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公开(公告)号：US5789815A
公开(公告)日：1998-08-04
申请号：US636483
申请日：1996-04-23
IPC分类号： H01L23/31 , H01L25/065 , H01L23/495 , H01L23/02 , H01L23/34
CPC分类号： H01L23/3121 , H01L25/0652 , H01L2224/16225 , H01L2924/09701 , H01L2924/1433 , H01L2924/3025
摘要： A three dimensional packaging approach reduces the overall footprint for interconnecting multiple semiconductor die. An three-dimensional folded module (10) produces a final package having a footprint size reduced by an approximate factor of four when compared to conventional electronic packaging. The module has a protective covering such as a cap (62) or a sealant (64) as a moisture barrier. Thus, high integration using flexible appendages (15, 25, 35, and 45) attached to a rigid substrate (12) and singularly folded above the substrate (12) results in both a small footprint package and also a light package. A reel-to-reel flex tape (56) assembly provides pre-tested flex boards (16, 26, 36, and 46) resulting in a cost-effective manufacturable package for semiconductor components.
摘要翻译： 三维封装方法减少了用于互连多个半导体管芯的整体占用空间。 与常规电子封装相比，三维折叠模块（10）产生具有减小约四倍的占地面积尺寸的最终包装。 模块具有作为防潮层的保护盖，例如盖（62）或密封剂（64）。 因此，使用附接到刚性基板（12）并且单独地折叠在基板（12）上方的柔性附件（15,25,35和45）的高集成度导致小尺寸封装以及光封装。 卷对卷柔性带（56）组件提供预测试的柔性板（16,26,36和46），从而产生用于半导体部件的成本有效的可制造的封装。
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公开(公告)号：US5892661A
公开(公告)日：1999-04-06
申请号：US741793
申请日：1996-10-31
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077 , H05K1/16 , H01Q1/36
CPC分类号： G06K19/0775 , G06K19/07749 , G06K19/07779 , G06K19/07783
摘要： A smartcard (10) is formed in part by a laminate layer (77). The laminate layer (77) is made up of a plurality of dielectric layers (11,30), insulating layers (45, 50), resistive layers (55), and electrically active structures. The electrically active structures include a capacitive structure (23) which is formed from one of the dielectric layers (11) and an antennae (32) which is made from a conductive layer that is formed into a spiral pattern on the another dielectric layer (30). These layers (11,30, 45, 50, 55) are formed separately and then pressed together to form the laminate layer (77).
摘要翻译： 智能卡（10）部分由层压层（77）形成。 层压层（77）由多个电介质层（11,30），绝缘层（45,50），电阻层（55）和电活性结构构成。 电活性结构包括由电介质层（11）之一形成的电容结构（23）和由在另一电介质层（30）上形成为螺旋图案的导电层制成的天线（32） ）。 这些层（11,30,45,50,55）分别形成，然后压在一起以形成层压层（77）。
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3.发明授权Laser etch-back process for forming a metal feature on a non-metal substrate 失效用于在非金属衬底上形成金属特征的激光蚀刻工艺
公开(公告)号：US5221426A
公开(公告)日：1993-06-22
申请号：US799804
申请日：1991-11-29
CPC分类号： H01L21/32131 , H05K3/027 , H05K3/108 , H05K2201/0154 , H05K2201/0317 , H05K2203/0508 , H05K2203/0597 , H05K3/062 , H05K3/388 , H05K3/4644 , Y10S438/94
摘要： An improved laser etch-back process forms a metal feature on an area of a polymeric or other non-metallic substrate. The process comprises forming a metal layer on the area that includes a first, relatively thick section, and a second, relatively thin section. Thereafter, the metal layer is uniformly irradiated with a laser pulse, but not to vaporize metal from the thick section. Thus, the laser pulse selectively etches the thin section to remove the metal and expose the substrate, without disturbing the thick section, which forms the desired metal feature.
摘要翻译： 改进的激光蚀刻工艺在聚合物或其它非金属基底的区域上形成金属特征。 该方法包括在包括第一相对厚的部分和第二较薄的部分的区域上形成金属层。 此后，用激光脉冲均匀地照射金属层，但不从厚部分蒸发金属。 因此，激光脉冲选择性地蚀刻薄部分以去除金属并暴露衬底，而不会干扰形成所需金属特征的厚部分。
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公开(公告)号：US5816478A
公开(公告)日：1998-10-06
申请号：US465488
申请日：1995-06-05
CPC分类号： B23K1/20 , B23K2201/40 , H01L2224/81193 , H01L2224/81385 , H05K3/244 , H05K3/3436
摘要： A method for flip-chip bonding of two electronic components (27,28) does not use a flux material. A substrate (13) of one electronic component (28) is roughened during processing to provide an improved adhesive surface for a solder ball (12). The roughened pattern is replicated by additional conductive layers formed over the substrate or in an alternate embodiment may be formed on one of the intermediary or top conductive layers. Tacking pressure is applied to the two components so the solder ball (12) will be affixed to the roughened surface and provide a temporary bond. This bond ensures the surfaces of the two electrical components remain in contact with each other during reflow of the solder ball (12) to form a permanent bond.
摘要翻译： 用于两个电子部件（27,28）的倒装芯片接合的方法不使用焊剂材料。 一个电子部件（28）的基板（13）在加工期间被粗糙化，以提供用于焊球（12）的改进的粘合剂表面。 粗糙图案由在衬底上形成的附加导电层复制，或者在替代实施例中可以形成在中间导电层或顶层导电层之一上。 对两个部件施加粘合压力，使得焊球（12）将固定到粗糙表面并提供临时粘合。 该焊接确保两个电气部件的表面在焊球（12）的回流期间保持彼此接触以形成永久接合。
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公开(公告)号：US5650640A
公开(公告)日：1997-07-22
申请号：US417360
申请日：1995-04-05
IPC分类号： H05B33/06 , H01L23/28 , H01L27/32 , H01L51/50 , H05B33/12 , H01L27/15 , H01L33/00 , H01L23/48
CPC分类号： H01L27/3288 , H01L51/5012 , H01L51/524 , H01L51/5243 , H01L51/5253 , H01L2224/48091 , H01L2224/48464 , H01L2924/12044 , H01L2924/15311
摘要： An integrated electro-optical package including an electronic circuit mounted on a substrate, first and second groups of leads extending from the circuit through a sealing area and each lead having an end exposed in a first area, transparent conductive strips positioned in the first area and each strip contacting the exposed end of a lead in the first group, an electroluminescent medium positioned on each of the strips and defining LEDs, metallic strips positioned over the electroluminescent medium as a second electrode for each of the LEDs, each metallic strip being in contact with an exposed end of an electrical lead in the second group of leads, and a hermetic seal positioned in sealing contact with the sealing area and hermetically sealing the first area.
摘要翻译： 一种集成电光学封装，包括安装在基板上的电子电路，从电路通过密封区域延伸的第一和第二组引线，每个引线具有暴露在第一区域中的端部，位于第一区域中的透明导电条带， 每个条带接触第一组中的引线的暴露端，定位在每个条上并定义LED的电致发光介质，位于电致发光介质上方的金属条作为每个LED的第二电极，每个金属条接触 在第二组引线中具有电引线的暴露端，以及与密封区域密封接触并密封第一区域的气密密封件。
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公开(公告)号：US4752109A
公开(公告)日：1988-06-21
申请号：US902997
申请日：1986-09-02
CPC分类号： G02B6/4248 , G02B6/4204 , G02B6/4225 , G02B6/4207 , G02B6/4238 , H01S5/02248 , H01S5/02272 , H01S5/02284 , H01S5/02415 , Y10S257/93
摘要： An optoelectronics package 1 comprising, an optical bench 12 along which is defined an optical axis 43, a semiconductor laser 21 along the optical axis 43, a lens 27 focused on the laser 21 and transmitting optical emission from the laser 21 along the optical axis 43, an optical fiber 45 having an optical face 48 aligned with the optical axis 43, and the fiber 45 is secured to the optical bench 12 with a column load applied on the fiber 45.
摘要翻译： 一种光电子封装1，包括：光学台座12，沿光轴43限定光学台座12;沿着光轴43的半导体激光器21;聚焦在激光器21上的透镜27，并沿着光轴43透射来自激光器21的光发射 ，具有与光轴43对准的光学面48的光纤45和光纤45以施加在光纤45上的列负载固定到光学台架12。
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公开(公告)号：US5905750A
公开(公告)日：1999-05-18
申请号：US731424
申请日：1996-10-15
申请人： Michael S. Lebby , Wenbin Jiang , John W. Stafford
发明人： Michael S. Lebby , Wenbin Jiang , John W. Stafford
CPC分类号： H01S5/02296 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L24/73 , H01L2924/181 , H01S5/02228 , H01S5/02244 , H01S5/02276 , H01S5/0683 , H01S5/183
摘要： A semiconductor laser package including a laser chip mounted to an uppermost surface of a leadframe, and a molded structure at least partially encapsulating the laser chip. The laser chip composed of a vertical cavity surface emitting laser and an optional photodetector. The vertical cavity surface emitting laser generating an emission along a path. The molded structure including an optical element positioned a specific distance from an emission aperture of the vertical cavity surface emitting laser. The laser chip and the optical element mounted in precise z-axis alignment from the emission aperture of the vertical cavity surface emitting laser utilizing the uppermost surface of the leadframe as a dimensional reference point.
摘要翻译： 一种半导体激光器封装，包括安装在引线框架的最上表面的激光芯片，以及至少部分地封装激光芯片的模制结构。 激光芯片由垂直腔表面发射激光器和可选的光电检测器组成。 垂直腔表面发射激光器沿着路径产生发射。 模制结构包括位于与垂直腔表面发射激光器的发射孔相距特定距离的光学元件。 激光芯片和光学元件以垂直腔表面发射激光器的发射孔径以准确的z轴对准安装，利用引线框架的最上表面作为尺寸参考点。
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公开(公告)号：US5689279A
公开(公告)日：1997-11-18
申请号：US415286
申请日：1995-04-03
申请人： Ronald J. Nelson , John W. Stafford
发明人： Ronald J. Nelson , John W. Stafford
CPC分类号： G09F9/33 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/09701
摘要： An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the chip. A window frame substrate having a central opening therethrough coextensive with the real image generated by the chip and mounting pads, bump bonded to the pads on the chip. A plurality of driver circuits connected to the light emitting devices through terminals on the window frame substrate. A lens mounted to the substrate over the opening and on a side opposite the chip to magnify the real image and produce an easily viewable virtual image.
摘要翻译： 一种集成的电光学封装，包括形成有大量发光器件阵列的半导体芯片，并配合以产生完整的真实图像。 发光器件被定位成行和列并且连接到与芯片的外边缘相邻的焊盘。 一种窗框基板，其具有与由芯片和安装焊盘产生的实像共同延伸的中心开口，凸块接合到芯片上的焊盘。 多个驱动电路通过窗框基板上的端子连接到发光器件。 透镜在开口上和与芯片相对的一侧安装到基板，以放大实际图像并产生容易观看的虚像。
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公开(公告)号：US4762395A
公开(公告)日：1988-08-09
申请号：US150481
申请日：1988-01-29
IPC分类号： G02B7/02
CPC分类号： G02B7/026
摘要： A lens assembly 26 includes, a lens 27, an optical diaphragm 29 as a convex curved leaf spring, a pedestal 30 spacing the diaphragm 29 from the lens 27, and a holder for mounting the lens assembly 26 in desired position.
摘要翻译： 透镜组件26包括透镜27，作为凸弯曲板簧的光学膜29，将隔膜29与透镜27间隔开的基座30和用于将透镜组件26安装在期望位置的保持器。
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公开(公告)号：US07125176B1
公开(公告)日：2006-10-24
申请号：US10674374
申请日：2003-09-30
申请人： John W. Stafford , George G. Grouch , Irka Zazulak
发明人： John W. Stafford , George G. Grouch , Irka Zazulak
CPC分类号： G02B6/4246 , G02B6/4214 , G02B6/423 , H05K1/0274 , H05K1/056 , H05K3/4641 , H05K2201/068 , H05K2201/09745
摘要： High speed high data interconnect apparatus includes a stiffening plate with optical fiber mounting groove defined on a surface thereof. The apparatus further includes a length of optical fiber mounted in the groove on the surface of the stiffening plate in a longitudinally extending direction generally parallel to the surface of the stiffening plate. A reflecting surface is positioned adjacent one, or both, of the opposed ends of the optical fiber to direct light at an angle of approximately ninety degrees to the optical path. A printed circuit board laminate is used to encase the stiffening plate and the optical fiber and includes a light via for the passage of light reflected by the reflecting surface. Bond pads are formed on a surface of the printed circuit board laminate adjacent the light via for the electrical connection of a light element, e.g. a VCSEL or photodiode, in communication with the light via.
摘要翻译： 高速高数据互连装置包括在其表面上限定有光纤安装槽的加强板。 该装置还包括一段长度的光纤，其沿纵向延伸的方向安装在加强板的表面上的凹槽中，该方向大致平行于加强板的表面。 反射表面邻近光纤的相对端的一个或两个定位，以将光以与光路近似九十度的角度引导。 印刷电路板层叠体用于包围加强板和光纤，并且包括用于使由反射表面反射的光通过的光通孔。 接合焊盘形成在邻近光通孔的印刷电路板层压体的表面上，用于光元件的电连接，例如， 与光通孔连通的VCSEL或光电二极管。
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