摘要:
A connector holder fixes an optical connector assembled at a leading end of an optical fiber to an optical module having a light input/output end so that the optical fiber and the light input/output end is optically connected. The connector holder is provided with a holding section for storing at least a part of the optical connector, and a cover section attached to the holding section to be freely opened and closed. The cover section is provided with a cover section main body, and a pressing section which presses the optical connector toward the optical module.
摘要:
A connector holder fixes an optical connector assembled at a leading end of an optical fiber to an optical module having a light input/output end so that the optical fiber and the light input/output end is optically connected. The connector holder is provided with a holding section for storing at least a part of the optical connector, and a cover section attached to the holding section to be freely opened and closed. The cover section is provided with a cover section main body, and a pressing section which presses the optical connector toward the optical module.
摘要:
A plasma etching method is provided to perform a plasma etching on a silicon oxide film or a silicon nitride film formed below an amorphous carbon film by using a pattern of the amorphous carbon film as a final mask in a multilayer mask including a photoresist layer having a predetermined pattern, an organic bottom anti-reflection coating (BARC) film formed below the photoresist layer, an SiON film formed below the BARC film, and the amorphous carbon film formed below the SiON film. An initial mask used at the time when the plasma etching of the silicon oxide film or the silicon nitride film is started is under a state in which the SiON film remains on the amorphous carbon film and a ratio of a film thickness of the amorphous carbon film to a film thickness of the residual SiON film is smaller than or equal to about 14.
摘要:
A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor package 1 is bonded to the front surface of mounting board 3 facing the rear surface. Heat sink 8 is brought into contact with the rear surface of semiconductor package 1 via through-ole 5 formed on mounting board 3. Semiconductor package 1 and heat sink 8 are pressed to each other by the elastic force of clip 6.
摘要:
Information processing equipment includes a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane and optically connected to the first optical connector. The disposing direction of the optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate and the disposing direction of the optical fibers in the first optical connector and the disposing direction of the optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate.
摘要:
A connector holder fixes an optical connector assembled at a leading end of an optical fiber to an optical module having a light input/output end so that the optical fiber and the light input/output end is optically connected. The connector holder is provided with a holding section for storing at least a part of the optical connector, and a cover section attached to the holding section to be freely opened and closed. The cover section is provided with a cover section main body, and a pressing section which presses the optical connector toward the optical module.
摘要:
An intra-housing optical communication system includes card slots 61 to 64 and at least a concentrate slot and conducts the optical communication between the slots, wherein the optical wires between the card slots are connected by using an optical fiber sheet or the like to simplify the wiring and reduce the size of the housing. The concentrate slots include an optical wiring change unit 6 for changing the form of connection between the card slots, thereby making it possible to easily change the form of connection to the desired shape (mesh, ring, etc.). Also, the optical terminals of the optical connectors are shared by a plurality of the slots and thus made available for use among the optical connectors.
摘要:
One or more one-dimensional array-shaped photoelectric conversion modules 302 are mounted on a board 301. A one-dimensional array-shaped light receiving/emitting element 303 is mounted in each of the one-dimensional array-shaped photoelectric conversion modules 302. Further, the one-dimensional array-shaped photoelectric conversion modules 302 are mechanically and optically connected to a flexible fiber sheet 306 through an optical connector 305. As parallel transmission paths 306 from the one-dimensional array-shaped photoelectric conversion modules 302 approach an end of a board 301, they are laminated with each other and connected to a two-dimensional array-shaped optical connector 307 at an end of the board. Further, a wavelength multiplexer/demultiplexer is connected to the optical connector.
摘要:
An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.
摘要:
Regular data inputted/outputted to/from external terminals is read/written to/from a regular cell array, and parity data is read/written from/to a parity cell array. Since the parity data is generated by a parity generation circuit, it is difficult to write a desired pattern to the parity cell array. The regular data and the parity data are exchanged with each other by a switch circuit, so that the regular data can be written to the parity cell array and the parity data can be written to the regular cell array. This enables the write of desired data to the parity cell array. A test of the parity data can be easily conducted. In particular, a leakage test or the like between memory cells can be easily conducted.