公开(公告)号：US08434664B2

公开(公告)日：2013-05-07

申请号：US12025400

申请日：2008-02-04

申请人： Kengo Aoya

发明人： Kengo Aoya

IPC分类号： B23K20/03

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L24/742 ,  H01L24/83 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/83 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K2203/0292 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/104 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device for loading electro-conductive ball onto the terminal regions of a substrate more correctly and reliably is disclosed. Micro-ball loading device (200) may have the following parts: backing plate (220) supporting substrate (100) such that plural terminal regions (108) formed on one surface of substrate (100) are free, transfer mask (210), which contains a metal mask and has plural through-holes (216) formed corresponding to plural terminal regions (108) of the substrate, fixing block (230) onto which end portions (210a) of the transfer mask are fixed such that transfer mask (210) faces one surface of the substrate, and magnet part (240), which attaches transfer mask (210) by magnetic force to the side of backing plate (220); for magnet part (240), the attachment force to the center portion of the substrate is less than that of the peripheral edge portion.

摘要翻译： 公开了一种用于将导电球加载到基板的端子区域上更加正确和可靠的装置。 微球加载装置（200）可以具有以下部件：支撑基板（100）的背板（220），使得形成在基板（100）的一个表面上的多个端子区域（108）是自由的，转印掩模（210）， 其包含金属掩模，并且具有与基板的多个端子区域（108）对应形成的多个通孔（216），固定块（230）固定在转印掩模的端部（210a）上，使得转印掩模 210）面向基板的一个表面，以及通过磁力将转印掩模（210）附着到背板（220）侧的磁体部分（240）; 对于磁体部分（240），对基板的中心部分的附着力小于周缘部分的附着力。

公开(公告)号：US20130082383A1

公开(公告)日：2013-04-04

申请号：US13251544

申请日：2011-10-03

申请人： KENGO AOYA

发明人： KENGO AOYA

IPC分类号： H01L23/498 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L23/13 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/1403

摘要： An electronic assembly includes an interposer having an inner aperture including a first side and a second side. A through-substrate-via (TSV) die is within the aperture including a plurality of TSVs, a bottomside, and a topside including topside bonding features thereon including of a first portion of the plurality of TSVs or pads coupled to the first TSVs. A ball grid array (BGA) is coupled to the topside bonding features of the TSV die and to pads on the second side of the interposer. Mold material is over at least a portion of the first side of the interposer, and within the inner aperture to fill a gap between the TSV die and the interposer. Respective ones of a second portion of the plurality of TSVs from the bottomside of the TSV die are connected by a lateral connector to pads on the first side of the interposer.

摘要翻译： 电子组件包括具有包括第一侧和第二侧的内孔的插入器。 贯穿基板通孔（TSV）管芯在孔内包括多个TSV，底部和顶部，其中包括顶部结合特征，其上包括耦合到第一TSV的多个TSV的第一部分或焊盘。 球栅阵列（BGA）被耦合到TSV管芯的顶侧结合特征以及插入件的第二侧上的焊盘。 模具材料在插入件的第一侧的至少一部分之上，并且在内部孔内，以填充TSV管芯和插入件之间的间隙。 来自TSV管芯的底部的多个TSV的第二部分中的相应的部分通过横向连接器连接到插入器的第一侧上的焊盘。

公开(公告)号：US08294261B2

公开(公告)日：2012-10-23

申请号：US12888135

申请日：2010-09-22

申请人： Kazuaki Mawatari ,  Kengo Aoya ,  Yoshikatsu Umeda ,  Jeffrey A. West

发明人： Kazuaki Mawatari ,  Kengo Aoya ,  Yoshikatsu Umeda ,  Jeffrey A. West

IPC分类号： H01L23/34

CPC分类号： H01L24/16 ,  H01L23/3677 ,  H01L23/481 ,  H01L25/0657 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16235 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00014

摘要： An integrated circuit (IC) device includes a substrate having a top surface including substrate pads, and a through substrate via (TSV) die including a semiconductor substrate including a topside semiconductor surface having active circuitry and a bottomside surface. The topside semiconductor surface includes bonding connectors that are coupled to the substrate pads on the top surface of the substrate. A plurality of TSVs include an inner metal core that extends from the topside semiconductor surface to protruding TSV tips which extend out from the bottomside surface. At least one of the plurality of TSVs are dummy TSVs that have their protruding TSV tips exclusive of any electrically connection thereto that provide additional surface area that enhances heat dissipation from the bottomside of the TSV die.

摘要翻译： 集成电路（IC）装置包括具有包括衬底焊盘的顶表面的衬底和包括半导体衬底的贯穿衬底通孔（TSV）裸片，该半导体衬底包括具有有源电路和底部表面的顶侧半导体表面。 顶侧半导体表面包括结合连接器，其连接到衬底的顶表面上的衬底焊盘。 多个TSV包括从顶侧半导体表面延伸到从底部表面延伸出的突出TSV尖端的内部金属芯。 多个TSV中的至少一个是具有突出的TSV尖端的虚拟TSV，其不提供任何与其电连接的TSV提供额外的表面积，从而增强了TSV管芯的底部散热。

公开(公告)号：US20110186990A1

公开(公告)日：2011-08-04

申请号：US12888135

申请日：2010-09-22

申请人： Kazuaki Mawatari ,  Kengo Aoya ,  Yoshikatsu Umeda ,  Jeffrey A. West

发明人： Kazuaki Mawatari ,  Kengo Aoya ,  Yoshikatsu Umeda ,  Jeffrey A. West

IPC分类号： H01L23/48

CPC分类号： H01L24/16 ,  H01L23/3677 ,  H01L23/481 ,  H01L25/0657 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16235 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00014

摘要： An integrated circuit (IC) device includes a substrate having a top surface including substrate pads, and a through substrate via (TSV) die including a semiconductor substrate including a topside semiconductor surface having active circuitry and a bottomside surface. The topside semiconductor surface includes bonding connectors that are coupled to the substrate pads on the top surface of the substrate. A plurality of TSVs include an inner metal core that extends from the topside semiconductor surface to protruding TSV tips which extend out from the bottomside surface. At least one of the plurality of TSVs are dummy TSVs that have their protruding TSV tips exclusive of any electrically connection thereto that provide additional surface area that enhances heat dissipation from the bottomside of the TSV die.

摘要翻译： 集成电路（IC）装置包括具有包括衬底焊盘的顶表面的衬底和包括半导体衬底的贯穿衬底通孔（TSV）裸片，该半导体衬底包括具有有源电路和底部表面的顶侧半导体表面。 顶侧半导体表面包括结合连接器，其连接到衬底的顶表面上的衬底焊盘。 多个TSV包括从顶侧半导体表面延伸到从底部表面延伸出的突出TSV尖端的内部金属芯。 多个TSV中的至少一个是具有突出的TSV尖端的虚拟TSV，其不提供任何与其电连接的TSV提供额外的表面积，从而增强了TSV管芯的底部散热。

公开(公告)号：US07882625B2

公开(公告)日：2011-02-08

申请号：US12033128

申请日：2008-02-19

申请人： Kengo Aoya

发明人： Kengo Aoya

IPC分类号： H05K3/30

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/41 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The objective of this invention is to provide a transfer mask that is able to accurately pass micro-balls onto terminal areas on a substrate. A thin plate transfer mask 200 is arranged facing a substrate 100, and possesses a plurality of through-holes 242 for the purpose of passing micro-balls (solder balls) onto a plurality of terminal areas 108 formed on one surface of a substrate 100. Slits 230, 232, 234, 236 formed in the surface of the transfer mask 200 extending in the length direction and the width direction of the transfer mask 200, inside the substrate edge P1 and outside the area in which the plurality of through-holes 242 is formed when it is facing the substrate 100.

摘要翻译： 本发明的目的是提供一种能够将微球精确地传递到基底上的终端区域的转印掩模。 薄板转印掩模200面向衬底100布置，并且具有多个通孔242，用于将微球（焊球）传递到形成在衬底100的一个表面上的多个端子区域108上。 在转印掩模200的表面上形成的狭缝230,232,234,236，其在基板边缘P1的内部和在多个通孔242的区域的外部沿着传送掩模200的长度方向和宽度方向延伸 当其面向基板100时形成。

公开(公告)号：US20100207273A1

公开(公告)日：2010-08-19

申请号：US12598648

申请日：2008-01-17

申请人： Kengo Aoya

发明人： Kengo Aoya

IPC分类号： H01L23/498 ,  H01L21/3205

CPC分类号： B23K3/0623 ,  H01L21/4853 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/181 ,  H05K3/3478 ,  H05K2203/0292 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Provided is a feeding method for feeding conductive balls to the insides of through holes of a mask reliably and efficiently so as to match a fine pitch. In the feeding method, a head (300), which can move over the surface of a feeding mask (200) and which is caused to give a directivity to micro balls (340) by a squeezee (310) for rotating around a feed port (320) to be fed with the micro balls (340), is used to feed the micro balls (340) to the insides of a plurality of through holes (210) formed in the feeding mask (200). At this time, the head (300) is moved while being oscillated, to feed the micro balls (340) to the insides of the through holes (210) while improving the probability, on which the micro balls (340) meet the through holes (210) of the feeding mask (200).

摘要翻译： 提供了一种用于将导电球可靠且有效地馈送到掩模的通孔的内部以便匹配细间距的馈送方法。 在进给方法中，头部（300）可以在进给口罩（200）的表面上移动，并且通过挤压器（310）向微球（340）提供指向性，以围绕进给口 （320）被供给到微球（340），用于将微球（340）馈送到形成在供给掩模（200）中的多个通孔（210）的内部。 此时，头部（300）在振动的同时移动，以将微球（340）馈送到通孔（210）的内部，同时提高微球（340）在其上与通孔 （210）。

公开(公告)号：US20090001132A1

公开(公告)日：2009-01-01

申请号：US12025400

申请日：2008-02-04

申请人： Kengo Aoya

发明人： Kengo Aoya

IPC分类号： B23K3/06

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L24/742 ,  H01L24/83 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/83 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K2203/0292 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/104 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device for loading electro-conductive ball onto the terminal regions of a substrate more correctly and reliably is disclosed. Micro-ball loading device (200) may have the following parts: backing plate (220) supporting substrate (100) such that plural terminal regions (108) formed on one surface of substrate (100) are free, transfer mask (210), which contains a metal mask and has plural through-holes (216) formed corresponding to plural terminal regions (108) of the substrate, fixing block (230) onto which end portions (210a) of the transfer mask are fixed such that transfer mask (210) faces one surface of the substrate, and magnet part (240), which attaches transfer mask (210) by magnetic force to the side of backing plate (220); for magnet part (240), the attachment force to the center portion of the substrate is less than that of the peripheral edge portion.

摘要翻译： 公开了一种用于将导电球加载到基板的端子区域上更加正确和可靠的装置。 微球加载装置（200）可以具有以下部件：支撑基板（100）的背板（220），使得形成在基板（100）的一个表面上的多个端子区域（108）是自由的，转印掩模（210）， 其包含金属掩模，并且具有与基板的多个端子区域（108）对应形成的多个通孔（216），固定块（230）固定在转印掩模的端部（210a）上，使得转印掩模 210）面向基板的一个表面，以及通过磁力将转印掩模（210）附着到背板（220）侧的磁体部分（240）; 对于磁体部分（240），对基板的中心部分的附着力小于周缘部分的附着力。

公开(公告)号：US20080196226A1

公开(公告)日：2008-08-21

申请号：US12033128

申请日：2008-02-19

申请人： Kengo Aoya

发明人： Kengo Aoya

IPC分类号： H01L21/60 ,  H01L21/67

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/41 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The objective of this invention is to provide a transfer mask that is able to accurately pass micro-balls onto terminal areas on a substrate. A thin plate transfer mask 200 is arranged facing a substrate 100, and possesses a plurality of through-holes 242 for the purpose of passing micro-balls (solder balls) onto a plurality of terminal areas 108 formed on one surface of a substrate 100. Slits 230, 232, 234, 236 formed in the surface of the transfer mask 200 extending in the length direction and the width direction of the transfer mask 200, inside the substrate edge P1 and outside the area in which the plurality of through-holes 242 is formed when it is facing the substrate 100.

摘要翻译： 本发明的目的是提供一种能够将微球精确地传递到基底上的终端区域的转印掩模。 薄板转印掩模200面向衬底100布置，并且具有多个通孔242，用于将微球（焊球）传递到形成在衬底100的一个表面上的多个端子区域108上。 在传送掩模200的表面上形成的狭缝230,232,234,236，其在基板边缘P1内部和沿着传送掩模200的长度方向和宽度方向延伸的多个通孔 当它面向衬底100时形成242。