适应机动车辆喷射时间的方法是基于连接IIC方法和MFMA方法。 在开始驱动之前，执行IIC方法，并且在驱动MFMA测量时进行。 获得的测量点用作IIC功能的后续测量点。 因此，可以确定注射器单独的特征场，其中考虑到在使用寿命期间由于制造而导致的偏差以及部件的老化和磨损。

公开(公告)号：US07709996B2

公开(公告)日：2010-05-04

申请号：US11916594

申请日：2006-06-06

申请人： Christian Hauser ,  Klaus Kiel ,  Manfred Kramel ,  Heinz Lixl ,  Gabriel Marzahn ,  Walter Schrod

发明人： Christian Hauser ,  Klaus Kiel ,  Manfred Kramel ,  Heinz Lixl ,  Gabriel Marzahn ,  Walter Schrod

IPC分类号： H01L41/09

CPC分类号： H01L41/042 ,  F02D41/2096 ,  F02D2041/2034 ,  H02N2/067

摘要： A tendency of the controlled load to oscillate when controlling a capacitive load can be avoided according to a piezo actuator for an injection valve of an internal combustion engine, having charging and discharging processes for charging and discharging the capacitive load by means of a load current, each loading process being effected by chronological partial load current pulses according to chronological partial charging capacity pulses (p1, p2, . . . pn), wherein the envelope (E) of the partial charging capacity pulses (p1, p2, . . . pn), during the loading process, increases in a strictly monotonous manner in an initial phase, and the slope of the envelope decreases in a monotonous manner.

摘要翻译： 根据用于内燃机的喷射阀的压电致动器，通过负载电流对容性负载进行充电和放电的充放电过程，可以避免控制负载在控制容性负载时振荡的趋势， 每个装载过程根据时间部分充电容量脉冲（p1，p2，...，pn）按时间顺序部分负载电流脉冲进行，其中部分充电容量脉冲（p1，p2，...，pn）的包络 ），在加载过程中，在初始阶段以严格单调的方式增加，并且包络的斜率以单调的方式减小。