Method of manufacturing semiconductor device
    1.
    发明授权
    Method of manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US08617991B2

    公开(公告)日:2013-12-31

    申请号:US13526960

    申请日:2012-06-19

    IPC分类号: H01L21/44

    摘要: A method of manufacturing a semiconductor device includes forming an interlayer dielectric film that has first and second trenches on first and second regions of a substrate, respectively, forming a first metal layer along a sidewall and a bottom surface of the first trench and along a top surface of the interlayer dielectric film in the first region, forming a second metal layer along a sidewall and a bottom surface of the second trench and along a top surface of the interlayer dielectric film in the second region, forming a first sacrificial layer pattern on the first metal layer such that the first sacrificial layer fills a portion of the first trench, forming a first electrode layer by etching the first metal layer and the second metal layer using the first sacrificial layer pattern, and removing the first sacrificial layer pattern.

    摘要翻译: 一种制造半导体器件的方法包括:在衬底的第一和第二区域上分别形成具有第一和第二沟槽的层间电介质膜,沿着第一沟槽的侧壁和底表面沿顶部形成第一金属层 在所述第一区域中的所述层间电介质膜的表面,沿着所述第二沟槽的侧壁和底表面沿着所述第二区域中的所述层间电介质膜的顶表面形成第二金属层,在所述第二区域中形成第一牺牲层图案 第一金属层,使得第一牺牲层填充第一沟槽的一部分,通过使用第一牺牲层图案蚀刻第一金属层和第二金属层形成第一电极层,以及去除第一牺牲层图案。

    Methods of forming oxide-filled trenches in substrates using multiple-temperature oxide deposition techniques
    2.
    发明授权
    Methods of forming oxide-filled trenches in substrates using multiple-temperature oxide deposition techniques 有权
    使用多温度氧化物沉积技术在衬底中形成氧化物填充的沟槽的方法

    公开(公告)号:US08399363B1

    公开(公告)日:2013-03-19

    申请号:US13036818

    申请日:2011-02-28

    摘要: Methods of forming integrated circuit substrates include forming first and second trenches having unequal widths in a semiconductor substrate and then depositing a first oxide layer at a first temperature into the first and second trenches. The first oxide layer has a thickness sufficient to completely fill the first trench but only partially fill the second trench, which is wider than the first trench. A step is also performed to selectively remove a portion of the first oxide layer from a bottom of the second trench. A second oxide layer is then deposited at a second temperature onto the bottom of the second trench. The second temperature is greater than the first temperature. For example, the first temperature may be in a range from about 300° C. to about 460° C. and the second temperature may be in a range from about 500° C. to about 600° C.

    摘要翻译: 形成集成电路基板的方法包括在半导体衬底中形成具有不等宽度的第一和第二沟槽,然后在第一温度下将第一氧化物层沉积到第一和第二沟槽中。 第一氧化物层具有足以完全填充第一沟槽但仅部分填充比第一沟槽宽的第二沟槽的厚度。 还执行步骤以从第二沟槽的底部选择性地去除第一氧化物层的一部分。 然后将第二氧化物层在第二温度下沉积到第二沟槽的底部。 第二温度大于第一温度。 例如,第一温度可以在约300℃至约460℃的范围内,第二温度可以在约500℃至约600℃的范围内。

    VENTRICULAR ASSIST DEVICE
    3.
    发明申请
    VENTRICULAR ASSIST DEVICE 有权
    静脉辅助装置

    公开(公告)号:US20120157756A1

    公开(公告)日:2012-06-21

    申请号:US13390087

    申请日:2010-08-11

    IPC分类号: A61M1/10

    摘要: A ventricular assist device includes a case, a pair of blood bags and a squeezing unit. The blood bags are installed inside the case. Each of the blood bags includes an inlet port connected to a ventricle of a heart to introduce therethrough blood flowing out from the ventricle, an internal space formed to store the blood introduced through the inlet port and an outlet port connected to an artery to discharge therethrough the blood stored in the internal space. The internal space has a variable volume. The squeezing unit is installed inside the case. The squeezing unit is configured to alternately squeeze the blood bags in such a way that, if one of the blood bags is squeezed to discharge the blood, the other blood bag is inflated to draw the blood.

    摘要翻译: 心室辅助装置包括壳体,一对血袋和挤压单元。 血袋安装在外壳内。 每个血袋包括连接到心脏心室的入口,以引入从心室流出的血液,形成的内部空间,用于存储通过入口插入的血液和连接到动脉的出口,以将其排出 血液储存在内部空间。 内部空间有一个变量。 挤压单元安装在外壳内。 挤压单元被配置为交替地挤压血袋,使得如果血袋中的一个被挤压以排出血液,则另一个血袋被充气以抽取血液。

    Transistor structure of a semiconductor device
    4.
    发明授权
    Transistor structure of a semiconductor device 有权
    半导体器件的晶体管结构

    公开(公告)号:US08916936B2

    公开(公告)日:2014-12-23

    申请号:US13751570

    申请日:2013-01-28

    IPC分类号: H01L29/76

    摘要: A semiconductor device including: a first gate pattern disposed in a peripheral region of a substrate; a second gate pattern disposed in a cell region of the substrate; a first insulator formed on sidewalls of the first gate pattern; and a second insulator formed on sidewalls of the second gate pattern, wherein a dielectric constant of the first insulator is different from a dielectric constant of the second insulator, and wherein a height of the second insulator is greater than a height of the second gate pattern.

    摘要翻译: 一种半导体器件,包括:设置在衬底的周边区域中的第一栅极图案; 设置在所述基板的单元区域中的第二栅极图案; 形成在第一栅极图案的侧壁上的第一绝缘体; 以及形成在所述第二栅极图案的侧壁上的第二绝缘体,其中所述第一绝缘体的介电常数不同于所述第二绝缘体的介电常数,并且其中所述第二绝缘体的高度大于所述第二栅极图案的高度 。

    SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
    5.
    发明申请
    SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20140054713A1

    公开(公告)日:2014-02-27

    申请号:US13751570

    申请日:2013-01-28

    IPC分类号: H01L27/088

    摘要: A semiconductor device including: a first gate pattern disposed in a peripheral region of a substrate; a second gate pattern disposed in a cell region of the substrate; a first insulator formed on sidewalls of the first gate pattern; and a second insulator formed on sidewalls of the second gate pattern, wherein a dielectric constant of the first insulator is different from a dielectric constant of the second insulator, and wherein a height of the second insulator is greater than a height of the second gate pattern.

    摘要翻译: 一种半导体器件,包括:设置在衬底的周边区域中的第一栅极图案; 设置在所述基板的单元区域中的第二栅极图案; 形成在第一栅极图案的侧壁上的第一绝缘体; 以及形成在所述第二栅极图案的侧壁上的第二绝缘体,其中所述第一绝缘体的介电常数不同于所述第二绝缘体的介电常数,并且其中所述第二绝缘体的高度大于所述第二栅极图案的高度 。

    Ventricular assist device
    6.
    发明授权
    Ventricular assist device 有权
    心室辅助装置

    公开(公告)号:US08535213B2

    公开(公告)日:2013-09-17

    申请号:US13390087

    申请日:2010-08-11

    IPC分类号: A61N1/362

    摘要: A ventricular assist device includes a case, a pair of blood bags and a squeezing unit. The blood bags are installed inside the case. Each of the blood bags includes an inlet port connected to a ventricle of a heart to introduce therethrough blood flowing out from the ventricle, an internal space formed to store the blood introduced through the inlet port and an outlet port connected to an artery to discharge therethrough the blood stored in the internal space. The internal space has a variable volume. The squeezing unit is installed inside the case. The squeezing unit is configured to alternately squeeze the blood bags in such a way that, if one of the blood bags is squeezed to discharge the blood, the other blood bag is inflated to draw the blood.

    摘要翻译: 心室辅助装置包括壳体,一对血袋和挤压单元。 血袋安装在外壳内。 每个血袋包括连接到心脏心室的入口,以引入从心室流出的血液,形成的内部空间,用于存储通过入口插入的血液和连接到动脉的出口,以将其排出 血液储存在内部空间。 内部空间有一个变量。 挤压单元安装在外壳内。 挤压单元被配置为交替地挤压血袋,使得如果血袋中的一个被挤压以排出血液,则另一个血袋被充气以抽取血液。

    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    7.
    发明申请
    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件的方法

    公开(公告)号:US20130005133A1

    公开(公告)日:2013-01-03

    申请号:US13523928

    申请日:2012-06-15

    IPC分类号: H01L21/283

    摘要: A method of manufacturing a semiconductor device can uniformly form a metal gate irrespective of gate pattern density. The method includes forming an interlayer dielectric layer having a trench on a substrate, forming a metal layer having first, second and third sections extending along the sides of the trench, the bottom of the trench and on the interlayer dielectric layer, respectively, forming a sacrificial layer pattern exposing an upper part of the first section of the metal layer, forming a spacer pattern on the exposed part of the first section of the metal layer, and forming a first gate metal layer by etching the first section of the metal layer using the sacrificial layer pattern and the spacer pattern as masks.

    摘要翻译: 无论栅极图案密度如何,制造半导体器件的方法均匀地形成金属栅极。 该方法包括在衬底上形成具有沟槽的层间电介质层,形成金属层,该金属层具有分别沿着沟槽的侧面,沟槽的底部和层间介电层延伸的第一,第二和第三部分,形成 牺牲层图案,暴露金属层的第一部分的上部,在金属层的第一部分的暴露部分上形成间隔图案,并且通过用金属层的第一部分蚀刻来形成第一栅极金属层,使用 牺牲层图案和间隔图案作为掩模。

    Method of fabricating semiconductor device including forming epitaxial blocking layers by nitridation process
    8.
    发明授权
    Method of fabricating semiconductor device including forming epitaxial blocking layers by nitridation process 有权
    制造半导体器件的方法包括通过氮化处理形成外延阻挡层

    公开(公告)号:US08691642B2

    公开(公告)日:2014-04-08

    申请号:US13238611

    申请日:2011-09-21

    IPC分类号: H01L21/8238

    摘要: A method of fabricating a semiconductor device includes forming gate structures on PMOS and NMOS transistor regions of the semiconductor substrate, forming epitaxial blocking layers on source/drain regions of PMOS and NMOS transistor regions using a nitridation process, then selectively removing one of the epitaxial blocking layers, and using a SEG process to form an epitaxial layer on respective source/drain regions while shielding the other source/drain regions with a remaining epitaxial blocking layer.

    摘要翻译: 制造半导体器件的方法包括在半导体衬底的PMOS和NMOS晶体管区域上形成栅极结构,使用氮化工艺在PMOS和NMOS晶体管区域的源极/漏极区域上形成外延阻挡层,然后选择性地去除外延阻挡层 并且使用SEG工艺在相应的源极/漏极区域上形成外延层,同时用剩余的外延阻挡层屏蔽另一个源极/漏极区域。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    9.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20130012021A1

    公开(公告)日:2013-01-10

    申请号:US13526960

    申请日:2012-06-19

    IPC分类号: H01L21/283

    摘要: A method of manufacturing a semiconductor device includes forming an interlayer dielectric film that has first and second trenches on first and second regions of a substrate, respectively, forming a first metal layer along a sidewall and a bottom surface of the first trench and along a top surface of the interlayer dielectric film in the first region, forming a second metal layer along a sidewall and a bottom surface of the second trench and along a top surface of the interlayer dielectric film in the second region, forming a first sacrificial layer pattern on the first metal layer such that the first sacrificial layer fills a portion of the first trench, forming a first electrode layer by etching the first metal layer and the second metal layer using the first sacrificial layer pattern, and removing the first sacrificial layer pattern.

    摘要翻译: 一种制造半导体器件的方法包括:在衬底的第一和第二区域上分别形成具有第一和第二沟槽的层间电介质膜,沿着第一沟槽的侧壁和底表面沿顶部形成第一金属层 在所述第一区域中的所述层间电介质膜的表面,沿着所述第二沟槽的侧壁和底表面沿着所述第二区域中的所述层间电介质膜的顶表面形成第二金属层,在所述第二区域中形成第一牺牲层图案 第一金属层,使得第一牺牲层填充第一沟槽的一部分,通过使用第一牺牲层图案蚀刻第一金属层和第二金属层形成第一电极层,以及去除第一牺牲层图案。

    POLYMER VALVE AND PULSATILE CONDUIT-TYPE VAD USING THE SAME
    10.
    发明申请
    POLYMER VALVE AND PULSATILE CONDUIT-TYPE VAD USING THE SAME 审中-公开
    聚合物阀和脉冲型导流管使用它

    公开(公告)号:US20110245916A1

    公开(公告)日:2011-10-06

    申请号:US12964180

    申请日:2010-12-09

    IPC分类号: A61F2/24 A61M1/10

    摘要: A prosthetic blood valve comprises a base body having a hollow, opposing props extending from the body to partition opposing inclined ridges of the body to allow the inclined ridges and each top of the props to define the hollow and to form an upper surface of the body, and a singular leaflet attached to and along the inclined ridges and the prop tops to cover the hollow. The singular leaflet has a substantially central opening between the props and formed of a flexible material so a forward or outward blood flow passes through the opening and a reverse flow or backflow of blood leads to opposing leaflet portions around the opening being abuttingly pulled to each other to thereby prevent the blood backflow.

    摘要翻译: 假体血液阀包括基体,其具有中空的相对的道具,其从身体延伸到分隔体的相对的倾斜脊部,以允许倾斜脊部和道具的每个顶部限定中空部并且形成身体的上表面 ,以及连接到并沿着倾斜脊和支撑顶部以覆盖中空的单个小叶。 单数小叶在道具之间具有基本上中心的开口并由柔性材料形成,因此向前或向外的血流通过开口,并且血液的反向流动或回流导致开口周围的相对的小叶部分彼此相互拉动 从而防止血液回流。