公开(公告)号：US08540922B2

公开(公告)日：2013-09-24

申请号：US11895756

申请日：2007-08-27

申请人： Lynn Sheehan ,  Kevin Dooley ,  Rory Jordan

发明人： Lynn Sheehan ,  Kevin Dooley ,  Rory Jordan

IPC分类号： C01B31/02

CPC分类号： H01L51/0023 ,  B82Y10/00 ,  H01L51/0048 ,  H01L51/102 ,  Y10T428/24802

摘要： A method of patterning a carbon nanotube layer includes providing a substrate comprising a carbon nanotube layer. A laser beam is generated. The laser beam is directed onto a first surface of the carbon nanotube layer. Relative movement between the laser beam and the first surface is caused, thereby forming at least one cavity feature on the first surface.

公开(公告)号：US08323439B2

公开(公告)日：2012-12-04

申请号：US12399968

申请日：2009-03-08

申请人： Kevin Dooley ,  Ratnesh Kumar Sharma ,  Lynn Sheehan ,  Sergio Escobar-Vargas ,  Anna Fenelon

发明人： Kevin Dooley ,  Ratnesh Kumar Sharma ,  Lynn Sheehan ,  Sergio Escobar-Vargas ,  Anna Fenelon

IPC分类号： B44C3/08 ,  B44C1/16 ,  B44C1/24 ,  B32B37/02 ,  B32B37/14 ,  B32B37/26 ,  B32B38/10 ,  B32B37/16 ,  B29C65/48

CPC分类号： B32B37/025 ,  B32B2313/04 ,  B32B2317/12 ,  B32B2457/00 ,  B32B2553/00 ,  F28F21/02 ,  H01L23/373 ,  H01L24/29 ,  H01L24/32 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/157 ,  Y10T29/4935

摘要： To deposit carbon nanotubes onto a substrate, an at least partially porous film is prepared so that a surface of the film has a layer of carbon nanotubes thereon. The film is positioned in relation to a surface of the substrate such that the surface of the film having the layer of carbon nanotubes is brought into contact with the surface of the substrate. Pressure is applied to the film to attach the film, including the layer of carbon nanotubes, to the surface of the substrate.

摘要翻译： 为了将碳纳米管沉积到基底上，制备至少部分多孔的膜，使得膜的表面在其上具有一层碳纳米管。 膜相对于基板的表面定位，使得具有碳纳米管层的膜的表面与基板的表面接触。 对膜施加压力以将包括碳纳米管层的膜附着到基底的表面。

公开(公告)号：US08894868B2

公开(公告)日：2014-11-25

申请号：US13267813

申请日：2011-10-06

申请人： Andy Hooper ,  Daragh Finn ,  Tim Webb ,  Lynn Sheehan ,  Kenneth Pettigrew ,  Yu Chong Tai

发明人： Andy Hooper ,  Daragh Finn ,  Tim Webb ,  Lynn Sheehan ,  Kenneth Pettigrew ,  Yu Chong Tai

IPC分类号： H01L21/302 ,  B23K26/00 ,  B44C1/22 ,  H01L21/306 ,  H01L21/3065 ,  B23K26/36 ,  B23K26/38 ,  B23K26/40 ,  H01L21/768

CPC分类号： B23K26/00 ,  B23K26/364 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/35 ,  B23K2103/50 ,  B23K2103/52 ,  B44C1/22 ,  H01L21/30604 ,  H01L21/3065 ,  H01L21/76898 ,  Y10S438/94 ,  Y10T428/24273

摘要： A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO3, HF and, optionally acetic acid.

摘要翻译： 在衬底内形成孔径（例如通孔，盲孔，沟槽，对准特征等）的方法包括用激光束照射衬底以形成具有侧壁的激光加工特征。 然后对激光加工的特征进行处理以改变激光加工特征的至少一个特征（例如，侧壁表面粗糙度，直径，锥度，纵横比，横截面轮廓等）。 可以通过使用含有HNO 3，HF和任选的乙酸的蚀刻剂溶液进行各向同性的湿蚀刻工艺来处理激光加工的特征以形成孔。

公开(公告)号：US20110298156A1

公开(公告)日：2011-12-08

申请号：US13076810

申请日：2011-03-31

申请人： Andrew Hooper ,  David Barsic ,  Kelly J. Bruland ,  Daragh S. Finn ,  Lynn Sheehan ,  Xiaoyuan Peng ,  Yasu Osako ,  Jim Dumestre ,  William J. Jordens

发明人： Andrew Hooper ,  David Barsic ,  Kelly J. Bruland ,  Daragh S. Finn ,  Lynn Sheehan ,  Xiaoyuan Peng ,  Yasu Osako ,  Jim Dumestre ,  William J. Jordens

IPC分类号： B29C35/08

CPC分类号： H01S3/102 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/389 ,  B23K26/40 ,  B23K26/705 ,  B23K2103/172 ,  B23K2103/50 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/12043 ,  H01L2924/13091 ,  H01L2924/14 ,  H01S3/0057 ,  H01S3/1305 ,  H01L2924/00 ,  H01L2924/3512

摘要： Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback.

摘要翻译： 定制的激光脉冲形状用于加工工件。 例如，半导体器件晶片在芯片附着膜（DAF）上的激光切割可以使用不同的定制的激光脉冲形状，用于将器件层划分到半导体衬底，切割半导体衬底，切割下面的DAF和/或后处理 的上模边缘以增加冲模强度。 不同的单形激光脉冲序列可以用于激光束在划线上的相应配方步骤或通过。 在另一个实施例中，划线半导体器件晶片仅使用包括彼此不同的至少两个激光脉冲的混合形激光脉冲串沿着划线的激光束的单次通过。 另外，或者在其他实施例中，可以选择一个或多个定制的脉冲形状并将其提供给工件。 选择可以基于传感器反馈。

公开(公告)号：US20090311489A1

公开(公告)日：2009-12-17

申请号：US11895756

申请日：2007-08-27

申请人： Lynn Sheehan ,  Kevin Dooley ,  Rory Jordan

发明人： Lynn Sheehan ,  Kevin Dooley ,  Rory Jordan

IPC分类号： B32B3/10 ,  B44C1/22 ,  B82B1/00 ,  B82B3/00

CPC分类号： H01L51/0023 ,  B82Y10/00 ,  H01L51/0048 ,  H01L51/102 ,  Y10T428/24802

摘要： A method of patterning a carbon nanotube layer includes providing a substrate comprising a carbon nanotube layer. A laser beam is generated. The laser beam is directed onto a first surface of the carbon nanotube layer. Relative movement between the laser beam and the first surface is caused, thereby forming at least one cavity feature on the first surface.

摘要翻译： 图案化碳纳米管层的方法包括提供包含碳纳米管层的基板。 产生激光束。 激光束被引导到碳纳米管层的第一表面上。 引起激光束与第一表面之间的相对移动，从而在第一表面上形成至少一个腔体特征。

公开(公告)号：US20180287328A1

公开(公告)日：2018-10-04

申请号：US15939136

申请日：2018-03-28

申请人： Dahv A.V. Kliner ,  Brian Victor ,  Lynn Sheehan ,  Aaron Brown

发明人： Dahv A.V. Kliner ,  Brian Victor ,  Lynn Sheehan ,  Aaron Brown

IPC分类号： H01S3/067 ,  G02B6/036 ,  G02B6/255 ,  G02B27/09 ,  G02B6/028 ,  G02F1/01 ,  B23K26/06 ,  B23K26/073

摘要： Methods, apparatus, and systems comprising a fiber-coupled laser and time-varying beam characteristics. A laser may generate an optical beam that is launched into one or more lengths of fiber, at least one of which comprises a confinement region that is optically coupled to an output. A perturbation device may modulate, through action upon the one or more lengths of fiber, a beam characteristic over a time period during which the laser is energized. A controller may cause the perturbation device to act upon the one or more lengths of fiber to impart a time-averaged beam characteristic and/or to induce a continuous variation in one or more beam characteristics during system use. A process monitor may sense a metric external to the optical system, and a feedback signal from the process monitor may be coupled into the controller. Dynamic beam characteristics may be modulated based on the feedback signal.

公开(公告)号：US20130089701A1

公开(公告)日：2013-04-11

申请号：US13267813

申请日：2011-10-06

申请人： Andy Hooper ,  Daragh Finn ,  Tim Webb ,  Lynn Sheehan ,  Kenneth Pettigrew ,  Yu Chong Tai

发明人： Andy Hooper ,  Daragh Finn ,  Tim Webb ,  Lynn Sheehan ,  Kenneth Pettigrew ,  Yu Chong Tai

IPC分类号： B23K26/00 ,  B44C1/22 ,  H01L21/306 ,  B32B3/24

CPC分类号： B23K26/00 ,  B23K26/364 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/35 ,  B23K2103/50 ,  B23K2103/52 ,  B44C1/22 ,  H01L21/30604 ,  H01L21/3065 ,  H01L21/76898 ,  Y10S438/94 ,  Y10T428/24273

摘要： A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO3, HF and, optionally acetic acid.

摘要翻译： 在衬底内形成孔径（例如通孔，盲孔，沟槽，对准特征等）的方法包括用激光束照射衬底以形成具有侧壁的激光加工特征。 然后对激光加工的特征进行处理以改变激光加工特征的至少一个特征（例如，侧壁表面粗糙度，直径，锥度，纵横比，横截面轮廓等）。 可以通过使用含有HNO 3，HF和任选的乙酸的蚀刻剂溶液进行各向同性的湿蚀刻工艺来处理激光加工的特征以形成孔。

公开(公告)号：US10673198B2

公开(公告)日：2020-06-02

申请号：US15939136

申请日：2018-03-28

申请人： Dahv A. V. Kliner ,  Brian Victor ,  Lynn Sheehan ,  Aaron Brown

发明人： Dahv A. V. Kliner ,  Brian Victor ,  Lynn Sheehan ,  Aaron Brown

IPC分类号： H01S3/067 ,  G02B6/036 ,  G02B6/255 ,  G02B27/09 ,  B23K26/073 ,  G02F1/01 ,  B23K26/06 ,  G02B6/028 ,  G02B6/26 ,  G02B6/14 ,  H01S3/00

摘要： Methods, apparatus, and systems comprising a fiber-coupled laser and time-varying beam characteristics. A laser may generate an optical beam that is launched into one or more lengths of fiber, at least one of which comprises a confinement region that is optically coupled to an output. A perturbation device may modulate, through action upon the one or more lengths of fiber, a beam characteristic over a time period during which the laser is energized. A controller may cause the perturbation device to act upon the one or more lengths of fiber to impart a time-averaged beam characteristic and/or to induce a continuous variation in one or more beam characteristics during system use. A process monitor may sense a metric external to the optical system, and a feedback signal from the process monitor may be coupled into the controller. Dynamic beam characteristics may be modulated based on the feedback signal.

公开(公告)号：US08598490B2

公开(公告)日：2013-12-03

申请号：US13076810

申请日：2011-03-31

申请人： Andrew Hooper ,  David Barsic ,  Kelly J. Bruland ,  Daragh S. Finn ,  Lynn Sheehan ,  Xiaoyuan Peng ,  Yasu Osako ,  Jim Dumestre ,  William J. Jordens

发明人： Andrew Hooper ,  David Barsic ,  Kelly J. Bruland ,  Daragh S. Finn ,  Lynn Sheehan ,  Xiaoyuan Peng ,  Yasu Osako ,  Jim Dumestre ,  William J. Jordens

IPC分类号： H01L21/78

CPC分类号： H01S3/102 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/389 ,  B23K26/40 ,  B23K26/705 ,  B23K2103/172 ,  B23K2103/50 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/12043 ,  H01L2924/13091 ,  H01L2924/14 ,  H01S3/0057 ,  H01S3/1305 ,  H01L2924/00 ,  H01L2924/3512

摘要： Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback.

摘要翻译： 定制的激光脉冲形状用于加工工件。 例如，半导体器件晶片在芯片附着膜（DAF）上的激光切割可以使用不同的定制的激光脉冲形状，用于将器件层划分到半导体衬底，切割半导体衬底，切割下面的DAF和/或后处理 的上模边缘以增加冲模强度。 不同的单形激光脉冲序列可以用于激光束在划线上的相应配方步骤或通过。 在另一个实施例中，使用包括彼此不同的至少两个激光脉冲的混合形状的激光脉冲串，划线半导体器件晶片仅包括激光束沿着划线的单次通过。 另外，或者在其他实施例中，可以选择一个或多个定制的脉冲形状并将其提供给工件。 选择可以基于传感器反馈。

公开(公告)号：US20100224354A1

公开(公告)日：2010-09-09

申请号：US12399968

申请日：2009-03-08

申请人： Kevin Dooley ,  Ratnesh Kumar Sharma ,  Lynn Sheehan ,  Sergio Escobar-Vargas ,  Anna Fenelon

发明人： Kevin Dooley ,  Ratnesh Kumar Sharma ,  Lynn Sheehan ,  Sergio Escobar-Vargas ,  Anna Fenelon

IPC分类号： F28F21/02 ,  B21D53/02 ,  F28F21/08 ,  B32B37/14

CPC分类号： B32B37/025 ,  B32B2313/04 ,  B32B2317/12 ,  B32B2457/00 ,  B32B2553/00 ,  F28F21/02 ,  H01L23/373 ,  H01L24/29 ,  H01L24/32 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/157 ,  Y10T29/4935

摘要： To deposit carbon nanotubes onto a substrate, an at least partially porous film is prepared so that a surface of the film has a layer of carbon nanotubes thereon. The film is positioned in relation to a surface of the substrate such that the surface of the film having the layer of carbon nanotubes is brought into contact with the surface of the substrate. Pressure is applied to the film to attach the film, including the layer of carbon nanotubes, to the surface of the substrate.

摘要翻译： 为了将碳纳米管沉积到基底上，制备至少部分多孔的膜，使得膜的表面在其上具有一层碳纳米管。 膜相对于基板的表面定位，使得具有碳纳米管层的膜的表面与基板的表面接触。 对膜施加压力以将包括碳纳米管层的膜附着到基底的表面。