公开(公告)号：US06680653B2

公开(公告)日：2004-01-20

申请号：US09742256

申请日：2000-12-20

Applicant: Scott A. Griffith ,  Trang N. Trinh ,  Pete Good

Inventor： Scott A. Griffith ,  Trang N. Trinh ,  Pete Good

IPC: H03L700

CPC classification number: H03L7/18 ,  H03L7/0898

Abstract: A system provided for controlling an output frequency of a voltage controlled oscillator relative to a reference frequency. A method includes the steps of detecting a phase error between a divided output of the voltage controlled oscillator and the reference frequency, pumping a frequency control input of the voltage controlled oscillator with the phase error and adjusting a pumping gain based upon a magnitude of the frequency control input to the voltage controlled oscillator. This apparatus includes a phase detector adapted to detect the phase error between the divided output of the voltage controlled oscilator and the reference frequency and a charge pump adapted to pump the frequency control input of the voltage controlled oscillator with the phase error. The apparatus also includes a gain controller adapted to adjust the pumping gain based upon the magnitude of the frequency control input to the voltage controlled oscillator.

Abstract translation: 一种用于控制压控振荡器相对于参考频率的输出频率的系统。 一种方法包括以下步骤：检测压控振荡器的分压输出与参考频率之间的相位误差，以相位误差泵送压控振荡器的频率控制输入，并根据频率的幅度调节泵浦增益 控制输入​​到压控振荡器。该装置包括相位检测器，用于检测压控振荡器的分频输出与参考频率之间的相位误差，以及电荷泵，其适于泵送压控振荡器的频率控制输入， 相位误差。 该装置还包括增益控制器，其适于基于对压控振荡器的频率控制输入的幅度来调节泵浦增益。

公开(公告)号：US5125111A

公开(公告)日：1992-06-23

申请号：US576755

申请日：1990-09-04

Applicant: Trang N. Trinh

Inventor： Trang N. Trinh

IPC: H01P5/10 ,  H03D7/14 ,  H03D9/06

CPC classification number: H01P5/1015 ,  H03D9/0633 ,  H03D2200/0013 ,  H03D7/1408

Abstract: A passive uniplanar double-balanced RF mixing apparatus, comprising a planar support substrate with first and second conductive layers disposed on first and second sides, and first and second linear slotlines having open terminations on a first end thereof formed in the first conductive layer. First and second coplanar waveguides are also formed in the first conductive layer with each having one end electrically coupled to first and of said first and second slotlines, respectively. A first balun comprises the first coplanar waveguide connection to the first slotline, and a second balun comprises the second coplanar waveguide connection the second slotline. An isolation gap formed in the first conductive layer adjacent to and between the first and second slotlines provided electrical isolation between the first and second baluns and waveguides for RF-toLO isolation. A transfer element, in the form of a third coplanar waveguide or a conductive via, is electrically connected to one of the baluns adjacent to, but removed a predetermined distance from, the associated slotline for transferring intermediate oscillator frequency signals. A folded diode ring is connected between the slotlines and to the first and second baluns.

Abstract translation: 一种无源单平面双平衡射频混合装置，包括平面支撑基板，其具有设置在第一和第二侧上的第一和第二导电层，以及第一和第二线性开槽线，其第一端形成在第一导电层中。 第一和第二共面波导也形成在第一导电层中，其中每一个具有分别与第一和第一和第二开槽线电耦合的一端。 第一平衡 - 不平衡变换器包括与第一时隙线的第一共面波导连接，并且第二平衡 - 不平衡变换器包括第二共面波导连接第二槽线。 形成在与第一和第二槽槽相邻并且在第一和第二槽槽之间的第一导电层中的隔离间隙提供了第一和第二平衡 - 不平衡变换器之间的电隔离以及RF-toLO隔离的波导。 形式为第三共面波导或导电通孔的传输元件电连接到与关联的时隙线相邻但已移除预定距离的一个不平衡变换器，用于传送中间振荡器频率信号。 折叠的二极管环连接在插槽线与第一和第二巴伦之间。

公开(公告)号：US06770955B1

公开(公告)日：2004-08-03

申请号：US10020105

申请日：2001-12-15

Applicant: Roberto Coccioli ,  Mohamed A. Megahed ,  Trang N. Trinh ,  Larry D. Vittorini ,  John S. Walley

Inventor： Roberto Coccioli ,  Mohamed A. Megahed ,  Trang N. Trinh ,  Larry D. Vittorini ,  John S. Walley

IPC: H01L23552

CPC classification number: H01Q1/2283 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2223/6688 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01Q1/38 ,  H05K1/0218 ,  H05K1/0243 ,  H05K1/112 ,  H05K3/3436 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: One exemplary embodiment is a structure comprising a laminate substrate having a top surface for receiving a semiconductor die. The exemplary structure further comprises an antenna element situated on a bottom surface of the laminate substrate, where the antenna element is suitable for connection to the semiconductor die. According to this exemplary embodiment, the structure further comprises a laminate substrate reference pad in the laminate substrate, where the laminate substrate reference pad is situated over the antenna element. The exemplary structure further comprises at least one laminate substrate reference via situated at a side of the antenna element. The at least one laminate substrate reference via can be electrically connected to the laminate substrate reference pad. The at least one laminate substrate reference via can be electrically coupled to a printed circuit board reference via in a printed circuit board.

Abstract translation: 一个示例性实施例是包括具有用于接收半导体管芯的顶表面的层压衬底的结构。 该示例性结构还包括位于层压基板的底表面上的天线元件，其中天线元件适于连接到半导体管芯。 根据该示例性实施例，该结构还包括层合衬底中的层压衬底参考焊盘，其中层压衬底参考焊盘位于天线元件上方。 示例性结构还包括位于天线元件侧面的至少一个层叠基板参考通孔。 至少一个层压基板参考通孔可以电连接到层压基板参考焊盘。 所述至少一个层叠基板参考通孔可以电连接到印刷电路板中的印刷电路板参考通孔。

公开(公告)号：US5132648A

公开(公告)日：1992-07-21

申请号：US540964

申请日：1990-06-08

Applicant: Trang N. Trinh ,  Elroy C. Smith, Jr.

Inventor： Trang N. Trinh ,  Elroy C. Smith, Jr.

IPC: H01P5/12

CPC classification number: H01P5/12

Abstract: A method and apparatus are disclosed for manufacturing large Monolithic Microwave Integrated Circuit (MMIC) arrays. MMIC elements are manufactured on a substrate to form a MMIC module and first conductive vias are created in the substrate at locations corresponding to contact points for the MMIC. The MMIC module is then secured to a multi-layered ceramic backplate structure for physical rigidity and electrical interconnection. The MMIC module uses a conductive material, such as chrome, to fill or coat the vias to provide electrical contact with MMIC contact pads. Each layer of the multi-layered backplate structure has an electrical interconnection circuit or network formed thereon, and conductive vias extending through the layer at locations corresponding to preselected vias in adjacent layers and electrical contacts for MMIC modules. In further aspects of the invention, portions of the backplate also support phase control integrated circuit logic elements or devices which are electrically connected to the MMICs through the interconnection circuits to reduce off-structure connections. The backplate uses a multi-layer hybrid technique in conjunction with the via holes on the MMIC substrate to form a low cost and reliable feeding network for a large MMIC array, such as a phased-array. The invention uses RF power distribution structures in combination with advanced fabrication and assembly techniques to eliminate individually fabricated RF feedthroughs.

Abstract translation: 公开了用于制造大型单片微波集成电路（MMIC）阵列的方法和装置。 在基板上制造MMIC元件以形成MMIC模块，并且在与MMIC的接触点对应的位置处在衬底中产生第一导电通孔。 然后将MMIC模块固定到用于物理刚度和电互连的多层陶瓷背板结构。 MMIC模块使用诸如铬的导电材料来填充或涂覆通孔以提供与MMIC接触垫的电接触。 多层背板结构的每层具有形成在其上的电互连电路或网络，以及导电通孔，其在对应于相邻层中的预选通孔的位置延伸穿过该层，以及用于MMIC模块的电触点。 在本发明的另一方面，背板的部分还支持通过互连电路电连接到MMIC的相位控制集成电路逻辑元件或器件，以减少非结构连接。 背板使用多层混合技术与MMIC基板上的通孔结合，为大型MMIC阵列（如相控阵列）形成低成本且可靠的馈电网络。 本发明使用RF功率分配结构与先进的制造和组装技术结合以消除单独制造的RF馈通。

公开(公告)号：US06818985B1

公开(公告)日：2004-11-16

申请号：US10026134

申请日：2001-12-22

Applicant: Roberto Coccioli ,  Mohamed A. Megahed ,  Trang N. Trinh ,  Larry D. Vittorini ,  John S. Walley

Inventor： Roberto Coccioli ,  Mohamed A. Megahed ,  Trang N. Trinh ,  Larry D. Vittorini ,  John S. Walley

IPC: H05K720

CPC classification number: H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48684 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48784 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/8548 ,  H01L2224/85484 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20753 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q23/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: According to one exemplary embodiment, a structure comprises a laminate substrate having a top surface for receiving a semiconductor die. The structure further comprises an antenna element situated on the top surface of the laminate substrate, where the antenna element is coupled to a laminate substrate bond pad. For example, the antenna element may also be coupled to the laminate substrate bond pad by a trace on the top surface of the laminate substrate. According to this exemplary embodiment, the structure further comprises a bonding wire that provides an electrical connection between the laminate substrate bond pad and a semiconductor die bond pad. For example, the input impedance of the antenna element coupled to the laminate substrate bond pad may match the output impedance at the semiconductor die bond pad. The structure may further comprise a capacitor coupled to the antenna element.

Abstract translation: 根据一个示例性实施例，结构包括具有用于接收半导体管芯的顶表面的层压衬底。 该结构还包括位于层压基板的顶表面上的天线元件，其中天线元件耦合到层压基板接合焊盘。 例如，天线元件还可以通过层叠基板的顶表面上的迹线耦合到层压基板接合焊盘。 根据该示例性实施例，该结构还包括提供层压衬底接合焊盘和半导体管芯接合焊盘之间的电连接的接合线。 例如，耦合到层叠衬底接合焊盘的天线元件的输入阻抗可以匹配半导体管芯接合焊盘处的输出阻抗。 该结构还可以包括耦合到天线元件的电容器。

公开(公告)号：US06466770B1

公开(公告)日：2002-10-15

申请号：US09386863

申请日：1999-08-31

Applicant: Scott A. Griffith ,  Trang N. Trinh

Inventor： Scott A. Griffith ,  Trang N. Trinh

IPC: H04B102

CPC classification number: H03H7/42 ,  H04B1/0458

Abstract: A BALUN circuit comprising a lead network coupled to the positive phase output of a differential power amplifier, a negative phase output coupled to the negative phase output of the differential amplifier, and a delay element coupled in series with the lag network. The output of the lead network and the delay element are combined to form a single-ended output. The lag and lead networks may adjust the output impedances of the positive and negative phase outputs so that the output impedance of the single-ended output is set to a desired value. In one implementation, selected components of the lag and lead networks, and the delay element, comprise printed elements.

Abstract translation: 一种BALUN电路，包括耦合到差分功率放大器的正相输出的引线网络，耦合到差分放大器的负相输出的负相输出以及与滞后网络串联耦合的延迟元件。 引线网络和延迟元件的输出组合形成单端输出。 滞后和引线网络可以调节正和负相输出的输出阻抗，使得单端输出的输出阻抗被设置为期望值。 在一个实现中，滞后和引导网络的所选择的组件以及延迟元件包括打印元件。

公开(公告)号：US5265266A

公开(公告)日：1993-11-23

申请号：US679400

申请日：1991-04-02

Applicant: Trang N. Trinh

Inventor： Trang N. Trinh

IPC: H01P5/10 ,  H03D7/14 ,  H03D9/06 ,  H04B1/26

CPC classification number: H03D9/0633 ,  H01P5/1015 ,  H04B1/26 ,  H03D2200/0015 ,  H03D2200/0023 ,  H03D7/1408 ,  H03D9/0641

Abstract: A passive uniplanar double-balanced star RF mixer, comprising a substantially planar support substrate with a conductive layer of material disposed on one side and a slotline and first, second, and third coplanar waveguides formed therein which are configured to accommodate different frequencies. The first waveguide is bifurcated on one end into two waveguide branches which form first and second waveguide terminations each physically coupled to one end of the slotline. The second waveguide is electrically coupled to the first waveguide at a location spaced apart from the branches. The third waveguide is electrically coupled to the slotline at a position located approximately equi-distant from the slotline ends. A first grounding element is connected to the grounds of the first and third waveguides, and is positioned adjacent to the first branch termination. A conductive surface is enclosed by the waveguide branches and the slotline. This enclosed conductive surface has its smallest planar dimension large relative to the width of the slotline. The enclosed surface is further connected to the first and second grounding element across the coplanar waveguide branches. A second grounding element is connected to the grounds for the second and third waveguides, and is positioned adjacent to the second branch termination. First and second diodes are connected by a cathode to the center conductor of the first waveguide first end termination and at an anode to the first grounding element and the enclosed conductive surface. Third and fourth diodes are connected by an anode to the center conductor of the first waveguide the second end termination and at cathodes to the second grounding element and the enclosed conductive surface.

Abstract translation: 一种无源单平面双平衡星形RF混频器，其包括基本上平面的支撑基板，其具有布置在一侧的材料的导电层和形成在其中的槽线以及第一，第二和第三共面波导，其被配置为适应不同的频率。 第一波导在一端分叉成两个波导分支，其形成第一和第二波导终端，每个波导终端物理耦合到槽线的一端。 第二波导在与分支间隔开的位置处电耦合到第一波导。 第三波导在与槽线端近似等距离的位置处电连接到槽线。 第一接地元件连接到第一和第三波导的接地，并且被定位成与第一分支端接件相邻。 导电表面被波导分支和槽线包围。 该封闭的导电表面相对于槽线的宽度具有较小的平面尺寸。 封闭表面还跨越共面波导分支连接到第一和第二接地元件。 第二接地元件连接到第二和第三波导的接地，并且被定位成与第二分支端接件相邻。 第一和第二二极管通过阴极连接到第一波导第一端部终端的中心导体，并且在阳极处连接到第一接地元件和封闭的导电表面。 第三和第四二极管通过阳极连接到第一波导的中心导体的第二端接端子和阴极连接到第二接地元件和封闭的导电表面。

公开(公告)号：US4833482A

公开(公告)日：1989-05-23

申请号：US160449

申请日：1988-02-24

Applicant: Trang N. Trinh ,  H. John Kuno

Inventor： Trang N. Trinh ,  H. John Kuno

IPC: H01Q21/00 ,  H01Q21/06 ,  H01Q21/24

CPC classification number: H01Q21/068 ,  H01Q21/0075 ,  H01Q21/24

Abstract: An antenna arrangement is disclosed for radiating and receiving circularly polarized radiation. A first antenna array having parallel stripline conductors is disposed on the top surface of a dielectric substrate. The stripline conductors have radiating tabs protruding outwardly therefrom in a direction about 45 degrees from the stripline conductors. A second antenna array having a second plurality of stripline conductor is disposed on the substrate. The second stripline conductors are interdigitated with the first stripline conductors. The second stripline conductors also have a plurality of outwardly protruding radiating elements which form about a 90 degree angle with the first radiating elements. The first and second antenna arrays are fed with two independent signals about 90 degrees apart and will independently radiate a horizontally linearly polarized wave and a vertically linearly polarized wave respectively, which becomes a circularly polarized wave at far field. The interdigitated antenna pattern allows a compact antenna arrangement to be fabricated while lessening the tendency of adjacent antennas to cross-couple and distort the transmitted signal.

Abstract translation: 公开了用于辐射和接收圆偏振辐射的天线装置。 具有平行带状线导体的第一天线阵列设置在电介质基片的顶表面上。 带状线导体具有从与带状线导体大约45度的方向向外突出的辐射片。 具有第二多个带状线导体的第二天线阵列设置在基板上。 第二带状线导体与第一带状线导体交错。 第二带状线导体还具有与第一辐射元件形成大约90度角的多个向外突出的辐射元件。 第一和第二天线阵列分别馈送有大约90度的两个独立信号，并且将分别独立地辐射水平线性偏振波和垂直线偏振波，其在远场成为圆偏振波。 交错天线图案允许制造紧凑的天线布置，同时减少相邻天线交叉耦合和扭曲发射信号的趋势。

公开(公告)号：US4742354A

公开(公告)日：1988-05-03

申请号：US894526

申请日：1986-08-08

Applicant: Cheng P. Wen ,  Trang N. Trinh

Inventor： Cheng P. Wen ,  Trang N. Trinh

IPC: G01S7/02 ,  H01Q21/24 ,  G01S7/42 ,  H01P5/18 ,  H04B7/10

CPC classification number: H01Q21/24 ,  G01S7/026 ,  G01S13/931 ,  G01S7/023

Abstract: A radar transceiver is disclosed which operates with circularly polarized waveforms. A single circularly polarized antenna is used to transmit and receive circularly polarized waveforms. A 3-dB directional coupler splits the signal to be transmitted into two signals 90.degree. out-of-phase for transmission by the antenna and also combines the horizontal and vertical components of any return signal.

Abstract translation: 公开了一种以圆偏振波形工作的雷达收发器。 单个圆极化天线用于发送和接收圆偏振波形。 3 dB定向耦合器将要发送的信号分解为90°异相信号，以便天线传输，并且还可以组合任何返回信号的水平和垂直分量。