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    Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
    1.
    发明授权
    Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers 有权
    用于微电子成像器的封装以及用于微电子成像器的晶片级封装的方法

    公开(公告)号：US08092734B2

    公开(公告)日：2012-01-10

    申请号：US10845304

    申请日：2004-05-13

    申请人： Tongbi Jiang ,  J. Mike Brooks

    发明人： Tongbi Jiang ,  J. Mike Brooks

    IPC分类号： B29C65/00

    CPC分类号： H01L31/0203 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2224/48227 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Methods for forming and attaching covers to microelectronic imaging units, packaging microelectronic imagers at the wafer level, and microelectronic imagers having covers that protect the image sensor are disclosed herein. In one embodiment, a method includes providing a first substrate having a plurality of covers, the covers including windows comprising regions of the first substrate and stand-offs projecting from the windows. The method continues by providing a second substrate having a plurality of microelectronic dies with image sensors, integrated circuits electrically coupled to the image sensors, and terminals electrically coupled to the integrated circuits. The method includes assembling the covers with corresponding dies so that the windows are aligned with corresponding image sensors and stand-offs contact corresponding dies inboard of the terminals and outboard of the image sensors. The first substrate is then cut to singulate the individual covers, after which the second substrate is cut to singulate individual imaging units.

    摘要翻译： 本文公开了用于在微晶电子成像单元上形成和附着盖子，在晶片级封装微电子成像器的方法以及具有保护图像传感器的覆盖物的微电子成像器。 在一个实施例中，一种方法包括提供具有多个盖的第一基板，所述盖包括包括第一基板的区域和从窗口突出的支架的窗口。 该方法继续通过提供具有多个具有图像传感器的多个微电子管芯的第二基板，电耦合到图像传感器的集成电路和电耦合到集成电路的端子。 该方法包括将盖与相应的模具进行组装，使得窗口与对应的图像传感器对准，并且支架将接触端子和图像传感器外侧的对应的模具接触。 然后切割第一衬底以分离单个覆盖物，然后将第二衬底切割成单个成像单元。

    Methods for installing a circuit device
    2.
    发明授权
    Methods for installing a circuit device 失效
    安装电路装置的方法

    公开(公告)号：US07065868B2

    公开(公告)日：2006-06-27

    申请号：US10747333

    申请日：2003-12-29

    申请人： Larry Kinsman ,  Mike Brooks ,  Warren M. Farnworth ,  Walter Moden ,  Terry Lee

    发明人： Larry Kinsman ,  Mike Brooks ,  Warren M. Farnworth ,  Walter Moden ,  Terry Lee

    IPC分类号： H01R9/00

    CPC分类号： H05K7/1415 ,  B25B27/00 ,  H05K3/301 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49169 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53209 ,  Y10T29/53257 ,  Y10T29/53261 ,  Y10T29/53265

    摘要： A method is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

    摘要翻译： 提供了一种用于将电路组件（诸如存储器件）安装在诸如插座的支撑件中的方法。 要安装的设备支撑在支架或外壳中。 保持器定位在接收插座中的支撑区域上方。 将手动执行器压入保持器中以将装置从保持器中排出并将装置安装在支撑件中。 保持器可以被配置为保持单个设备，或者多个设备在由分区定义的槽中对齐。 可以提供多装置托盘用于将装置向分度装置移动到排出槽，通过这些装置通过手动驱动排放致动器来安装装置。 该技术在安装之前和安装期间为设备提供保护，并且便于手动安装这些设备，而不需要在安装之前或安装期间直接与设备接触。

    Method and apparatus for installing a circuit device
    3.
    发明授权
    Method and apparatus for installing a circuit device 失效
    用于安装电路装置的方法和装置

    公开(公告)号：US06681480B1

    公开(公告)日：2004-01-27

    申请号：US09258764

    申请日：1999-02-26

    申请人： Larry Kinsman ,  Mike Brooks ,  Warren M. Farnworth ,  Walter Moden ,  Terry Lee

    发明人： Larry Kinsman ,  Mike Brooks ,  Warren M. Farnworth ,  Walter Moden ,  Terry Lee

    IPC分类号： B23P1900

    CPC分类号： H05K7/1415 ,  B25B27/00 ,  H05K3/301 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49169 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53209 ,  Y10T29/53257 ,  Y10T29/53261 ,  Y10T29/53265

    摘要： A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

    摘要翻译： 提供了一种技术，用于将诸如存储设备的电路组件安装在诸如插座的支撑件中。 要安装的设备支撑在支架或外壳中。 保持器定位在接收插座中的支撑区域上方。 将手动执行器压入保持器中以将装置从保持器中排出并将装置安装在支撑件中。 保持器可以被配置为保持单个设备，或者多个设备在由分区定义的槽中对齐。 可以提供多装置托盘用于将装置向分度装置移动到排出槽，通过这些装置通过手动驱动排放致动器来安装装置。 该技术在安装之前和安装期间为设备提供保护，并且便于手动安装这些设备，而不需要在安装之前或安装期间直接与设备接触。

    Method of wafer level chip scale packaging
    4.
    发明授权
    Method of wafer level chip scale packaging 有权
    晶圆级芯片级封装方法

    公开(公告)号：US06368896B2

    公开(公告)日：2002-04-09

    申请号：US09298514

    申请日：1999-04-23

    申请人： Warren M. Farnworth ,  Alan G. Wood ,  Mike Brooks

    发明人： Warren M. Farnworth ,  Alan G. Wood ,  Mike Brooks

    IPC分类号： H01L2144

    CPC分类号： H01L23/49827 ,  H01L23/4985 ,  H01L2224/02333 ,  H01L2224/73215 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15173

    摘要： A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit. Several different embodiments of interconnects are provided including: bumps on the die contacts, bonded to the flex circuit conductors with a conductive adhesive layer; polymer bumps on the conductors, or die contacts, applied in a semi-cured state and then fully cured; solder bumps on the die contacts and conductors, bonded to one another using a bonding tool; rivet-like bonded connections between the conductors and die contacts, formed using metal bumps and a wire bonding or ball bonding apparatus; single point bonded connections between the conductors and die contacts, formed with a bonding tool; and wire bonds between the conductors and die contacts.

    摘要翻译： 提供了一种芯片级半导体封装和一种制造该封装的方法。 该封装包括半导体管芯和连接到管芯的表面的柔性电路。 柔性电路包括具有密集阵列的外部触点的聚合物基板和与外部触点电连通的导体图案。 封装还包括被配置为在管芯触头（例如，焊盘）之间提供分开的电路径的互连件以及柔性电路上的导体。 提供了互连的几个不同实施例，包括：在裸片上的凸起接触，用导电粘合剂层结合到柔性电路导体上; 导体上的聚合物凸块或模具接触件以半固化状态施加，然后完全固化; 使用焊接工具彼此接合的管芯触点和导体上的焊料凸块; 使用金属凸块和引线接合或球焊接装置形成的导体和裸片接触之间的铆钉状接合连接; 导体和裸片接点之间的单点接合连接，用接合工具形成; 以及导体和裸片接触之间的引线键合。