公开(公告)号：US09362196B2

公开(公告)日：2016-06-07

申请号：US13181737

申请日：2011-07-13

申请人： Keiju Yamada ,  Takashi Yamazaki ,  Masatoshi Fukuda ,  Yasuhiro Koshio

发明人： Keiju Yamada ,  Takashi Yamazaki ,  Masatoshi Fukuda ,  Yasuhiro Koshio

IPC分类号： H01L23/02 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/00

CPC分类号： H01L23/552 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： According to an embodiment, a semiconductor package includes a semiconductor chip mounted on an interposer board, a encapsulant sealing the semiconductor chip, and a conductive shielding layer covering the encapsulant and at least part of a side surface of the interposer board. The interposer board has plural vias through an insulating substrate. A part of the plural vias has a cutting plane exposing to the side surface of the interposer board and cut in a thickness direction of the interposer board. The cutting plane of the via is electrically connected to the conductive shielding layer.

摘要翻译： 根据实施例，半导体封装包括安装在插入板上的半导体芯片，密封半导体芯片的密封剂以及覆盖密封剂的导电屏蔽层和插入板的侧表面的至少一部分。 插入板具有通过绝缘基板的多个通路。 多个通孔的一部分具有暴露于插入板的侧表面并在插入板的厚度方向上切割的切割平面。 通孔的切割平面电连接到导电屏蔽层。

公开(公告)号：US08860190B2

公开(公告)日：2014-10-14

申请号：US13357866

申请日：2012-01-25

申请人： Keiju Yamada ,  Masaaki Ishida

发明人： Keiju Yamada ,  Masaaki Ishida

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5226 ,  H01L23/5286 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor device includes a circuit substrate, a semiconductor element, a sealing resin layer, and a conductive shielding layer. The circuit substrate includes an insulating layer, a plurality of interconnections forming first interconnection layers provided on an upper surface side of the insulating layer, a plurality of interconnections forming second interconnection layers provided on a lower surface side of the insulating layer, and a plurality of vias penetrating from the upper surface to the lower surface of the insulating layer. The semiconductor element is mounted on the upper surface side of the circuit substrate. The conductive shielding layer covers the sealing resin layer and part of an end portion of the circuit substrate. Any of the plurality of vias and the conductive shielding layer are electrically connected.

摘要翻译： 根据一个实施例，半导体器件包括电路基板，半导体元件，密封树脂层和导电屏蔽层。 电路基板包括绝缘层，形成设置在绝缘层的上表面侧的第一互连层的多个互连，形成设置在绝缘层的下表面侧的第二互连层的多个互连，以及多个 从绝缘层的上表面到下表面穿透的通孔。 半导体元件安装在电路基板的上表面侧。 导电屏蔽层覆盖密封树脂层和电路基板端部的一部分。 多个通孔和导电屏蔽层中的任何一个电连接。

公开(公告)号：US20120193770A1

公开(公告)日：2012-08-02

申请号：US13357866

申请日：2012-01-25

申请人： Keiju YAMADA ,  Masaaki Ishida

发明人： Keiju YAMADA ,  Masaaki Ishida

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5226 ,  H01L23/5286 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor device includes a circuit substrate, a semiconductor element, a sealing resin layer, and a conductive shielding layer. The circuit substrate includes an insulating layer, a plurality of interconnections forming first interconnection layers provided on an upper surface side of the insulating layer, a plurality of interconnections forming second interconnection layers provided on a lower surface side of the insulating layer, and a plurality of vias penetrating from the upper surface to the lower surface of the insulating layer. The semiconductor element is mounted on the upper surface side of the circuit substrate. The conductive shielding layer covers the sealing resin layer and part of an end portion of the circuit substrate. Any of the plurality of vias and the conductive shielding layer are electrically connected.

摘要翻译： 根据一个实施例，半导体器件包括电路基板，半导体元件，密封树脂层和导电屏蔽层。 电路基板包括绝缘层，形成设置在绝缘层的上表面侧的第一互连层的多个互连，形成设置在绝缘层的下表面侧的第二互连层的多个互连，以及多个 从绝缘层的上表面到下表面穿透的通孔。 半导体元件安装在电路基板的上表面侧。 导电屏蔽层覆盖密封树脂层和电路基板端部的一部分。 多个通孔和导电屏蔽层中的任何一个电连接。

公开(公告)号：US20130225102A1

公开(公告)日：2013-08-29

申请号：US13603790

申请日：2012-09-05

申请人： Yukako TSUTSUMI ,  Koh HASHIMOTO ,  Takayoshi ITO ,  Koji AKITA ,  Keiju YAMADA

发明人： Yukako TSUTSUMI ,  Koh HASHIMOTO ,  Takayoshi ITO ,  Koji AKITA ,  Keiju YAMADA

IPC分类号： H01L31/02 ,  H04B1/40

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L23/66 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1026 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01Q9/00 ,  H01Q13/00 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one embodiment, a wireless device includes a board, a semiconductor chip, a radiation element, a sealing resin, a conductive layer, and a first conductive wall. The semiconductor chip is mounted on the board and includes a transmission/reception circuit. The radiation element is formed on the board. The sealing resin seals the semiconductor chip. The conductive layer covers at least a portion of a surface of the sealing resin. The first conductive wall is provided between the semiconductor chip and the radiation element and is connected to the conductive layer.

摘要翻译： 根据一个实施例，无线设备包括板，半导体芯片，辐射元件，密封树脂，导电层和第一导电壁。 半导体芯片安装在电路板上，并包括发送/接收电路。 辐射元件形成在板上。 密封树脂密封半导体芯片。 导电层覆盖密封树脂表面的至少一部分。 第一导电壁设置在半导体芯片和辐射元件之间并连接到导电层。

公开(公告)号：US08874048B2

公开(公告)日：2014-10-28

申请号：US13603790

申请日：2012-09-05

申请人： Yukako Tsutsumi ,  Koh Hashimoto ,  Takayoshi Ito ,  Koji Akita ,  Keiju Yamada

发明人： Yukako Tsutsumi ,  Koh Hashimoto ,  Takayoshi Ito ,  Koji Akita ,  Keiju Yamada

IPC分类号： H03C1/52 ,  H04B1/38

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L23/66 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1026 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01Q9/00 ,  H01Q13/00 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one embodiment, a wireless device includes a board, a semiconductor chip, a radiation element, a sealing resin, a conductive layer, and a first conductive wall. The semiconductor chip is mounted on the board and includes a transmission/reception circuit. The radiation element is formed on the board. The sealing resin seals the semiconductor chip. The conductive layer covers at least a portion of a surface of the sealing resin. The first conductive wall is provided between the semiconductor chip and the radiation element and is connected to the conductive layer.

摘要翻译： 根据一个实施例，无线设备包括板，半导体芯片，辐射元件，密封树脂，导电层和第一导电壁。 半导体芯片安装在电路板上，并包括发送/接收电路。 辐射元件形成在板上。 密封树脂密封半导体芯片。 导电层覆盖密封树脂表面的至少一部分。 第一导电壁设置在半导体芯片和辐射元件之间并连接到导电层。

公开(公告)号：US20120015687A1

公开(公告)日：2012-01-19

申请号：US13181737

申请日：2011-07-13

申请人： Keiju YAMADA ,  Takashi Yamazaki ,  Masatoshi Fukuda ,  Yasuhiro Koshio

发明人： Keiju YAMADA ,  Takashi Yamazaki ,  Masatoshi Fukuda ,  Yasuhiro Koshio

IPC分类号： H04W88/02 ,  H01L23/552

CPC分类号： H01L23/552 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： According to an embodiment, a semiconductor package includes a semiconductor chip mounted on an interposer board, a encapsulant sealing the semiconductor chip, and a conductive shielding layer covering the encapsulant and at least part of a side surface of the interposer board. The interposer board has plural vias through an insulating substrate. A part of the plural vias has a cutting plane exposing to the side surface of the interposer board and cut in a thickness direction of the interposer board. The cutting plane of the via is electrically connected to the conductive shielding layer.

摘要翻译： 根据实施例，半导体封装包括安装在插入板上的半导体芯片，密封半导体芯片的密封剂以及覆盖密封剂的导电屏蔽层和插入板的侧表面的至少一部分。 插入板具有通过绝缘基板的多个通路。 多个通孔的一部分具有暴露于插入板的侧表面并在插入板的厚度方向上切割的切割平面。 通孔的切割平面电连接到导电屏蔽层。

公开(公告)号：US20130222401A1

公开(公告)日：2013-08-29

申请号：US13600670

申请日：2012-08-31

申请人： Takayoshi ITO ,  Koh HASHIMOTO ,  Yukako TSUTSUMI ,  Koji AKITA ,  Keiju YAMADA

发明人： Takayoshi ITO ,  Koh HASHIMOTO ,  Yukako TSUTSUMI ,  Koji AKITA ,  Keiju YAMADA

IPC分类号： H01L25/16 ,  G06F13/14

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01P5/028 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to the embodiments, a semiconductor package includes a semiconductor chip, a first conductive layer, a second conductive layer, and a power feeder. The semiconductor chip is provided on a substrate, is sealed with a resin, and contains a transmission/reception circuit. The first conductive layer is grounded and covers a first region on a surface of the resin. The second conductive layer is not grounded and covers a second region on the surface of the resin other than the first region. A power feeder electrically connects the semiconductor chip to the second conductive layer.

摘要翻译： 根据实施例，半导体封装包括半导体芯片，第一导电层，第二导电层和馈电器。 半导体芯片设置在基板上，用树脂密封，并且包含发送/接收电路。 第一导电层接地并覆盖树脂表面上的第一区域。 第二导电层不接地并且覆盖除了第一区域之外的树脂表面上的第二区域。 电源馈电器将半导体芯片电连接到第二导电层。

公开(公告)号：US20130222196A1

公开(公告)日：2013-08-29

申请号：US13603864

申请日：2012-09-05

申请人： Koh HASHIMOTO ,  Yukako Tsutsumi ,  Takayoshi Ito ,  Koji Akita ,  Keiju Yamada

发明人： Koh HASHIMOTO ,  Yukako Tsutsumi ,  Takayoshi Ito ,  Koji Akita ,  Keiju Yamada

IPC分类号： H01Q1/38 ,  H01Q13/10

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01Q9/0407 ,  H01Q9/265 ,  H01Q9/285 ,  H01Q13/10 ,  H01Q23/00 ,  H01L2924/00

摘要： According to one embodiment, a wireless device includes a circuit board, a semiconductor chip, a sealing resin, a conductive film, and an antenna element. The semiconductor chip includes a transmitting/receiving circuit and is mounted on the circuit board. The sealing resin seals the semiconductor chip. The conductive film covers a first surface portion of the sealing resin. An aperture is formed in a portion of the conductive film that corresponds to a second surface portion of the sealing resin other than the first surface portion, and the second surface portion is included in a side surface of the sealing resin and closest to an antenna terminal connected to the antenna element.

摘要翻译： 根据一个实施例，无线装置包括电路板，半导体芯片，密封树脂，导电膜和天线元件。 半导体芯片包括发送/接收电路并且安装在电路板上。 密封树脂密封半导体芯片。 导电膜覆盖密封树脂的第一表面部分。 在导电膜的与第一表面部分以外的密封树脂的第二表面部分相对应的部分中形成有孔，并且第二表面部分包括在密封树脂的侧表面中并且最靠近天线端子 连接到天线元件。