公开(公告)号：US08368097B2

公开(公告)日：2013-02-05

申请号：US11826248

申请日：2007-07-13

Applicant: Hyun Jun Kim ,  Chang Hwan Choi ,  Jong Myeon Lee ,  Dong Woohn Kim ,  Won Ha Moon

Inventor： Hyun Jun Kim ,  Chang Hwan Choi ,  Jong Myeon Lee ,  Dong Woohn Kim ,  Won Ha Moon

IPC: H01L33/00

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/1815 ,  H01L2924/00

Abstract: An LED package comprises a frame having a concave portion formed in the center thereof; one or more LED chips mounted on the bottom surface of the concave portion; and a lens filled in the concave portion, the lens having an upper surface formed of continuous prismatic irregularities forming concentric circles.

Abstract translation: LED封装包括在其中心形成有凹部的框架; 安装在凹部的底面上的一个或多个LED芯片; 以及填充在所述凹部中的透镜，所述透镜具有由形成同心圆的连续棱镜不规则形成的上表面。

公开(公告)号：US08226852B2

公开(公告)日：2012-07-24

申请号：US12914042

申请日：2010-10-28

Applicant: Hai Sung Lee ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

Inventor： Hai Sung Lee ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

IPC: C09K11/02 ,  C09K11/08

CPC classification number: C09K11/7749 ,  C09K11/025 ,  H01L33/502 ,  H01L2933/0041

Abstract: The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.

Abstract translation: 本发明涉及一种形成荧光膜的方法及其制造方法。 形成荧光体膜的方法包括在水性溶剂中混合荧光体和透光珠，使得具有第一电荷的纳米尺寸的透光珠吸附在具有第二电荷的荧光体颗粒的表面上。 该方法还包括将从混合步骤获得的荧光体混合物涂覆在要形成荧光膜的区域上，并干燥涂覆的荧光体混合物以形成荧光膜。 本发明还提供一种制造包含形成荧光膜的方法的LED封装的方法。

公开(公告)号：US07994084B2

公开(公告)日：2011-08-09

申请号：US12323840

申请日：2008-11-26

Applicant: Soo Hyun Lyoo ,  Jong Myeon Lee ,  Ho Sung Choo ,  Min Ji Ko ,  Beom Joon Cho ,  Myung Whun Chang

Inventor： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Ho Sung Choo ,  Min Ji Ko ,  Beom Joon Cho ,  Myung Whun Chang

IPC: C04B35/468 ,  H01G4/12

CPC classification number: H01G4/129 ,  B82Y30/00 ,  C04B35/468 ,  C04B2235/3281 ,  C04B2235/3298 ,  C04B2235/365 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/9615 ,  H01G4/1227 ,  H01G4/30 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

Abstract: Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.

Abstract translation: 提供一种电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷衬底。 电介质组合物包括约80重量％以上的主成分BaTiO 3和约20重量％以下的辅助成分CuBi 2 O 4和ZnO-B 2 O 3 -SiO 2基玻璃。

公开(公告)号：US20090141427A1

公开(公告)日：2009-06-04

申请号：US12323840

申请日：2008-11-26

Applicant: Soo Hyun Lyoo ,  Jong Myeon Lee ,  Ho Sung Choo ,  Min Ji Ko ,  Beom Joon Cho ,  Myung Whun Chang

Inventor： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Ho Sung Choo ,  Min Ji Ko ,  Beom Joon Cho ,  Myung Whun Chang

IPC: H01G4/12 ,  C04B35/468

CPC classification number: H01G4/129 ,  B82Y30/00 ,  C04B35/468 ,  C04B2235/3281 ,  C04B2235/3298 ,  C04B2235/365 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/9615 ,  H01G4/1227 ,  H01G4/30 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

Abstract: Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.

Abstract translation: 提供一种电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷衬底。 电介质组合物包括约80重量％以上的主成分BaTiO 3和约20重量％以下的辅助成分CuBi 2 O 4和ZnO-B 2 O 3 -SiO 2基玻璃。

公开(公告)号：US20090117357A1

公开(公告)日：2009-05-07

申请号：US12265561

申请日：2008-11-05

Applicant: Beom Joon CHO ,  Jong Myeon Lee ,  Myung Whun Chang

Inventor： Beom Joon CHO ,  Jong Myeon Lee ,  Myung Whun Chang

IPC: B32B18/00 ,  B32B5/16 ,  C04B35/00

CPC classification number: B32B18/00 ,  C04B35/638 ,  C04B2235/3217 ,  C04B2235/5292 ,  C04B2235/5436 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/721 ,  C04B2235/9615 ,  C04B2237/562 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0269 ,  H05K2203/308 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/252

Abstract: There is provided a hard-to-sinter constraining green sheet and a method of manufacturing a multilayer ceramic substrate using the same. The hard-to-sinter constraining green sheet disposed at least one of top and bottom surfaces of a non-sintered multi-layer ceramic substrate, the hard-to-sinter constraining green sheet including: a first constraining layer having a surface to be positioned on the multi-layer ceramic substrate, the first constraining layer including a first organic binder and a first inorganic binder having a spherical shape or a quasi-spherical shape; and a second constraining layer bonded to a top surface of the first constraining layer and including a second organic binder and a second inorganic powder having a flake shape, the second constraining layer having a powder packing density lower than a powder packing density of the first constraining layer.

Abstract translation: 提供了难以烧结的约束生片和使用其制造多层陶瓷基板的方法。 所述难烧结约束生片设置在非烧结多层陶瓷衬底的顶表面和底表面中的至少一个上，所述难烧结约束生片包括：具有待定位表面的第一约束层 在多层陶瓷基板上，第一约束层包括第一有机粘合剂和具有球形或准球形的第一无机粘合剂; 以及第二约束层，其结合到所述第一约束层的顶表面并且包括第二有机粘合剂和具有片状的第二无机粉末，所述第二约束层的粉末填充密度低于所述第一约束层的粉末堆积密度 层。

公开(公告)号：US20090107616A1

公开(公告)日：2009-04-30

申请号：US12262104

申请日：2008-10-30

Applicant: Soo Hyun Lyoo ,  Jong Myeon Lee ,  Eun Tae Park ,  Hyoung Ho Kim

Inventor： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Eun Tae Park ,  Hyoung Ho Kim

IPC: C03B29/00

CPC classification number: B32B18/00 ,  C04B2237/346 ,  C04B2237/56 ,  C04B2237/62 ,  H01L2224/16225 ,  H01L2924/09701 ,  H05K1/0231 ,  H05K1/0306 ,  H05K1/183 ,  H05K1/186 ,  H05K3/284 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/10636 ,  H05K2203/308 ,  Y02P70/611

Abstract: Provided is a manufacturing method of a multi-layer ceramic substrate. The manufacturing method includes preparing an unsintered ceramic laminated body with a cavity, mounting a chip device within the cavity, filling the cavity, in which the chip device is mounted, with a ceramic slurry, attaching a constrained layer on top and/or bottom of the ceramic laminated body, and firing the ceramic laminated body. Accordingly, since the deformation of the cavity is prevented during the firing of the ceramic laminated body, the dimension precision and reliability of the multi-layer ceramic substrate can be improved.

Abstract translation: 提供一种多层陶瓷基板的制造方法。 该制造方法包括制备具有空腔的未烧结的陶瓷层叠体，在空腔内安装芯片装置，将其中安装有芯片装置的空腔填充到陶瓷浆料中，将约束层附着在顶部和/或底部上 陶瓷层叠体，烧结陶瓷层叠体。 因此，由于在烧结陶瓷层叠体期间防止了空腔的变形，因此可以提高多层陶瓷基板的尺寸精度和可靠性。

公开(公告)号：US20080293321A1

公开(公告)日：2008-11-27

申请号：US12178460

申请日：2008-07-23

Applicant: Hyoung Dong KANG ,  Hyun Chui Jung ,  Sang Moon Lee ,  Jong Myeon Lee

Inventor： Hyoung Dong KANG ,  Hyun Chui Jung ,  Sang Moon Lee ,  Jong Myeon Lee

IPC: H01J9/12 ,  B05D5/12

CPC classification number: H01J9/025 ,  B82Y10/00 ,  B82Y30/00 ,  H01J2201/30469

Abstract: A process for fabricating a field emitter electrode includes: impregnating a cathode and anode in an electrolyte containing carbon nanotubes dispersed therein and applying a predetermined voltage to the cathode and anode so as to deposit carbon nanotubes on a substrate provided on the anode; recovering the substrate and applying a conductive polymer onto the surface of the substrate having carbon nanotubes deposited thereon; and heat treating the conductive polymer having carbon nanotubes deposited thereon, so as to completely cure it.

Abstract translation: 制造场致发射电极的方法包括：在分散在其中的含有碳纳米管的电解质中浸渍阴极和阳极，并向阴极和阳极施加预定电压，以将碳纳米管沉积在设置在阳极上的衬底上; 回收衬底并将导电聚合物施加到其上沉积有碳纳米管的衬底的表面上; 并对其上沉积有碳纳米管的导电聚合物进行热处理，以使其完全固化。

公开(公告)号：US20080142822A1

公开(公告)日：2008-06-19

申请号：US11826248

申请日：2007-07-13

Applicant: Hyun Jun Kim ,  Chang Hwan Choi ,  Jong Myeon Lee ,  Dong Woohn Kim ,  Won Ha Moon

Inventor： Hyun Jun Kim ,  Chang Hwan Choi ,  Jong Myeon Lee ,  Dong Woohn Kim ,  Won Ha Moon

IPC: H01L33/00

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/1815 ,  H01L2924/00

Abstract: An LED package comprises a frame having a concave portion formed in the center thereof; one or more LED chips mounted on the bottom surface of the concave portion; and a lens filled in the concave portion, the lens having an upper surface formed of continuous prismatic irregularities forming concentric circles.

Abstract translation: LED封装包括在其中心形成有凹部的框架; 安装在凹部的底面上的一个或多个LED芯片; 以及填充在所述凹部中的透镜，所述透镜具有由形成同心圆的连续棱镜不规则形成的上表面。

公开(公告)号：US20070194691A1

公开(公告)日：2007-08-23

申请号：US11708466

申请日：2007-02-21

Applicant: Ho Sung Choo ,  Youn Gon Park ,  Hai Sung Lee ,  Myung Whun Chang ,  Jong Myeon Lee

Inventor： Ho Sung Choo ,  Youn Gon Park ,  Hai Sung Lee ,  Myung Whun Chang ,  Jong Myeon Lee

IPC: H01J1/62

CPC classification number: C09K11/02 ,  C09K11/08 ,  H01L33/505 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: In a light emitting diode package, a package substrate includes a mounting area, an electrode and a light emitting diode chip disposed on the mounting area. A phosphor film encapsulates the light emitting diode chip in an upward convex configuration. A resin encapsulant encapsulates the phosphor film in an upward convex configuration. The light emitting diode package prevents light loss which arises from increased light scattering due to dense phosphors, thereby achieving excellent light extraction efficiency. Also, a phosphor film is formed by dispensing, thereby leading to no breaking of an upper wire even in a face-up chip.

Abstract translation: 在发光二极管封装中，封装基板包括设置在安装区域上的安装区域，电极和发光二极管芯片。 荧光体膜将发光二极管芯片封装成向上凸起的构造。 树脂密封剂将磷光体膜以向上凸起的形式封装。 发光二极管封装防止由于致密荧光体引起的光散射引起的光损失，从而获得优异的光提取效率。 此外，通过分配形成荧光膜，从而即使在面朝上的芯片中也不会导致上部线断裂。

公开(公告)号：US20070194341A1

公开(公告)日：2007-08-23

申请号：US11709135

申请日：2007-02-22

Applicant: Myung Whun Chang ,  Jong Myeon Lee ,  Ho Sung Choo ,  Young Gon Park ,  Hai Sung Lee

Inventor： Myung Whun Chang ,  Jong Myeon Lee ,  Ho Sung Choo ,  Young Gon Park ,  Hai Sung Lee

IPC: H01L33/00

CPC classification number: H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: A light emitting diode package. A package substrate has first and second electrode structures and a light emitting diode is mounted on the package substrate and electrically connected to the first and second electrode structures. A resin encapsulant is made of a transparent resin to seal the light emitting diode. A plurality of transparent spherical particles having a refractive index higher than the transparent resin are dispersed in the resin encapsulant.

Abstract translation: 发光二极管封装。 封装衬底具有第一和第二电极结构，并且发光二极管安装在封装衬底上并电连接到第一和第二电极结构。 树脂密封剂由透明树脂制成以密封发光二极管。 折射率高于透明树脂的多个透明球形颗粒分散在树脂密封剂中。