-
公开(公告)号：US20140029270A1
公开(公告)日：2014-01-30
申请号：US13816213
申请日：2012-07-26
申请人： Masami Suzuki , Satoshi Tokuoka , Satoru Maeda
发明人： Masami Suzuki , Satoshi Tokuoka , Satoru Maeda
CPC分类号： G02B6/0043 , B21K5/20 , B23K26/0006 , B23K26/082 , B23K26/0853 , B23K26/352 , B23K26/389 , B23K2103/50 , B29D11/00673 , G02B6/0061 , G02B6/0065 , Y10T428/24273
摘要： A processing machine is configured to include a processing device capable of applying processing for forming many holes to a processing area as a part of a region to be processed in a workpiece, a transferring device to relatively move the workpiece with respect to the processing device after the processing is applied to a certain area in the region to be processed, and to position an unprocessed area as a new area to be processed by the processing device, a processing pattern storage unit to store information defining arrangement positions of the holes formed by the processing device, and a control unit to determine a target processing position of each of the holes by adding a position correction amount of each hole on a random basis to the position of each hole defined by the information stored in the processing pattern storage unit.
摘要翻译： 一种加工机构，其特征在于，包括能够对作为工件的待处理区域的一部分的处理区域进行多孔加工处理的处理装置，在所述处理装置之后相对于所述处理装置使所述工件相对移动的传送装置， 处理被应用于要处理的区域中的某个区域，并且将未处理区域定位为由处理装置处理的新区域;处理模式存储单元，用于存储定义由所述处理装置形成的孔的布置位置的信息 处理装置和控制单元，通过将每个孔的位置校正量随机地添加到由存储在处理模式存储单元中的信息定义的每个孔的位置来确定每个孔的目标处理位置。
-
公开(公告)号：US09492889B2
公开(公告)日：2016-11-15
申请号：US13814227
申请日：2012-07-26
申请人： Masami Suzuki , Norio Nishi , Junichi Matsumoto , Nobutaka Yoneyama , Satoshi Tokuoka , Etsushi Kato
发明人： Masami Suzuki , Norio Nishi , Junichi Matsumoto , Nobutaka Yoneyama , Satoshi Tokuoka , Etsushi Kato
CPC分类号： B23K26/04 , B23K26/032 , B23K26/042 , B23K26/0643 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/0853
摘要： A processing machine includes mirrors and to reflect a beam L oscillated from a laser oscillator to a predetermined surface on which a workpiece is arranged, optical axis operating mechanisms and to position an optical axis of the beam L at a desired target irradiation position by changing directions of the mirrors and, a camera sensor to capture an image of the target irradiation position and its periphery reflected in the mirror, and an error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanisms and an actual position of the optical axis of the beam L in the predetermined surface by referring to the image captured by the camera sensor. A correction amount to the optical axis operating mechanisms and is determined based on the error to irradiate the target irradiation position with the beam L during processing.
摘要翻译： 加工机器包括反射镜并将从激光振荡器振荡的光束L反射到其上布置工件的预定表面，光轴操作机构，并且通过改变方向将光束L的光轴定位在期望的目标照射位置 以及用于拍摄目标照射位置的图像及其反射镜中的周边的图像的摄像机传感器，以及用于检测指示到光轴操作机构的目标照射位置与实际位置之间的误差的误差校准机构 通过参照由照相机传感器拍摄的图像，在预定表面中的光束L的光轴。 对光轴操作机构的校正量，并且基于在处理期间用光束L照射目标照射位置的误差来确定。
-
公开(公告)号：US20130186871A1
公开(公告)日：2013-07-25
申请号：US13814227
申请日：2012-07-26
申请人： Masami Suzuki , Norio Nishi , Junichi Matsumoto , Nobutaka Yoneyama , Satoshi Tokuoka , Etsushi Kato
发明人： Masami Suzuki , Norio Nishi , Junichi Matsumoto , Nobutaka Yoneyama , Satoshi Tokuoka , Etsushi Kato
IPC分类号： B23K26/04 , B23K26/067
CPC分类号： B23K26/04 , B23K26/032 , B23K26/042 , B23K26/0643 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/0853
摘要： A processing machine includes mirrors and to reflect a beam L oscillated from a laser oscillator to a predetermined surface on which a workpiece is arranged, optical axis operating mechanisms and to position an optical axis of the beam L at a desired target irradiation position by changing directions of the mirrors and, a camera sensor to capture an image of the target irradiation position and its periphery reflected in the mirror, and an error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanisms and an actual position of the optical axis of the beam L in the predetermined surface by referring to the image captured by the camera sensor. A correction amount to the optical axis operating mechanisms and is determined based on the error to irradiate the target irradiation position with the beam L during processing.
摘要翻译： 加工机器包括反射镜并将从激光振荡器振荡的光束L反射到其上布置工件的预定表面，光轴操作机构，并且通过改变方向将光束L的光轴定位在期望的目标照射位置 以及用于拍摄目标照射位置的图像及其反射镜中的周边的图像的摄像机传感器，以及用于检测指示到光轴操作机构的目标照射位置与实际位置之间的误差的误差校准机构 通过参照由照相机传感器拍摄的图像，在预定表面中的光束L的光轴。 对光轴操作机构的校正量，并且基于在处理期间用光束L照射目标照射位置的误差来确定。
-
公开(公告)号：US20140191819A1
公开(公告)日：2014-07-10
申请号：US14124359
申请日：2011-06-07
申请人： Masami Suzuki
发明人： Masami Suzuki
IPC分类号： H03H7/40
CPC分类号： H03H7/40 , H01F38/14 , H02J5/005 , H02J7/025 , H02J17/00 , H02J50/10 , H02J50/12 , H02J50/20 , H02J50/80 , H02J50/90 , H04B5/0037
摘要： In an impedance matching device, a storage unit stores a control value representing a load value and a value equivalent to input impedance in advance. The control value identifies inductance and capacitance values matching a predetermined impedance value by use of either a first or second matching circuit. An impedance estimation unit estimates input impedance of the power transmission antenna. The load value estimation unit estimates load value of a circuit connected to a power reception antenna and consuming transmitted electric power. A circuit selection unit electrically connects the first matching circuit, the second matching circuit, or a through circuit per the load value and the input impedance equivalent value. A control value output unit reads out the control value stored in the storage unit based on the load value and the input impedance equivalent value, and outputs the control value to the circuit selected by the circuit selection unit.
摘要翻译： 在阻抗匹配装置中，存储单元预先存储表示负载值和等于输入阻抗的值的控制值。 控制值通过使用第一或第二匹配电路来识别与预定阻抗值匹配的电感和电容值。 阻抗估计单元估计输电天线的输入阻抗。 负载值估计单元估计连接到受电天线的电路的负载值并消耗发送电力。 电路选择单元根据负载值和输入阻抗等效值将第一匹配电路，第二匹配电路或贯通电路电连接。 控制值输出单元基于负载值和输入阻抗等效值读出存储在存储单元中的控制值，并将控制值输出到由电路选择单元选择的电路。
-
公开(公告)号：US20130297135A1
公开(公告)日：2013-11-07
申请号：US13980843
申请日：2012-01-27
申请人： Fumihiro Yamanaka , Masami Suzuki
发明人： Fumihiro Yamanaka , Masami Suzuki
CPC分类号： B60W20/40 , B60K6/48 , B60K6/547 , B60L11/14 , B60L15/2054 , B60W10/02 , B60W10/06 , B60W10/08 , B60W10/10 , B60W10/11 , B60W10/115 , B60W20/00 , B60W20/30 , B60W30/19 , B60W30/192 , B60W2600/00 , B60W2710/0644 , B60W2710/083 , B60W2710/1011 , Y02T10/6221 , Y02T10/6286 , Y02T10/645 , Y02T10/70 , Y02T10/7077 , Y02T10/72 , Y02T10/7275 , Y10S903/93
摘要： A control device of a hybrid vehicle includes an engine, a motor/generator, a first clutch, an automatic transmission, a second clutch, and startup/shifting simultaneous processing section. When engine speed increase control for increasing the engine speed by the motor/generator in order to start up the engine during travel and downshifting control of the automatic transmission are processed in parallel, the startup/shifting simultaneous processing section uses the motor torque of the motor/generator to increase the increase of input speed by the downshifting control to a target input speed while engine speed increase control is being performed by the motor/generator.
摘要翻译： 混合动力车辆的控制装置包括发动机，电动机/发电机，第一离合器，自动变速器，第二离合器和起动/换档同时处理部。 当发动机转速增加时，由马达/发电机提高发动机转速，以便在行驶期间启动发动机并且自动变速器的降档控制被并行处理，起动/换档同时处理部分使用电动机的电动机转矩 /发电机，通过电动机/发电机执行发动机转速增加控制，通过降档控制将输入速度增加到目标输入速度。
-
公开(公告)号：US20120015402A1
公开(公告)日：2012-01-19
申请号：US13187677
申请日：2011-07-21
申请人： Masayuki Tsuchiya , Masami Suzuki , Kenji Yoshida , Etsuko Fujii , Miho Watanabe , Koichi Matsubara , Yu Jau Chen , Juliana Sim
发明人： Masayuki Tsuchiya , Masami Suzuki , Kenji Yoshida , Etsuko Fujii , Miho Watanabe , Koichi Matsubara , Yu Jau Chen , Juliana Sim
CPC分类号： A01K67/027 , A01K2267/01 , A61K35/16 , C07K16/00 , C07K16/30
摘要： An objective of the present invention is to facilitate the acquisition of antibody-producing cells that are infiltrating virus-infected cells, cancer cells, abnormal cells forming a benign hyperplasia, and the like, and to improve the efficiency of the production of antibodies as well as nucleic acids encoding them from the antibody-producing cells.The present inventors discovered that, when cancer tissues comprising infiltrating lymphocytes are transplanted into highly immunodeficient animals that do not have T cells, B cells, and NK cells and further exhibit a low IFN production ability, the differentiation and proliferation of infiltrating lymphocytes are unexpectedly promoted, and the number of plasma cells that produce antibodies recognizing cancer tissues increases dramatically, plasma cells can be separated easily, and antibodies or nucleic acids encoding them can be easily prepared from the plasma cells.
摘要翻译： 本发明的目的是便于获得渗透病毒感染细胞的抗体产生细胞，癌细胞，形成良性增生的异常细胞等，以及提高抗体生产的效率 作为从抗体产生细胞编码它们的核酸。 本发明人发现，当将包含浸润性淋巴细胞的癌组织移植到不具有T细胞，B细胞和NK细胞的高度免疫缺陷的动物中并且进一步表现出低的IFN产生能力时，意外地促进了浸润性淋巴细胞的分化和增殖 并且产生识别癌组织的抗体的浆细胞的数量急剧增加，可以容易地分离浆细胞，并且可以容易地从浆细胞制备抗体或编码它们的核酸。
-
公开(公告)号：US08047885B2
公开(公告)日：2011-11-01
申请号：US12468121
申请日：2009-05-19
IPC分类号： B63H20/14
CPC分类号： B63H20/20
摘要： A boat propulsion unit has a construction that prevents a structure near a drive shaft from becoming complicated and increased in size. The boat propulsion unit preferably in the form of an outboard motor includes a front propeller that is rotated together with a front propeller drive shaft during both forward travel and reverse travel of the boat, a rear propeller that is rotated together with a rear propeller drive shaft in an opposite direction of the front propeller during both of the forward travel and the reverse travel of the boat, and a forward-reverse drive that is arranged on an axis of the front propeller drive shaft and the rear propeller drive shaft, and that can be switched between a direction in which the front propeller drive shaft and the rear propeller drive shaft are rotated during the forward travel of the boat and a direction in which the front propeller drive shaft and the rear propeller drive shaft are rotated during the reverse travel of the boat.
摘要翻译： 船推进单元具有防止驱动轴附近的结构变得复杂和尺寸增加的结构。 优选为舷外马达形式的船推进单元包括在船的向前行进和反向行进期间与前螺旋桨驱动轴一起旋转的前螺旋桨，与螺旋桨传动轴一起旋转的后推进器 在船的前进行驶和反向行驶期间在前螺旋桨的相反方向上，以及布置在前螺旋桨传动轴和后螺旋桨驱动轴的轴线上的前后倒档驱动器，并且可以 在前轮驱动轴和后推进器驱动轴在船的向前行进期间旋转的方向与前推进器驱动轴和后螺旋桨驱动轴在逆向行驶期间旋转的方向之间切换 小舟。
-
公开(公告)号：US07851880B2
公开(公告)日：2010-12-14
申请号：US11944831
申请日：2007-11-26
申请人： Masami Suzuki , Yoshimichi Harada , Yoshihiro Nabe , Yuji Takaoka , Masaaki Takizawa , Chiaki Sakai
发明人： Masami Suzuki , Yoshimichi Harada , Yoshihiro Nabe , Yuji Takaoka , Masaaki Takizawa , Chiaki Sakai
IPC分类号： H01L31/0224 , H01L23/48
CPC分类号： H01L27/14618 , H01L23/481 , H01L24/02 , H01L27/14636 , H01L27/14683 , H01L2224/0401 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042
摘要： A solid-state imaging device includes a semiconductor substrate having a foreside provided with an imaging area and an electrode pad, the imaging area having an array of optical sensors, the electrode pad being disposed around a periphery of the imaging area; a transparent substrate joined to the foreside of the semiconductor substrate with a sealant therebetween; underside wiring that extends through the semiconductor substrate from the electrode pad to an underside of the semiconductor substrate; and a protective film composed of an inorganic insulating material and interposed between the semiconductor substrate and the sealant, the protective film covering at least the electrode pad.
摘要翻译： 固态成像装置包括具有成像区域的前侧的半导体基板和电极焊盘，所述成像区域具有光学传感器阵列，所述电极焊盘围绕所述摄像区域的周边设置; 透明基板，其与半导体基板的前端接合，在其间具有密封剂; 从所述电极焊盘延伸穿过所述半导体衬底到所述半导体衬底的下侧的下侧布线; 以及保护膜，其由无机绝缘材料构成并插入在所述半导体基板和所述密封剂之间，所述保护膜至少覆盖所述电极焊盘。
-
公开(公告)号：US07597829B2
公开(公告)日：2009-10-06
申请号：US11020137
申请日：2004-12-27
申请人： Atsushi Yusa , Terumasa Kondo , Toshiyuki Tomita , Masami Suzuki
发明人： Atsushi Yusa , Terumasa Kondo , Toshiyuki Tomita , Masami Suzuki
CPC分类号： B29C45/1701
摘要： An injection molding method that modifies a surface of thermoplastic resin using a supercritical fluid that contains a solute, and molds the thermoplastic resin, includes the steps of injecting the thermoplastic resin into a mold cavity in a mold, a space being formed between the mold cavity and the surface of the thermoplastic resin, introducing into the space the supercritical fluid that contains the solute, and exhausting from the space the supercritical fluid that contains the solute.
摘要翻译： 使用含有溶质的超临界流体对热塑性树脂的表面进行改性并使热塑性树脂成形的注射成型方法包括将热塑性树脂注入模具的模腔中的步骤，在模腔之间形成空间 和热塑性树脂的表面，将含有溶质的超临界流体引入空间，并从空间排出包含溶质的超临界流体。
-
公开(公告)号：US20090146287A1
公开(公告)日：2009-06-11
申请号：US12000745
申请日：2007-12-17
IPC分类号： H01L23/48
CPC分类号： H01L23/49572 , H01L23/13 , H01L23/49816 , H01L23/4985 , H01L25/105 , H01L2224/16 , H01L2224/73204 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311
摘要： Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a package film having a planar configuration whose region is divided into a device-mounting film portion having a device hole forming therein, an external-connection film portion, and a bent portion located between the device-mounting film portion and the external-connection film portion, an external electrode pad being formed on the external-connection film portion on a first surface side of the package film, an inner lead being formed in such a manner as to lead from the device hole to the external electrode pad via the bending portion; mounting a semiconductor chip on the device-mounting film portion on the first surface side by bonding the inner lead to an electrode pad of the semiconductor chip in a region where the device hole is formed; and bending the external-connection film portion at the bending portion 180° toward a second surface side of the package film and fixing the same. The method for mounting a semiconductor device on a mother board in close contact therewith includes the steps of: depositing solder balls on electrode pads of the mother board; and placing the semiconductor device on the mother board and melting the solder balls so as to electrically connect the electrode pads of the mother board and the external electrode pads of the semiconductor device.
摘要翻译： 公开了一种半导体器件及其制造方法及其安装方法。 制造半导体器件的方法包括以下步骤：制备具有平面形状的封装膜，其区域被分成具有形成器件孔的器件安装膜部分，外部连接膜部分和位于 在所述装置安装膜部分和所述外部连接膜部分之间，在所述封装膜的第一表面侧的所述外部连接膜部分上形成外部电极焊盘，所述内部引线形成为引导 从所述装置孔经由所述弯曲部到所述外部电极焊盘; 通过在形成器件孔的区域中将内部引线接合到半导体芯片的电极焊盘，将半导体芯片安装在第一表面侧的器件安装膜部分上; 并且将弯曲部分处的外部连接膜部分朝向封装膜的第二表面侧弯曲180°并将其固定。 将半导体器件与母板紧密接触的方法包括以下步骤：在母板的电极焊盘上沉积焊球; 并将半导体器件放置在母板上并熔化焊球，以将母板的电极焊盘和半导体器件的外部电极焊盘电连接。
-
-
-
-
-
-
-
-
-
搜索结果
139 条记录 (耗时 0.049 秒)
