SYSTEM FOR RELIABLE, HIGH THROUGHPUT, COMPLEX ELECTRIC FIELD GENERATION, AND METHOD FOR PRODUCING COATINGS THEREFROM

    公开(公告)号:US20220081798A1

    公开(公告)日:2022-03-17

    申请号:US17409688

    申请日:2021-08-23

    申请人: Modumetal, Inc.

    摘要: Embodiments of the present disclosure include a system for depositing a layered nanolaminate alloy including a controller for an electrodeposition process that includes a waveform synthesizer circuit configured to generate a complex waveform signal corresponding to a desired electrodeposition waveform to be output from an electrodeposition power supply. The controller also includes a synthesizer control circuit configured to control the waveform synthesizer circuit. Based at least in part on a recipe having information related to the electrodeposition process, the synthesizer control circuit controls the generation of the complex waveform signal by modulating in real-time at least one of a waveform shape, a frequency, an amplitude, an offset, a slew, a wavelength, a phase, a velocity, and a derivative of the complex waveform signal. The controller further includes a controller output circuit configured to transmit the complex waveform signal to an input of the electrodeposition power supply.

    TOPOLOGY OPTIMIZED HIGH INTERFACE PACKING STRUCTURES

    公开(公告)号:US20200173032A1

    公开(公告)日:2020-06-04

    申请号:US16346843

    申请日:2017-11-02

    申请人: MODUMETAL, INC.

    摘要: The present disclosure provides articles comprising a laminate material having a void volume of at least 40%, having a lattice structure comprising a plurality of interconnected struts forming polyhedrons in a series that extends in three dimensions, or both, where the laminate materials have an interface density of at least 2.0 interfaces/micrometer (μm). Also described are methods for forming the same.