公开(公告)号：US5549977A

公开(公告)日：1996-08-27

申请号：US228168

申请日：1994-04-15

Applicant: Sungho Jin ,  Mark T. McCormack ,  Ramamoorthy Ramesh

Inventor： Sungho Jin ,  Mark T. McCormack ,  Ramamoorthy Ramesh

IPC: G01R33/09 ,  H01L43/08 ,  H01L43/10 ,  H01L43/12 ,  G11B5/66 ,  B05D5/12 ,  C23C14/00

CPC classification number: H01L43/10 ,  Y10S428/90 ,  Y10S428/928 ,  Y10T428/1107

Abstract: A magnetoresistance ratio of 200% (absolute value) or more at room temperature in a field of 6T can be achieved in a layer of material of nominal composition XMnO.sub.y (X is La and at least one of Ca, Sr and Ba, y in the range 2-3.5), if, after formation of the layer, the layer is heat treated in an oxygen-rich (O.sub.2 partial pressure greater than that of air) atmosphere, typically in flowing O.sub.2. The temperature and duration of the heat treatment are in the range 300.degree.-850.degree.C. and 10 minutes-12 hours, and are selected to result in the desired ratio of 200% or more.

Abstract translation: 在标称组成XMnOy（X是La）和Ca，Sr和Ba，y中的至少一个的材料层中，可以在6T的场中在室温下达到200％（绝对值）或更高的磁阻比 范围2-3.5），如果在层的形成之后，该层在富氧（O 2分压大于空气的气氛）气氛中，通常在流动的O 2中进行热处理。 热处理的温度和持续时间在300℃-850℃和10分钟-12小时的范围内，并且选择达到所需比例为200％以上。

公开(公告)号：US5509815A

公开(公告)日：1996-04-23

申请号：US255687

申请日：1994-06-08

Applicant: Sungho Jin ,  Mark T. McCormack

Inventor： Sungho Jin ,  Mark T. McCormack

IPC: B23K35/02 ,  B23K35/14 ,  H05K3/34 ,  H05K3/36 ,  H01R9/09

CPC classification number: B23K35/0222 ,  H05K3/3436 ,  B23K35/0227 ,  B23K35/0244 ,  H01L2924/0002 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0235 ,  H05K2203/0769 ,  H05K2203/104 ,  Y02P70/613

Abstract: Electronic devices having at least two components wire mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two component. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to the diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.

Abstract translation: 具有至少两个部件的电子设备配线接触焊盘在配合焊盘之间设置有高纵横比焊接点。 这些接头通过将包含焊丝的复合焊料介质放置在电绝缘基体中而形成，使得至少两个焊丝与配合焊盘接触，并将焊丝熔合到焊盘。 然后可选地从所述至少两个部件之间移除具有剩余焊丝的绝缘基体。 复合焊料介质通过在绝缘基体中制备细长的焊丝体并且切断复合焊料介质的切片而形成，该焊丝具有与直径的长宽比的高纵横比。 或者，复合焊料介质的片材通过将焊接涂覆的磁性颗粒磁化地排列成横向于绝缘矩阵布置的列并充分加热以将每个列中的焊料熔合成连续导电的焊接路径来制备。

公开(公告)号：US5461308A

公开(公告)日：1995-10-24

申请号：US176366

申请日：1993-12-30

Applicant: Sungho Jin ,  Mark T. McCormack ,  Apurba Roy ,  James C. Wadlington

Inventor： Sungho Jin ,  Mark T. McCormack ,  Apurba Roy ,  James C. Wadlington

IPC: G01R15/20 ,  H01L43/08 ,  G01R33/00

CPC classification number: G01R15/205

Abstract: The present inventors have discovered that a compact, highly sensitive current sensor can be made for any inductive component having an air gap in its magnetic path by disposing a layer of magnetoresistive material in the path of the fringing magnetic field. In the preferred embodiment, a thin magnetoresistive film of La.sub.w Ca.sub.x Mn.sub.y O.sub.z on a LaAlO.sub.3 /Al.sub.2 O.sub.3 substrate provides a high sensitivity in the range of 1-100 mV/ampere of DC current in the inductive component. The current sensor consumes a very small amount of power and provides the desirable electrical isolation between the sensor and the active device circuit.

Abstract translation: 本发明人已经发现，通过在边缘磁场的路径中设置一层磁阻材料，可以为任何在其磁路中具有气隙的电感元件制造紧凑，高灵敏度的电流传感器。 在优选实施例中，LaAlO 3 / Al 2 O 3衬底上的LawCaxMnyOz的薄磁阻膜在电感元件中提供1-100mV /安培的DC电流的高灵敏度。 电流传感器消耗非常少量的功率并且在传感器和有源器件电路之间提供期望的电隔离。

公开(公告)号：US07386197B2

公开(公告)日：2008-06-10

申请号：US10994021

申请日：2004-11-19

Applicant: Dmitri E. Nikonov ,  Mark T. McCormack

Inventor： Dmitri E. Nikonov ,  Mark T. McCormack

IPC: G02B6/12

CPC classification number: G01M11/37

Abstract: A method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit. In one embodiment, a second probe is used in combination with the first probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.

Abstract translation: 通过将光学探针耦合到平面光波电路来实现测试平面光波电路的方法。 在一个实施例中，第二探针与第一探头组合使用，以通过发射和接收通过平面光波电路的光束来测试平面光波电路。

公开(公告)号：US5569433A

公开(公告)日：1996-10-29

申请号：US335619

申请日：1994-11-08

Applicant: Ho S. Chen ,  Sungho Jin ,  Mark T. McCormack

Inventor： Ho S. Chen ,  Sungho Jin ,  Mark T. McCormack

IPC: B23K35/26 ,  C22C13/02 ,  C22C13/00 ,  C22C12/00

CPC classification number: C22C13/02 ,  B23K35/264

Abstract: We have made the surprising discovery that small amounts of Ag below 1% by weight are effective in making Bi--Sn alloys less strain-rate sensitive without deleteriously affecting the melting character of the alloy. A Pb-free solder composition comprising at least 40% by weight Bi, between 40% and 60% Sn, and between 0.05 and 1% Ag is effective to increase the total elongation of the solder by at least 20% under the same processing conditions. Moreover the solder is free of undesirable Ag-containing phases with a melting point in excess of the 183.degree. C. melting point of the Pb--Sn binary eutectic alloy. In a preferred embodiment, the composition comprises 54.75% Bi, 45% Sn, and 0.25 % Ag.

Abstract translation: 我们惊奇地发现，低于1重量％的少量Ag对于使Bi-Sn合金的应变率敏感性降低是有效的，而不会有害地影响合金的熔融特性。 包含至少40重量％Bi，40％至60％Sn和0.05至1％Ag之间的无铅焊料组合物在相同加工条件下将焊料的总伸长率提高至少20％是有效的 。 此外，焊料没有不希望的含Ag相，熔点超过Pb-Sn二元共晶合金的183℃熔点。 在优选的实施方案中，组合物包含54.75％Bi，45％Sn和0.25％Ag。

公开(公告)号：US5512818A

公开(公告)日：1996-04-30

申请号：US220768

申请日：1994-03-31

Applicant: Sungho Jin ,  Ashraf W. Lotfi ,  Mark T. McCormack

Inventor： Sungho Jin ,  Ashraf W. Lotfi ,  Mark T. McCormack

IPC: G01R33/09 ,  G01R15/20 ,  G01R17/16 ,  G01R19/00 ,  G05F1/10 ,  H01F10/18 ,  G01V3/06

CPC classification number: G01R15/205

Abstract: In accordance with the present invention, a voltage proportional replication device comprises an input electromagnet responsive to an input voltage for producing a magnetic field in proportion to the input voltage; and a first magnetoresistive sensing element disposed within the field of the input electromagnet. The device further includes an adjustable source of output voltage; an output electromagnet responsive to the output voltage for producing a magnetic field in proportion to the output voltage; and a second magnetoresistive sensing element disposed within the field of the output electromagnet. A control circuit for controlling the adjustable output voltage maintains a constant ratio between the resistances of the first and second magnetoresistive elements, thereby maintaining a constant ratio between the input voltage and the output voltage.

Abstract translation: 根据本发明，电压比例复制装置包括响应于输入电压的输入电磁体，用于产生与输入电压成比例的磁场; 以及设置在输入电磁体的场内的第一磁阻感测元件。 该装置还包括可调节的输出电压源; 响应于输出电压的输出电磁体，用于产生与输出电压成比例的磁场; 以及设置在输出电磁体的场内的第二磁阻感测元件。 用于控制可调输出电压的控制电路在第一和第二磁阻元件的电阻之间保持恒定的比例，从而保持输入电压和输出电压之间的恒定比率。

公开(公告)号：US5411814A

公开(公告)日：1995-05-02

申请号：US187668

申请日：1994-01-26

Applicant: Sungho Jin ,  Mark T. McCormack ,  Thomas H. Tiefel

Inventor： Sungho Jin ,  Mark T. McCormack ,  Thomas H. Tiefel

IPC: G01D5/14 ,  G01D5/16 ,  G01R33/09 ,  G06F3/033 ,  G06F3/046 ,  G11B5/39 ,  H01F1/00 ,  H01F1/40 ,  H01L43/08 ,  H01L43/10 ,  B32B9/00 ,  G01R33/02

CPC classification number: G06F3/046 ,  B82Y25/00 ,  G01D5/145 ,  G01R33/09 ,  H01F1/0036 ,  H01F1/407 ,  H01L43/10 ,  Y10S428/90 ,  Y10T428/1107

Abstract: We have discovered that the addition of a relatively small amount of Sr and/or Ba to La-Ca-Mn-O can yield material of improved magnetoresistive properties at room temperature and in a small applied field, as compared to the analogous Sr and/or Ba-free material. An exemplary composition is La.sub.0.55 Ca.sub.0.25 Sr.sub.0.08 MnO.sub.x. Material according to the invention has a substantially larger value of .vertline.d.rho./dH.vertline. than the analogous comparison material at 25.degree. C. and H.ltoreq.0.05 Tesla. Preferred compositions also can exhibit a substantially linear dependence of resistivity on applied magnetic field under these conditions, as well as have a relatively large value of zero field resistivity. The novel materials can advantageously be used in applications that involve sensing of a magnetic field, or of changes in such a field.

Abstract translation: 我们已经发现，与类似的Sr和/或Ca相比，在La-Ca-Mn-O中添加相对少量的Sr和/或Ba可以产生在室温和小的施加场中改进的磁阻性质的材料， 或不含Ba的材料。 示例性组合物是La0.55Ca0.25Sr0.08MnOx。 根据本发明的材料具有显着更大的值| d rho / dH | 在25℃和H <0.05特斯拉的类似比较材料。 优选的组合物还可以在这些条件下表现出对所施加的磁场的电阻率的基本上线性的依赖性，并且具有相对较大的零场电阻率值。 该新型材料可以有利地用于涉及感测磁场或这种场的变化的应用中。

公开(公告)号：US5346775A

公开(公告)日：1994-09-13

申请号：US21005

申请日：1993-02-22

Applicant: Sungho Jin ,  Mark T. McCormack

Inventor： Sungho Jin ,  Mark T. McCormack

IPC: B22F1/02 ,  B23K1/00 ,  B23K35/02 ,  B23K35/14 ,  B23K35/24 ,  B23K35/26 ,  B23K35/40 ,  C22C1/10 ,  H01R43/02 ,  H05K3/34

CPC classification number: B23K35/26 ,  B23K1/00 ,  B23K35/0222 ,  B23K35/0244 ,  H05K3/3484 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  H01L24/12 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/10719 ,  H05K2203/104 ,  Y10T428/12007 ,  Y10T428/12486

Abstract: New solder compositions which can have improved mechanical properties are disclosed. In a preferred embodiment, the solder comprises a matrix material and magnetically dispersed particles. A desirable dispersion of the magnetic particles in the matrix material, is accomplished by applying a magnetic field to the molten matrix material containing magnetic particles and solidifying it in the presence of the magnetic field. The particle-dispersed microstructures improve the mechanical properties of the solder composition. The improved solder composition can be made into a powder to be used in solder paste, cream or reshaped while substantially retaining the improved mechanical properties.

Abstract translation: 公开了具有改进的机械性能的新的焊料组合物。 在优选实施例中，焊料包括基体材料和磁分散的颗粒。 磁性颗粒在基质材料中的理想分散是通过对含有磁性颗粒的熔融基质材料施加磁场并在磁场存在下使其固化来实现的。 颗粒分散的微结构改善了焊料组合物的机械性能。 改进的焊料组合物可以制成粉末以用于焊膏，奶油或重新成形，同时基本上保持改进的机械性能。

公开(公告)号：US06859587B2

公开(公告)日：2005-02-22

申请号：US10041038

申请日：2001-12-28

Applicant: Dmitri E. Nikonov ,  Mark T. McCormack

Inventor： Dmitri E. Nikonov ,  Mark T. McCormack

IPC: G01M11/00 ,  G02B6/30

CPC classification number: G01M11/37

Abstract: A method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit. In one embodiment, a second probe is used in combination with the first probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.

Abstract translation: 通过将光学探针耦合到平面光波电路来实现测试平面光波电路的方法。 在一个实施例中，第二探针与第一探头组合使用，以通过发射和接收通过平面光波电路的光束来测试平面光波电路。

公开(公告)号：US5618189A

公开(公告)日：1997-04-08

申请号：US588193

申请日：1996-01-18

Applicant: Sungho Jin ,  Mark T. McCormack

Inventor： Sungho Jin ,  Mark T. McCormack

IPC: B23K35/02 ,  B23K35/14 ,  H05K3/34 ,  H05K3/36 ,  H01R9/09

CPC classification number: B23K35/0222 ,  H05K3/3436 ,  B23K35/0227 ,  B23K35/0244 ,  H01L2924/0002 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0235 ,  H05K2203/0769 ,  H05K2203/104 ,  Y02P70/613

Abstract: Electronic devices having at least two components with mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two components. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to their diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.

Abstract translation: 具有至少两个具有配合接触垫的部件的电子设备在配合焊盘之间设置有高纵横比焊接点。 这些接头通过将包含焊丝的复合焊料介质放置在电绝缘基体中而形成，使得至少两个焊丝与配合焊盘接触，并将焊丝熔合到焊盘。 然后可选地从所述至少两个部件之间移除具有剩余焊丝的绝缘基体。 复合焊料介质通过在绝缘基体中制备细长的焊丝体并且切断复合焊料介质的切片而形成，该焊丝具有与其直径的长宽比的高纵横比。 或者，复合焊料介质的片材通过将焊接涂覆的磁性颗粒磁化地排列成横向于绝缘矩阵布置的列并充分加热以将每个列中的焊料熔合成连续导电的焊接路径来制备。