PROCESS FOR MAKING AN IRIDIUM LAYER
    2.
    发明申请

    公开(公告)号:US20180195199A9

    公开(公告)日:2018-07-12

    申请号:US15146888

    申请日:2016-05-04

    摘要: A process for depositing a plurality of layers of iridium on a substrate includes: contacting the substrate with an electrolyte composition including: iridium cations protons; biasing the substrate at a first potential; forming iridium on the substrate at the first potential of the substrate; disposing hydrogen on the substrate; self-terminating the forming of iridium on the substrate in response to increasing a coverage of hydrogen on the substrate; oxidizing hydrogen on the substrate by changing a potential of the substrate from the first potential to a second potential; and changing the potential of the substrate from the second potential to a third potential for forming additional iridium on the substrate to deposit a plurality of layers of iridium on the substrate, such that forming the additional iridium on the substrate occurs at the third potential in response to oxidizing the hydrogen on the substrate at the second potential.

    METHOD FOR PRODUCING FINE CATALYST PARTICLES AND METHOD FOR PRODUCING CARBON-SUPPORTED CATALYST

    公开(公告)号:US20170117554A1

    公开(公告)日:2017-04-27

    申请号:US15302006

    申请日:2015-02-13

    IPC分类号: H01M4/86 H01M4/92

    摘要: The present invention is to provide fine catalyst particles with better catalytic performance than ever before and a carbon-supported catalyst with better catalytic performance than ever before. Disclosed is a method for producing fine catalyst particles, comprising: a potential applying step of applying a potential to the fine palladium-containing particles in a first dispersion, until a peak indicating a Pd{111} surface in a reduction wave of a cyclic voltammogram becomes larger than a peak indicating a Pd{110} or Pd{100} surface in the reduction wave of the cyclic voltammogram; a copper covering step of covering at least part of the fine palladium-containing particle with copper by preparing a second dispersion by mixing the first dispersion and a copper-containing solution after the potential applying step, and applying a potential that is nobler than the oxidation-reduction potential of copper to the fine palladium-containing particles in the second dispersion; and a platinum covering step of covering at least part of the fine palladium-containing particle with platinum by mixing the second dispersion and a platinum-containing solution after the copper covering step.

    Process for growing metal particles by electroplating with in situ inhibition
    8.
    发明授权
    Process for growing metal particles by electroplating with in situ inhibition 有权
    通过原位抑制电镀生长金属颗粒的方法

    公开(公告)号:US09391331B2

    公开(公告)日:2016-07-12

    申请号:US14114515

    申请日:2012-04-18

    摘要: A process for manufacturing a catalytic, electrically conductive electrode based on metal particles, comprises: a step of electroplating with a metal salt to form the said metal particles at the surface of an electrode, characterized in that the step of electroplating of the metal salt is performed in the presence of a blocking chemical species with a high power of absorption onto the surface of the said metal particles and with an oxidation potential higher than the reduction potential of the said metal salt such that the blocking chemical species conserves its blocking power during the reduction reaction of the said metal salt, and so as to reduce the size of the metal particles formed, constituting the said catalytic, electrically conductive electrode; and, a step of desorption of the blocking chemical species.

    摘要翻译: 一种用于制造基于金属颗粒的催化导电电极的方法,包括:在金属表面电镀金属盐以形成所述金属颗粒的步骤,其特征在于,所述金属盐的电镀步骤为 在存在具有高吸收功能的阻挡化学物质存在于所述金属颗粒的表面上并且具有高于所述金属盐的还原电位的氧化电位的情况下进行,使得阻断化学物质在其中抑制其阻断作用 所述金属盐的还原反应,并且减小构成所述催化性导电电极的形成的金属颗粒的尺寸; 以及阻塞化学物质的解吸步骤。