Method and apparatus for implementing direct attenuation measurement through embedded structure excitation
    2.
    发明申请
    Method and apparatus for implementing direct attenuation measurement through embedded structure excitation 失效
    通过嵌入式结构激励实现直接衰减测量的方法和装置

    公开(公告)号:US20050285600A1

    公开(公告)日:2005-12-29

    申请号:US10879813

    申请日:2004-06-29

    IPC分类号: G01R27/28 G01R31/08 G01R31/28

    CPC分类号: G01R31/2853 G01R27/28

    摘要: A method and apparatus are provided for implementing direct attenuation loss measurement in an electronic package. A sinusoidal voltage source signal of a selected frequency is coupled to an embedded transmission line test structure in the electronic package. Receive circuitry is coupled to the transmission line test structure for detecting amplitude of a received sinusoidal voltage source signal to identify attenuation loss through the transmission line test structure. An identified attenuation loss of the transmission line test structure is compared with a threshold value for verifying acceptable attenuation of the electronic package transmission line test structure.

    摘要翻译: 提供一种用于在电子封装中实现直接衰减损耗测量的方法和装置。 所选频率的正弦电压源信号耦合到电子封装中的嵌入式传输线测试结构。 接收电路耦合到传输线测试结构,用于检测接收的正弦电压源信号的幅度,以通过传输线测试结构识别衰减损耗。 将传输线测试结构的确定的衰减损耗与用于验证电子封装传输线测试结构的可接受衰减的阈值进行比较。

    Method and apparatus for implementing automated electronic package transmission line characteristic impedance verification
    3.
    发明申请
    Method and apparatus for implementing automated electronic package transmission line characteristic impedance verification 失效
    实现自动化电子封装传输线特性阻抗验证的方法和装置

    公开(公告)号:US20050104602A1

    公开(公告)日:2005-05-19

    申请号:US10712742

    申请日:2003-11-13

    CPC分类号: G01R27/04

    摘要: A method and apparatus are provided for implementing automated electronic package transmission line characteristic impedance verification. A sinusoidal voltage source is coupled to a transmission line test structure for generating a selected frequency. Impedance measuring circuitry is coupled to the transmission line test structure for measuring an input impedance with an open-circuit termination and a short-circuit termination. Characteristic impedance calculation circuitry is coupled to the impedance measuring circuitry receiving the input impedance measured values for the open-circuit termination and the short-circuit termination for calculating characteristic impedance. Logic circuitry is coupled to the characteristic impedance calculation circuitry for comparing the calculated characteristic impedance with threshold values for verifying acceptable electronic package transmission line characteristic impedance.

    摘要翻译: 提供了一种用于实现自动化电子封装传输线特性阻抗验证的方法和装置。 正弦电压源耦合到用于产生选定频率的传输线测试结构。 阻抗测量电路耦合到传输线测试结构,用于测量具有开路端接和短路端接的输入阻抗。 特征阻抗计算电路耦合到阻抗测量电路,其接收用于开路端接的输入阻抗测量值和用于计算特性阻抗的短路端接。 逻辑电路耦合到特征阻抗计算电路,用于将计算的特性阻抗与用于验证可接受的电子封装传输线特性阻抗的阈值进行比较。

    Daisy Chainable Memory Chip
    4.
    发明申请
    Daisy Chainable Memory Chip 失效
    菊花链式存储芯片

    公开(公告)号:US20080031076A1

    公开(公告)日:2008-02-07

    申请号:US11872108

    申请日:2007-10-15

    IPC分类号: G11C8/12

    摘要: A memory chip suitable for use in a daisy chain of memory chips. The memory chip receives an address/command word on a first input, determines if the address command word is directed to the memory chip; if so, the memory chip accesses an array on the memory chip. If not, the memory chip re-drives the address/command word on a first output. Write data is received as part of the address/command word or from a first data bus port. A bus clock is received and is used to receive and transmit information on the first input, the first output, the first data bus port and the second data bus port. The memory chip is incorporated into a design structure that is embodied in a computer readable medium used for designing, manufacturing, or testing the memory chip.

    摘要翻译: 适用于存储芯片的菊花链的存储芯片。 存储器芯片在第一输入端接收地址/命令字,确定地址命令字是否被引导到存储器芯片; 如果是这样,则存储器芯片访问存储器芯片上的阵列。 如果不是,则存储器芯片在第一输出上重新驱动地址/命令字。 作为地址/命令字的一部分或从第一数据总线端口接收写入数据。 接收总线时钟并用于接收和发送关于第一输入,第一输出,第一数据总线端口和第二数据总线端口的信息。 存储器芯片被并入设计结构中,其体现在用于设计,制造或测试存储器芯片的计算机可读介质中。

    Learning a predicted voltage to supply an electronic device based on dynamic voltage variation
    5.
    发明申请
    Learning a predicted voltage to supply an electronic device based on dynamic voltage variation 审中-公开
    基于动态电压变化学习预测电压以供应电子设备

    公开(公告)号:US20070208463A1

    公开(公告)日:2007-09-06

    申请号:US11366881

    申请日:2006-03-02

    IPC分类号: G05D11/00

    CPC分类号: G06F1/26

    摘要: In an embodiment, a predicted voltage to supply to an electronic device is learned based on a dynamic voltage variation that occurs at the electronic device. The dynamic voltage variation occurs in response to the electronic device processing a functional event, and the predicted voltage is supplied to the electronic device in response to observing the functional event on a bus that is connected to the electronic device. In response to observing the dynamic voltage variation, the predicted voltage that is associated with the functional event is modified based on the dynamic voltage variation. Then, on the next occurrence of the functional event, the predicted voltage is supplied to the electronic device. In this way, voltage transients at the electronic device are controlled.

    摘要翻译: 在一个实施例中,基于在电子设备处发生的动态电压变化来学习向电子设备提供的预测电压。 响应于电子设备处理功能事件而发生动态电压变化,并且响应于观察连接到电子设备的总线上的功能事件,将预测电压提供给电子设备。 响应观察动态电压变化,基于动态电压变化修改与功能事件相关联的预测电压。 然后,在下一次发生功能事件时,向电子设备提供预测电压。 以这种方式,控制电子设备处的电压瞬变。

    Method, apparatus and computer program product for implementing automated detection excess aggressor shape capacitance coupling in printed circuit board layouts
    8.
    发明申请
    Method, apparatus and computer program product for implementing automated detection excess aggressor shape capacitance coupling in printed circuit board layouts 失效
    用于在印刷电路板布局中实现自动检测过多侵略形状电容耦合的方法,装置和计算机程序产品

    公开(公告)号:US20050125752A1

    公开(公告)日:2005-06-09

    申请号:US10731064

    申请日:2003-12-09

    IPC分类号: G06F17/50 H05K1/02 H05K3/00

    摘要: A method, apparatus and computer program product are provided for implementing automated detection of excess aggressor shape capacitance coupling in printed circuit board layouts. A PCB design file containing an electronic representation of a printed circuit board design is received. A list of candidate shapes is identified. The candidate shapes are disposed on layers adjacent to aggressor planes. A capacitance coupling the candidate shapes to adjacent aggressor planes is calculated. A ratio of the calculated capacitance and a decoupling capacitance connecting the candidate shapes to a reference plane is determined. The PCB design file containing an electronic representation of a printed circuit board design includes shape data and text data that are extracted to produce a list of shapes' names, areas, locations and planes; and includes data defining thickness and relative permittivity of the dielectric layers used for calculating the effective capacitance is an inter-layer parallel-plate effective capacitance.

    摘要翻译: 提供了一种方法,装置和计算机程序产品,用于实现印刷电路板布局中的多余侵略形状电容耦合的自动检测。 接收包含印刷电路板设计的电子表示的PCB设计文件。 识别候选形状的列表。 候选形状设置在与侵略者平面相邻的层上。 计算将候选形状耦合到相邻攻击者平面的电容。 确定所计算的电容和将候选形状连接到参考平面的去耦电容的比率。 包含印刷电路板设计的电子表示的PCB设计文件包括提取的形状数据和文本数据以产生形状名称,区域,位置和平面的列表; 并且包括用于计算有效电容的介电层的厚度和相对介电常数的数据是层间平行板有效电容。