Abstract:
There is provided a technology which allows improvements in manufacturing yield and product reliability in a semiconductor device having a triple well structure. A shallow p-type well is formed in a region different from respective regions in a p-type substrate where a deep n-type well, a shallow p-type well, and a shallow n-type well are formed. A p-type diffusion tap formed in the shallow p-type well is wired to a p-type diffusion tap formed in a shallow n-type well in the deep n-type well using an interconnection in a second layer. The respective gate electrodes of an nMIS and a pMIS each formed in the deep n-type well are coupled to the respective drain electrodes of an nMIS and a pMIS each formed in the substrate using an interconnection in a second or higher order layer.
Abstract:
There is provided a technology which allows improvements in manufacturing yield and product reliability in a semiconductor device having a triple well structure. A shallow p-type well is formed in a region different from respective regions in a p-type substrate where a deep n-type well, a shallow p-type well, and a shallow n-type well are formed. A p-type diffusion tap formed in the shallow p-type well is wired to a p-type diffusion tap formed in a shallow n-type well in the deep n-type well using an interconnection in a second layer. The respective gate electrodes of an nMIS and a pMIS each formed in the deep n-type well are coupled to the respective drain electrodes of an nMIS and a pMIS each formed in the substrate using an interconnection in a second or higher order layer.
Abstract:
There is provided a technology which allows improvements in manufacturing yield and product reliability in a semiconductor device having a triple well structure. A shallow p-type well is formed in a region different from respective regions in a p-type substrate where a deep n-type well, a shallow p-type well, and a shallow n-type well are formed. A p-type diffusion tap formed in the shallow p-type well is wired to a p-type diffusion tap formed in a shallow n-type well in the deep n-type well using an interconnection in a second layer. The respective gate electrodes of an nMIS and a pMIS each formed in the deep n-type well are coupled to the respective drain electrodes of an nMIS and a pMIS each formed in the substrate using an interconnection in a second or higher order layer.
Abstract:
An object of the present invention is to discriminate received information from one and same originator visually and readily. A CPU detects identification information of the originator in receiving a facsimile. It also selects identification information which coincides with the identification information detected among identification information of originators stored in a printing color table in a RAM in advance and selects a printing color corresponding to the identification information. A signal generating circuit generates an index signal which instructs to print an index mark in a selected printing color. The CPU controls an operation of a color printer so as to print the index mark in a predetermined color based on the index signal together with image information. It is possible to discriminate information transmitted from a predetermined terminal by selecting the recording sheet on which the index mark of the predetermined printing color is printed out of the mixed recording sheets. The recording sheet may be readily selected visually because the information is distinguished by the colors.
Abstract:
A semiconductor device that permits effective use of a region positioned under a positional detection mark or an external electrode, i.e., the region that has not been conventionally utilized may be provided. In a semiconductor device including a lower layer, a shielding film and an upper layer, the lower layer includes at least one selected from the group consisting of a positional detection mark, a quality testing element, and a circuit element. The shielding film is formed on the lower layer and shields an energy beam used for detecting a positional detection mark. The upper layer includes a positional detection mark formed on the shielding film.
Abstract:
An interconnection structure of a semiconductor device with a gate electrode, an active region provided in the vicinity of the gate electrode and a first buried layer in a contact hole exposing the gate electrode and the active region. The contact hole is easily formed, and the first buried layer has a substantially low interconnection resistance value.
Abstract:
An engine has first and second cylinder rows substantially parallel to each other and is mounted sideways so that the cylinder rows are arranged side by side in the longitudinal direction of the vehicle body with the first cylinder row disposed forward of the second cylinder row. An exhaust system for the engine has first and second exhaust pipes. The first exhaust pipe is connected to the cylinders in the first cylinder row on the front side of the first cylinder row and is led rearward of the engine through a recess formed on the lower side of an oil pan of the engine which is positioned between the first and second cylinder rows. The second exhaust pipe is connected to the cylinders in the second cylinder row on the rear side of the second cylinder row, is once led forward into the recess of the oil pan and then turned rearward in the recess to extend rearward. The first and second exhaust pipes are merged into a common exhaust pipe at a junction in the rear of the engine.
Abstract:
A method of producing a multi-petaled cyclamen plant having an increased number of petals, including at least inhibiting the function of a transcription factor involved in morphogenesis of a floral organ of cyclamen.
Abstract:
A semiconductor device that permits effective use of a region positioned under a positional detection mark or an external electrode, i.e., the region that has not been conventionally utilized may be provided. In a semiconductor device including a lower layer, a shielding film and an upper layer, the lower layer includes at least one selected from the group consisting of a positional detection mark, a quality testing element, and a circuit element. The shielding film is formed on the lower layer and shields an energy beam used for detecting a positional detection mark. The upper layer includes a positional detection mark formed on the shielding film.
Abstract:
A semiconductor device having a memory cell region comprising a plurality of memory cells is described, and a stable characteristic is imparted to all the memory cells provided in the memory cell block. Impurities are implanted into a memory cell region of a silicon substrate at predetermined intervals, thus forming a plurality of wells. A resist film used as a mask for implanting impurities has strip-shaped patterns and a broad pattern. Since the strip-shaped patterns located close to the broad pattern are inclined, the characteristics of the wells located in the vicinity of the outer periphery of the memory cell region become unstable. The wells having unstable characteristics are taken as dummy wells which do not affect the function of a semiconductor device.