公开(公告)号：US20060200958A1

公开(公告)日：2006-09-14

申请号：US11430152

申请日：2006-05-08

申请人： L. deRochemont ,  Peter Farmer

发明人： L. deRochemont ,  Peter Farmer

IPC分类号： H01G7/00 ,  H05K3/20 ,  H05K3/30

CPC分类号： H01L21/4807 ,  B32B15/00 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/642 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68377 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45147 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0207 ,  H05K1/0271 ,  H05K1/0272 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/202 ,  H05K3/38 ,  H05K3/4007 ,  H05K3/46 ,  H05K3/4629 ,  H05K3/4641 ,  H05K2201/0355 ,  H05K2201/09118 ,  H05K2203/0369 ,  H05K2203/1476 ,  Y10S428/901 ,  Y10T29/43 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00014

摘要： Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.

公开(公告)号：US6027826A

公开(公告)日：2000-02-22

申请号：US538264

申请日：1995-10-02

申请人： Pierre L. deRochemont ,  Daniel E. Ryder ,  Michael J. Suscavage ,  Mikhail Klugerman

发明人： Pierre L. deRochemont ,  Daniel E. Ryder ,  Michael J. Suscavage ,  Mikhail Klugerman

IPC分类号： C23C16/40 ,  C23C16/56 ,  H01L39/02 ,  H01L39/14 ,  H01L39/24 ,  B32B15/04 ,  B32B18/00 ,  H01B12/00 ,  H01L39/00

CPC分类号： C23C16/408 ,  C23C16/56 ,  H01L39/02 ,  H01L39/143 ,  H01L39/2451 ,  H01L39/2477 ,  Y02T50/67 ,  Y10S428/928 ,  Y10S428/93 ,  Y10S505/701 ,  Y10T428/294 ,  Y10T428/31678

摘要： The invention provides methods to manufacture dense, complex c-axis oriented ceramic oxide layers with thickness greater than 2.5 microns (.mu.m) on a metallic substrate (composites) without the use of an interfacial barrier, buffer, or surface layer using a metalorganic deposition process and thermomechanical reaction treatments is disclosed. A porous amorphous metal oxide ceramic deposit is formed directly on the substrate by spray pyrolyzing a mixed metalorganic precursor solution onto the metallic substrate. The metallic substrate has been previously heated to temperatures greater than the boiling point of the organic solvent and are high enough to initiate in situ decomposition of the metalorganic precursor salts. The process does not apply the precursor solution to the substrate as a liquid coating that is pyrolyzed in subsequent processing steps. The resultant porous amorphous oxide deposit is processed into a dense amorphous ceramic, or a fully crystallized c-axis oriented ceramic through a series of mechanical compression and short reaction treatments that are used to crystallize the amorphous ceramic layer. The inventive method applies to making complex ceramic oxides including superconducting compositions of bismuth cuprate ceramic, piezoelectric or insulating compositions. The composites so produced are useful in devices that include ceramic sputtering targets, heat shields, electrically conducting wires, magnetic solenoids, electromagnetic shielding, and energy storage devices. The invention also provides the ceramic-metal composites so made.

摘要翻译： 本发明提供了在金属基材（复合材料）上制造厚度大于2.5微米（μm）的致密的，复杂的c轴取向的陶瓷氧化物层的方法，而不使用界面屏障，缓冲层或表面层，使用金属有机沉积 公开了工艺和热机械反应处理。 通过将混合的金属有机前体溶液喷雾热分解到金属基底上，直接在基底上形成多孔无定形金属氧化物陶瓷沉积物。 金属基底已经预先加热到高于有机溶剂的沸点的温度，并且足够高以引发金属有机前体盐的原位分解。 该方法不将前体溶液作为在随后的加工步骤中热解的液体涂层施加于基材。 所得的多孔无定形氧化物沉积物通过用于结晶无定形陶瓷层的一系列机械压缩和短反应处理而被加工成致密无定形陶瓷或完全结晶的c轴取向陶瓷。 本发明的方法适用于制备复合陶瓷氧化物，包括铜酸铋陶瓷，压电或绝缘组合物的超导组合物。 如此生产的复合材料可用于包括陶瓷溅射靶，隔热罩，导电线，磁螺线管，电磁屏蔽和储能装置的器件。 本发明还提供如此制成的陶瓷 - 金属复合材料。

公开(公告)号：US20070139976A1

公开(公告)日：2007-06-21

申请号：US11620042

申请日：2007-01-04

申请人： L. deRochemont

发明人： L. deRochemont

IPC分类号： H02M3/335

CPC分类号： H01F27/2804 ,  B82Y30/00 ,  C04B2235/768 ,  C04B2235/781 ,  H01C7/003 ,  H01C17/003 ,  H01C17/06533 ,  H01F3/00 ,  H01F5/003 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01F41/041 ,  H01F2027/2809 ,  H01G4/10 ,  H01G4/33 ,  H01L23/64 ,  H01L28/10 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01037 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/207 ,  H05K2201/017 ,  H05K2201/0175 ,  H05K2201/09763 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/121 ,  Y10T29/49021

摘要： A power management module, provides an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element including one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout the ceramic element.

摘要翻译： 电源管理模块提供一种电感器，其包括设置在铁磁性陶瓷元件周围的一个或多个电导体，所述铁磁陶瓷元件包括在整个陶瓷元件中具有小于或等于1.50摩尔％的金属氧化物组成均匀性波动的一种或多种金属氧化物。