公开(公告)号：US06818985B1

公开(公告)日：2004-11-16

申请号：US10026134

申请日：2001-12-22

Applicant: Roberto Coccioli ,  Mohamed A. Megahed ,  Trang N. Trinh ,  Larry D. Vittorini ,  John S. Walley

Inventor： Roberto Coccioli ,  Mohamed A. Megahed ,  Trang N. Trinh ,  Larry D. Vittorini ,  John S. Walley

IPC: H05K720

CPC classification number: H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48684 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48784 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/8548 ,  H01L2224/85484 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20753 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q23/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: According to one exemplary embodiment, a structure comprises a laminate substrate having a top surface for receiving a semiconductor die. The structure further comprises an antenna element situated on the top surface of the laminate substrate, where the antenna element is coupled to a laminate substrate bond pad. For example, the antenna element may also be coupled to the laminate substrate bond pad by a trace on the top surface of the laminate substrate. According to this exemplary embodiment, the structure further comprises a bonding wire that provides an electrical connection between the laminate substrate bond pad and a semiconductor die bond pad. For example, the input impedance of the antenna element coupled to the laminate substrate bond pad may match the output impedance at the semiconductor die bond pad. The structure may further comprise a capacitor coupled to the antenna element.

Abstract translation: 根据一个示例性实施例，结构包括具有用于接收半导体管芯的顶表面的层压衬底。 该结构还包括位于层压基板的顶表面上的天线元件，其中天线元件耦合到层压基板接合焊盘。 例如，天线元件还可以通过层叠基板的顶表面上的迹线耦合到层压基板接合焊盘。 根据该示例性实施例，该结构还包括提供层压衬底接合焊盘和半导体管芯接合焊盘之间的电连接的接合线。 例如，耦合到层叠衬底接合焊盘的天线元件的输入阻抗可以匹配半导体管芯接合焊盘处的输出阻抗。 该结构还可以包括耦合到天线元件的电容器。

公开(公告)号：US06770955B1

公开(公告)日：2004-08-03

申请号：US10020105

申请日：2001-12-15

Applicant: Roberto Coccioli ,  Mohamed A. Megahed ,  Trang N. Trinh ,  Larry D. Vittorini ,  John S. Walley

Inventor： Roberto Coccioli ,  Mohamed A. Megahed ,  Trang N. Trinh ,  Larry D. Vittorini ,  John S. Walley

IPC: H01L23552

CPC classification number: H01Q1/2283 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2223/6688 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01Q1/38 ,  H05K1/0218 ,  H05K1/0243 ,  H05K1/112 ,  H05K3/3436 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: One exemplary embodiment is a structure comprising a laminate substrate having a top surface for receiving a semiconductor die. The exemplary structure further comprises an antenna element situated on a bottom surface of the laminate substrate, where the antenna element is suitable for connection to the semiconductor die. According to this exemplary embodiment, the structure further comprises a laminate substrate reference pad in the laminate substrate, where the laminate substrate reference pad is situated over the antenna element. The exemplary structure further comprises at least one laminate substrate reference via situated at a side of the antenna element. The at least one laminate substrate reference via can be electrically connected to the laminate substrate reference pad. The at least one laminate substrate reference via can be electrically coupled to a printed circuit board reference via in a printed circuit board.

Abstract translation: 一个示例性实施例是包括具有用于接收半导体管芯的顶表面的层压衬底的结构。 该示例性结构还包括位于层压基板的底表面上的天线元件，其中天线元件适于连接到半导体管芯。 根据该示例性实施例，该结构还包括层合衬底中的层压衬底参考焊盘，其中层压衬底参考焊盘位于天线元件上方。 示例性结构还包括位于天线元件侧面的至少一个层叠基板参考通孔。 至少一个层压基板参考通孔可以电连接到层压基板参考焊盘。 所述至少一个层叠基板参考通孔可以电连接到印刷电路板中的印刷电路板参考通孔。

公开(公告)号：US5940027A

公开(公告)日：1999-08-17

申请号：US940634

申请日：1997-09-30

Applicant: Daniel C. Forseth ,  Paul G. Jagnow ,  Mark W. Johnson ,  F. Britt Snodgrass ,  Larry D. Vittorini

Inventor： Daniel C. Forseth ,  Paul G. Jagnow ,  Mark W. Johnson ,  F. Britt Snodgrass ,  Larry D. Vittorini

IPC: G01S1/00 ,  G04G3/02 ,  G01S5/02 ,  H04B7/185

CPC classification number: G01S19/235 ,  G04G3/022 ,  H03L1/027

Abstract: A global positioning system (GPS) receiver and high accuracy low power time source (HAL) are disclosed. The HAL provides a time source having an accuracy which is high enough for the receiver to achieve fast direct Y-code acquisition. The HAL includes an oscillator adapted to provide an uncompensated frequency signal at a desired frequency. Frequency conversion circuitry receives the uncompensated frequency signal and a control signal as inputs, and provides as an output a compensated frequency signal having an average compensated frequency which is closer to the desired frequency than is the average uncompensated frequency. A temperature sensor provides an output indicative of a temperature of the oscillator. Frequency error determining circuitry determines an error value, as a function of the temperature sensor output, which is indicative of a quantity of frequency error over time in the uncompensated frequency signal. The frequency error determining circuitry generates the control signal as a function of the determined quantity of frequency error in the uncompensated frequency signal. A counter receives the compensated frequency signal from the frequency conversion circuitry and provides as an output a digital representation of a time period based upon the compensated frequency signal.

Abstract translation: 公开了一种全球定位系统（GPS）接收机和高精度低功率时间源（HAL）。 HAL提供了具有足够高的准确度的时间源，用于接收机实现快速的直接Y码采集。 HAL包括适于以期望的频率提供未补偿的频率信号的振荡器。 频率转换电路接收未补偿的频率信号和控制信号作为输入，并且提供具有平均补偿频率的补偿频率信号作为输出，其平均补偿频率比平均未补偿频率更接近期望频率。 温度传感器提供指示振荡器的温度的输出。 频率误差确定电路确定作为温度传感器输出的函数的误差值，其表示在未补偿的频率信号中随时间的频率误差量。 频率误差确定电路根据所确定的未补偿频率信号中的频率误差量产生控制信号。 计数器从频率转换电路接收经补偿的频率信号，并根据经补偿的频率信号提供时间周期的数字表示作为输出。