公开(公告)号：US08513248B2

公开(公告)日：2013-08-20

申请号：US13266557

申请日：2010-04-28

申请人： David Kenneth Dean ,  Jorge Munoz-Muriedas ,  Mairi Sime ,  Jon Graham Anthony Steadman ,  Rachel Elizabeth Anne Thewlis ,  Giancarlo Trani ,  Ian David Wall ,  Daryl Simon Walter

发明人： David Kenneth Dean ,  Jorge Munoz-Muriedas ,  Mairi Sime ,  Jon Graham Anthony Steadman ,  Rachel Elizabeth Anne Thewlis ,  Giancarlo Trani ,  Ian David Wall ,  Daryl Simon Walter

IPC分类号： A61K31/495

CPC分类号： C07D487/04

摘要： The present invention provides a compound of formula (I) or a pharmaceutically acceptable salt thereof: wherein A is hydrogen, C1-4alkyl, C3-6cycloalkyl, C1-3alkoxy, C1-3alkoxy C1-4alkyl, C1-2fluoroalkyl, halogen, NR6R7, optionally substituted heteroaryl (Het), or optionally substituted phenyl, and R1, R2, R3, R4, R5, R6 and R7 are as defined in the description. The compounds or salts are thought to modulate P2X7 receptor function and to be capable of antagonizing the effects of ATP at the P2X7 receptor. The invention also provides the use of the compound or salt in the treatment or prophylaxis of, for example, inflammatory pain, neuropathic pain, visceral pain, rheumatoid arthritis or osteoarthritis or neurodegenerative disorders.

摘要翻译： 本发明提供式（I）化合物或其药学上可接受的盐：其中A为氢，C 1-4烷基，C 3-6环烷基，C 1-3烷氧基，C 1-3烷氧基C 1-4烷基，C 1-2 - 氟烷基，卤素，NR 6 R 7， 任选取代的杂芳基（Het）或任选取代的苯基，并且R 1，R 2，R 3，R 4，R 5，R 6和R 7如说明书中所定义。 认为化合物或盐可以调节P2X7受体功能，并能够拮抗ATP在P2X7受体上的作用。 本发明还提供了化合物或盐在治疗或预防例如炎性疼痛，神经性疼痛，内脏痛，类风湿性关节炎或骨关节炎或神经变性疾病中的用途。

公开(公告)号：US07682421B2

公开(公告)日：2010-03-23

申请号：US11548713

申请日：2006-10-12

申请人： Gareth P. Taylor ,  Jorge Munoz

发明人： Gareth P. Taylor ,  Jorge Munoz

IPC分类号： B01D19/00

CPC分类号： B01D19/0031 ,  A61M5/36 ,  B01D19/0036 ,  B01D19/0094

摘要： A liquid is degassed with an apparatus including a membrane contactor, where the liquid is drawn through the apparatus by gravity.

摘要翻译： 用包括膜接触器的装置对液体进行脱气，其中液体通过重力被引导通过设备。

公开(公告)号：US06984890B2

公开(公告)日：2006-01-10

申请号：US10884521

申请日：2004-07-02

申请人： Bharat Shivkumar ,  Daniel M. Kinzer ,  Jorge Munoz

发明人： Bharat Shivkumar ,  Daniel M. Kinzer ,  Jorge Munoz

IPC分类号： H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49838 ,  H01L23/528 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0603 ,  H01L2224/451 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A substrate having upper and lower surfaces, the upper surface including a periphery defined by first and second spaced apart side edges and front and rear spaced apart edges; a power semiconductor die disposed on the upper surface of the substrate, the die including a top surface on which at least a first metalized surface is disposed and a bottom surface; a plurality of conductive pads disposed only at the second side edge of the substrate; and a plurality of wire bonds extending from the first metalized surface to the plurality of conductive pads.

公开(公告)号：US06396127B1

公开(公告)日：2002-05-28

申请号：US09476825

申请日：2000-01-03

申请人： Jorge Munoz ,  Rod DeLeon

发明人： Jorge Munoz ,  Rod DeLeon

IPC分类号： H01L2350

CPC分类号： H01L24/40 ,  H01L23/4952 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/48 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/8485 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/20755 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package includes a bottom leadframe having a bottom plate portion and at least one first terminal extending from the bottom plate portion; at least one second terminal being co-planar with the first terminal; a semiconductor power MOSFET die having a bottom surface defining a drain connection and a top surface on which a first metalized region defining a source and a second metalized region defining a gate are disposed, the bottom surface being coupled to the bottom plate of the leadframe such that the first terminal is electrically connected to the drain; a copper plate coupled to and spanning a substantial part of the first metalized region defining the source connection, the copper plate including at least one chamfered edge extending upward and away from the first metalized region; and at least one beam portion being sized and shaped to couple the copper plate portion to the at least one second terminal such that it is electrically coupled to the source.

摘要翻译： 半导体封装包括具有底板部分的底部引线框架和从底板部分延伸的至少一个第一端子; 至少一个第二端子与所述第一端子共面; 具有限定漏极连接的底表面的半导体功率MOSFET管芯和顶表面，其上限定限定源极的第一金属化区域和限定栅极的第二金属化区域，所述底表面联接到引线框架的底板， 第一端子电连接到漏极; 铜板，其耦合并跨越限定所述源极连接的所述第一金属化区域的主要部分，所述铜板包括向上并远离所述第一金属化区域延伸的至少一个倒角边缘; 并且至少一个梁部分的尺寸和形状被设计成将铜板部分耦合到至少一个第二端子，使得它被电耦合到源极。

公开(公告)号：US06376910B1

公开(公告)日：2002-04-23

申请号：US09361633

申请日：1999-06-23

申请人： Jorge Munoz ,  Chuan Cheah

发明人： Jorge Munoz ,  Chuan Cheah

IPC分类号： H01L2348

CPC分类号： H01L24/33 ,  H01L24/02 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/32245 ,  H01L2224/83207 ,  H01L2224/83805 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/00

摘要： A solderable back contact for semiconductor die consists of a titanium layer bonded to the bottom of the die. The free surface of the titanium layer is coated with a copper layer. A soft solder layer joins the bottom of the die to a copper lead frame by first heating the die to below the melting point of the solder, and then ultrasonically “scrubbing” the solder to cause it to bond to the die and lead frame with a minimum sized solder fillet.

摘要翻译： 用于半导体管芯的可焊接背接触件由结合到管芯底部的钛层组成。 钛层的自由表面涂有铜层。 软焊料层通过首先将管芯加热到焊料的熔点以下，然后超声波地“擦洗”焊料以使其与管芯和引线框架结合，从而将管芯的底部连接到铜引线框架 最小尺寸的焊锡圆角。

公开(公告)号：US20130049079A1

公开(公告)日：2013-02-28

申请号：US13557716

申请日：2012-07-25

申请人： Jorge Munoz

发明人： Jorge Munoz

IPC分类号： H01L23/495 ,  H01L29/78

CPC分类号： H01L24/49 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40247 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49505 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/84205 ,  H01L2224/84801 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to an exemplary embodiment, a small-outline package includes a power transistor having a source and a drain, the power transistor situated on a paddle of a leadframe of the small-outline package. The source of the power transistor is electrically connected to a plurality of source leads. The drain of the power transistor is electrically and thermally connected to a top side of the paddle of the leadframe, the paddle of the leadframe being exposed from a bottom surface of the small-outline package, thereby providing a direct electrical contact to the drain from a bottom side of the paddle of the leadframe.

摘要翻译： 根据示例性实施例，小外形封装包括具有源极和漏极的功率晶体管，功率晶体管位于小外形封装的引线框架的桨叶上。 功率晶体管的源极电连接到多个源极。 功率晶体管的漏极电连接并且热连接到引线框架的焊盘的顶侧，引线框架的焊盘从小外形封装的底表面露出，从而提供与漏极的直接电接触 引线框的桨叶的底侧。

公开(公告)号：US06410989B1

公开(公告)日：2002-06-25

申请号：US09225254

申请日：1999-01-04

申请人： Bharat Shivkumar ,  Daniel M. Kinzer ,  Jorge Munoz

发明人： Bharat Shivkumar ,  Daniel M. Kinzer ,  Jorge Munoz

IPC分类号： H01L2348

CPC分类号： H01L23/49838 ,  H01L23/528 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0603 ,  H01L2224/451 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A substrate having upper and lower surfaces, the upper surface including a periphery defined by first and second spaced apart side edges and front and rear spaced apart edges; a power semiconductor die disposed on the upper surface of the substrate, the die including a top surface on which at least a first metalized surface is disposed and a bottom surface; a plurality of conductive pads disposed only at the second side edge of the substrate; and a plurality of wire bonds extending from the first metalized surface to the plurality of conductive pads.

公开(公告)号：US5887776A

公开(公告)日：1999-03-30

申请号：US729791

申请日：1996-10-08

申请人： Jorge Munoz

发明人： Jorge Munoz

IPC分类号： A45F5/00

CPC分类号： A45F5/00 ,  Y10S224/93

摘要： A portable radio-cassette adapter plate which is secured to a portable radio. An offset belt clip is secured to the portable radio-cassette adapter plate by an offset belt clip tether which is adjustable in length. By clamping the offset belt clip to a waistband or belt of a user, the portable radio is suspended comfortably by the offset belt clip tether. The distance which the portable radio is suspended below the waistband or belt of the user may be varied for comfort according to personal preference.

摘要翻译： 便携式收音机适配器板，固定在便携式收音机上。 偏移带夹通过长度可调节的偏移带夹系绳固定到便携式收音机适配器板上。 通过将偏移带夹固定到使用者的腰带或皮带上，便携式收音机由偏移带夹系绳舒适地悬挂。 便携式收音机悬挂在用户的腰带或腰带之下的距离可以根据个人喜好而变化以便于舒适。

公开(公告)号：US20120172366A1

公开(公告)日：2012-07-05

申请号：US13266557

申请日：2010-04-28

申请人： David Kenneth Dean ,  Jorge Munoz-Muriedas ,  Mairi Sime ,  Jon Graham Anthony Steadman ,  Rachel Elizabeth Anne Thewlis ,  Giancarlo Trani ,  Ian David Wall ,  Daryl Simon Walter

发明人： David Kenneth Dean ,  Jorge Munoz-Muriedas ,  Mairi Sime ,  Jon Graham Anthony Steadman ,  Rachel Elizabeth Anne Thewlis ,  Giancarlo Trani ,  Ian David Wall ,  Daryl Simon Walter

IPC分类号： A61K31/4985 ,  A61P29/00 ,  A61P25/16 ,  A61P25/08 ,  A61P25/14 ,  C07D487/04 ,  A61P25/28

CPC分类号： C07D487/04

摘要： The present invention provides a compound of formula (I) or a pharmaceutically acceptable salt thereof: wherein A is hydrogen, C1-4alkyl, C3-6cycloalkyl, C1-3alkoxy, C1-3alkoxy C1-4alkyl, C1-2fluoroalkyl, halogen, NR6R7, optionally substituted heteroaryl, or optionally substituted phenyl, and R1, R2, R3, R4, R5, R6 and R7 are as defined in the description.The compounds or salts are thought to modulate P2X7 receptor function and to be capable of antagonizing the effects of ATP at the P2X7 receptor. The invention also provides the use of the compound or salt in the treatment or prophylaxis of, for example, inflammatory pain, neuropathic pain, visceral pain, rheumatoid arthritis or osteoarthritis or neurodegenerative disorders.

摘要翻译： 本发明提供式（I）化合物或其药学上可接受的盐：其中A为氢，C 1-4烷基，C 3-6环烷基，C 1-3烷氧基，C 1-3烷氧基C 1-4烷基，C 1-2 - 氟烷基，卤素，NR 6 R 7， 任选取代的杂芳基或任选取代的苯基，并且R 1，R 2，R 3，R 4，R 5，R 6和R 7如说明书中所定义。 认为化合物或盐可以调节P2X7受体功能，并能够拮抗ATP在P2X7受体上的作用。 本发明还提供了化合物或盐在治疗或预防例如炎性疼痛，神经性疼痛，内脏痛，类风湿性关节炎或骨关节炎或神经变性疾病中的用途。

公开(公告)号：US20100311749A1

公开(公告)日：2010-12-09

申请号：US12739462

申请日：2008-10-24

申请人： Laura Jane Chambers ,  Katharine Laura Collis ,  David Kenneth Dean ,  Jorge Munoz-Muriedas ,  Jon Graham Anthony Steadman ,  Daryl Simon Walter

发明人： Laura Jane Chambers ,  Katharine Laura Collis ,  David Kenneth Dean ,  Jorge Munoz-Muriedas ,  Jon Graham Anthony Steadman ,  Daryl Simon Walter

IPC分类号： A61K31/5377 ,  C07D241/08 ,  A61K31/495 ,  C07D413/10 ,  C07D401/06 ,  A61K31/496 ,  C07D405/06 ,  C07D403/10 ,  A61P29/00 ,  A61P25/28 ,  A61P19/02

CPC分类号： C07D241/08 ,  C07D401/06 ,  C07D401/10 ,  C07D403/10 ,  C07D407/06

摘要： The invention provides a compound of formula (I) or a pharmaceutically acceptable salt thereof: wherein: A is C1-6alkyl, C3-6cycloalkyl, —CH2—R6, —CHMe-R7, —CMe2-R7, or optionally substituted aryl; wherein, when A is optionally substituted aryl, said aryl group is optionally substituted with 1 to 3 substituents, which may be the same or different, selected from the group consisting of halogen, C1-6alkyl, —CF3, C1-4alkoxy, C1fluoroalkoxy, cyano, NR8R9, and pyridyl wherein the pyridyl is optionally substituted by one methyl; R1 is chlorine, fluorine, —CF3, cyano or C1-6alkyl; R2, R3 and R5 independently are hydrogen, fluorine, chlorine, —CF3, cyano or C1-6alkyl, such that at least one of R2, R3 and R5 is other than hydrogen; R4 is hydrogen. These compounds and salts are thought to be P2X7 receptor antagonists. The invention also provides for the treatment of pain, inflammation, rheumatoid arthritis, osteoarthritis, or a neurodegenerative disease.

摘要翻译： 本发明提供式（I）化合物或其药学上可接受的盐：其中：A为C 1-6烷基，C 3-6环烷基，-CH 2 -R 6，-CHMe-R 7，-CMe 2 -R 7或任选取代的芳基; 其中当A是任选取代的芳基时，所述芳基任选地被1至3个选自卤素，C 1-6烷基，-CF 3，C 1-4烷氧基，C 1-6烷氧基， 氰基，NR8R9和吡啶基，其中吡啶基任选被一个甲基取代; R1是氯，氟，-CF3，氰基或C1-6烷基; R2，R3和R5独立地是氢，氟，氯，-CF3，氰基或C1-6烷基，使得R2，R3和R5中的至少一个不是氢; R4是氢。 这些化合物和盐被认为是P2X7受体拮抗剂。 本发明还提供治疗疼痛，炎症，类风湿性关节炎，骨关节炎或神经变性疾病。