公开(公告)号：US20050008833A1

公开(公告)日：2005-01-13

申请号：US10854598

申请日：2004-05-26

Applicant: Brian Curcio ,  Frank Egitto ,  Robert Japp ,  Thomas Miller ,  Manh-Quan Nguyen ,  Douglas Powell

Inventor： Brian Curcio ,  Frank Egitto ,  Robert Japp ,  Thomas Miller ,  Manh-Quan Nguyen ,  Douglas Powell

IPC: H01L21/48 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00

CPC classification number: H01L21/486 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/061 ,  H05K2203/1152 ,  Y10S438/976 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/2848

Abstract: A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.

公开(公告)号：US20060253270A1

公开(公告)日：2006-11-09

申请号：US11431356

申请日：2006-05-10

Applicant: Manh-Quan Nguyen

Inventor： Manh-Quan Nguyen

IPC: G06F17/10

CPC classification number: H05K3/4638 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0047 ,  H05K2201/09918

Abstract: A method of creating a mathematical model which is employed in the determination of at least one work location in a multi-layered laminated circuit panel. The mathematical model for modifying drill data takes into consideration translational and rotational compensations caused by the encountered stretching or shrinking of the multi-layered panel subsequent to pressing or due to thermally processing, whereby the mathematical model may be utilized to modify drill data in order to accurately predict hole or via locations.

公开(公告)号：US20050121800A1

公开(公告)日：2005-06-09

申请号：US11031859

申请日：2005-01-07

Applicant: Frank Egitto ,  Keith Miller ,  Manh-Quan Nguyen

Inventor： Frank Egitto ,  Keith Miller ,  Manh-Quan Nguyen

IPC: G01R1/067 ,  G01R1/073 ,  H05K3/20 ,  H05K3/40 ,  H05K3/42 ,  H01L21/8234 ,  H01L21/4763 ,  H01L21/8244 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: G01R1/06733 ,  G01R1/0735 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/714 ,  H01R2201/20 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2203/0369 ,  H05K2203/0733 ,  Y10T29/4922

Abstract: A structure and method to establish an electrical connection between a tester and an electrical component. A flexible dielectric layer has a first side and a second side. A through via extends through the first side and the second side of the dielectric layer. A blind via is placed in a position that is offset from the through via and extends laterally in a first direction from a section of the first through via to a section of the flexible dielectric layer. The blind via extends in a second direction from the first side of the flexible dielectric layer to a section of the flexible dielectric layer that is between the first side and the second side of the dielectric layer. An electrically conductive member extends through the through via and extends into the blind via, thereby filling the through via and the blind via. The electrically conductive member has a first surface and a second surface. Any distance between the first surface and the second surface is greater than a distance between the first side of the dielectric layer and the second side of the dielectric layer.

Abstract translation: 一种在测试仪和电气部件之间建立电气连接的结构和方法。 柔性介电层具有第一面和第二面。 通孔延伸穿过电介质层的第一侧和第二侧。 盲通孔放置在从通孔偏移的位置，并且在从第一通孔的一部分到柔性介电层的一部分的第一方向上横向延伸。 盲孔从柔性介电层的第一侧沿第二方向延伸到介电层的第一侧和第二侧之间的柔性介电层的一部分。 导电构件延伸穿过通孔并延伸到盲孔中，从而填充通孔和盲孔。 导电构件具有第一表面和第二表面。 第一表面和第二表面之间的任何距离都大于电介质层的第一面和电介质层的第二面之间的距离。