公开(公告)号：US08865520B2

公开(公告)日：2014-10-21

申请号：US13216063

申请日：2011-08-23

申请人： Kuo-Pin Yang ,  Wei-Min Hsiao ,  Cheng-Hui Hung

发明人： Kuo-Pin Yang ,  Wei-Min Hsiao ,  Cheng-Hui Hung

IPC分类号： H01L21/00 ,  H01L21/20 ,  H01L21/30 ,  H01L21/46 ,  H01L21/48 ,  H01L21/683

CPC分类号： H01L21/6835 ,  H01L21/486 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10

摘要： The present invention provides a temporary carrier bonding and detaching process. A first surface of a semiconductor wafer is mounted on a first carrier by a first adhesive layer, and a first isolation coating disposed between the first adhesive layer and the first carrier. Then, a second carrier is mounted on the second surface of the semiconductor wafer. The first carrier is detached. Then, the first surface of the semiconductor wafer is mounted on a film frame. The second carrier is detached. The method of the present invention utilizes the second carrier to support and protect the semiconductor wafer, after which the first carrier is detached. Therefore, the semiconductor wafer will not be damaged or broken, thereby improving the yield rate of the semiconductor process. Furthermore, the simplicity of the detaching method for the first carrier allows for improvement in efficiency of the semiconductor process.

摘要翻译： 本发明提供了临时的载体接合和分离工艺。 半导体晶片的第一表面通过第一粘合剂层安装在第一载体上，第一隔离涂层设置在第一粘合层和第一载体之间。 然后，第二载体安装在半导体晶片的第二表面上。 第一个承运人分离。 然后，将半导体晶片的第一表面安装在胶片框架上。 第二个承运人分离。 本发明的方法利用第二载体来支撑和保护半导体晶片，然后分离第一载体。 因此，半导体晶片不会被损坏或破损，从而提高半导体工艺的成品率。 此外，第一载体的分离方法的简单性允许提高半导体工艺的效率。

公开(公告)号：US20140117174A1

公开(公告)日：2014-05-01

申请号：US13663587

申请日：2012-10-30

申请人： TSAI-JEN TAN ,  WEN-PIN YANG

发明人： TSAI-JEN TAN ,  WEN-PIN YANG

IPC分类号： F16M11/22

CPC分类号： A47B23/007 ,  A47B23/041 ,  F16M11/048 ,  F16M11/10 ,  F16M11/2028 ,  F16M11/38 ,  F16M13/022

摘要： An electronic device support for installing a clamping means to clamp and hold an electronic device is introduced. The electronic device support includes a rod and two bases. The rod is in an arc shape; each base has a connecting portion; both ends of the rod are installed at the connecting portions respectively. In the electronic device support, the arc shape rod is combined with the bases, so that the electronic device can be raised and fixed appropriately by the electronic device support to achieve the effects of facilitating a user who lies in bed to use the electronic device without holding the electronic device as well as facilitating the user to leave the bed.

摘要翻译： 引入了用于安装用于夹紧和保持电子装置的夹持装置的电子装置支撑件。 电子设备支撑件包括杆和两个基座。 杆是弧形的; 每个基座具有连接部分; 杆的两端分别安装在连接部分。 在电子设备支撑件中，弧形杆与基座组合，使得电子设备可以通过电子设备支撑件适当地升高和固定，以实现便于躺在床上的用户使用电子设备的效果，而无需 握住电子设备以及便于用户离开床。

公开(公告)号：US20130236183A1

公开(公告)日：2013-09-12

申请号：US13445916

申请日：2012-04-13

申请人： Chia-Hsin Chao ,  Wen-Yung Yeh ,  Hung-Pin Yang

发明人： Chia-Hsin Chao ,  Wen-Yung Yeh ,  Hung-Pin Yang

IPC分类号： H04B10/24 ,  H04J14/08

CPC分类号： H05B33/0827 ,  H04B10/116 ,  H05B33/0854 ,  H05B37/0272

摘要： A visible light communication (VLC) transceiver and a VLC system are provided. The VLC transceiver includes a substrate, a lens module and a plurality of channel units. The channel units are disposed on the substrate in an array to provide different bidirectional communication channels. Wherein, each of the channel units respectively includes at least a visible light emitter and at least a visible light receiver. The channel units can enhance communication bandwidth by using modulation technology such as spatial multiplexing or time multiplexing. The lens module is disposed on an optical path of the channel units. The lens module actively tracks the receiving situation of the visible light receiver to improve the signal quality of high-speed multiplexing communication.

摘要翻译： 提供可见光通信（VLC）收发器和VLC系统。 VLC收发器包括基板，透镜模块和多个通道单元。 通道单元以阵列方式设置在基板上，以提供不同的双向通信通道。 其中，每个通道单元分别至少包括可见光发射器和至少可见光接收器。 信道单元可以通过使用诸如空间复用或时间复用的调制技术来增强通信带宽。 透镜模块设置在通道单元的光路上。 透镜模块主动跟踪可见光接收器的接收情况，提高高速复用通信的信号质量。

公开(公告)号：US20130223094A1

公开(公告)日：2013-08-29

申请号：US13780940

申请日：2013-02-28

申请人： Wen-Pin YANG ,  Chen-Lung CHEN

发明人： Wen-Pin YANG ,  Chen-Lung CHEN

IPC分类号： F21V8/00

CPC分类号： G02B6/0031 ,  G02B6/0085

摘要： A display module has a display panel and a backlight module disposed on one side of the display panel. The backlight module includes a heat sink, a light bar, a light guide plate, a first reflective sheet, and a second reflective sheet. The light bar abuts against one side of the heat sink. The first reflective sheet is disposed adjacent to a bottom surface of the light guide plate, and the second reflective sheet is disposed adjacent to an edge of a light-emitting surface of the light guide plate. The second reflective sheet has a first part and a second part forming an included angle with the first part, the first part is attached to the heat sink or the light bar, and the second part overlaps a part of the light-emitting surface of the light guide plate.

摘要翻译： 显示模块具有设置在显示面板一侧的显示面板和背光模块。 背光模块包括散热器，灯条，导光板，第一反射片和第二反射片。 灯条与散热器的一侧相接。 第一反射片与导光板的底面相邻配置，第二反射片与导光板的发光面的边缘相邻配置。 第二反射片具有与第一部分形成夹角的第一部分和第二部分，第一部分附接到散热片或光棒，第二部分与发光表面的一部分重叠 导光板。

公开(公告)号：US20110051635A1

公开(公告)日：2011-03-03

申请号：US12722548

申请日：2010-03-12

申请人： Shun-Pin Yang ,  Ting-Che Tseng ,  Chin-Yang Hsieh ,  Wei-Lun Wan

发明人： Shun-Pin Yang ,  Ting-Che Tseng ,  Chin-Yang Hsieh ,  Wei-Lun Wan

IPC分类号： H04B7/00

CPC分类号： H04L27/0008 ,  H04L27/20 ,  H04L27/22

摘要： A communication method employed in a wireless communication system including a first communication device and a second communication device is provided. The communication method includes: setting up a connection between the first and second communication devices; after the connection is set up, checking if both the first and second communication devices provide a symbol mapping function for converting a first modulation/demodulation to a second modulation/demodulation different from the first modulation/demodulation; and when both the first and second communication devices provide the symbol mapping function, using the second modulation/demodulation to replace the first modulation/demodulation so that each of the first and second communication devices communicates with each other by using the second modulation/demodulation.

摘要翻译： 提供了一种在包括第一通信设备和第二通信设备的无线通信系统中采用的通信方法。 通信方法包括：建立第一和第二通信设备之间的连接; 在连接建立之后，检查第一和第二通信设备是否提供用于将第一调制/解调转换为不同于第一调制/解调的第二调制/解调的符号映射功能; 并且当第一和第二通信设备都提供符号映射功能时，使用第二调制/解调来代替第一调制/解调，使得第一和第二通信设备中的每一个通过使用第二调制/解调来彼此通信。

公开(公告)号：US20110048788A1

公开(公告)日：2011-03-03

申请号：US12583949

申请日：2009-08-28

申请人： Meng-Jen Wang ,  Kuo-Pin Yang

发明人： Meng-Jen Wang ,  Kuo-Pin Yang

IPC分类号： H05K1/11 ,  H01B13/00

CPC分类号： H05K3/445 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H05K3/061 ,  H05K2203/0323 ,  H05K2203/1476 ,  H01L2924/00

摘要： The present invention relates to a method for forming a via in a substrate and a substrate with a via. The method includes the following steps: (a) providing a substrate having a first surface and a second surface; (b) forming a groove that has a side wall and a bottom wall on the first surface of the substrate; (c) forming a conductive metal on the side wall and the bottom wall of the groove so as to form a central groove; (d) forming an annular groove that surrounds the conductive metal on the first surface of the substrate; (e) forming an insulating material in the central groove and the annular groove; and (f) removing part of the second surface of the substrate to expose the conductive metal and the insulating material.

摘要翻译： 本发明涉及一种用于在基板和具有通孔的基板上形成通孔的方法。 该方法包括以下步骤：（a）提供具有第一表面和第二表面的基底; （b）在所述基板的第一表面上形成具有侧壁和底壁的凹槽; （c）在槽的侧壁和底壁上形成导电金属，以形成中心槽; （d）形成围绕所述基板的第一表面上的所述导电金属的环形槽; （e）在所述中央槽和所述环形槽中形成绝缘材料; 和（f）去除衬底的第二表面的一部分以暴露导电金属和绝缘材料。

公开(公告)号：US20110011250A1

公开(公告)日：2011-01-20

申请号：US12544797

申请日：2009-08-20

申请人： Cheng-Pin YANG

发明人： Cheng-Pin YANG

IPC分类号： D04C1/00 ,  D03D25/00

CPC分类号： D04B1/12 ,  D10B2403/0114

摘要： A double-layer directed sweat cloth, especially a quick hygroscopic sweat cloth, is disclosed. Sweat drawn by a lining is given a directional route for transporting and delivering quickly to an external dissipation layer for evaporation and sweat transferred is prevented from staining reversely a skin surface, forming a dry-wet separation effect to keep a lining layer dry. In the lining layer, part of core sections of yarns which absorb sweat are at same positions in the dissipation layer, allowing water liquid affinitive to the lining to directly acquire a directional route that sweat is quickly transported and carried outward to keep skin dry, by a co-core capillary effect to transport sweat directly and collapsing sweat beads at far ends. Moreover, as drawing yarns are woven hollowly, a hollow portion is formed in the lining to provide a dry-wet separation mechanism, maintaining dryness to skin where the cloth is worn on.

摘要翻译： 公开了一种双层定向汗布，特别是一种快速吸湿布。 由衬里吸出的汗液被赋予了用于快速输送和输送到用于蒸发的外部耗散层的定向路径，防止转移的汗液反向地染色皮肤表面，形成干湿分离效果以保持衬里层干燥。 在衬里层中，吸收汗液的纱线芯部分的一部分在耗散层中处于相同的位置，允许与衬里相关的水溶液直接获得一种定向路线，汗液快速运输并携带向外以保持皮肤干燥，由 直接运输汗水并在远端塌陷汗珠的共芯毛细管效应。 此外，当拉丝纱被中空编织时，在衬里中形成中空部分以提供干湿分离机构，保持穿在布上的皮肤的干燥度。

公开(公告)号：US20100244244A1

公开(公告)日：2010-09-30

申请号：US12726777

申请日：2010-03-18

申请人： Kuo-Pin Yang

发明人： Kuo-Pin Yang

IPC分类号： H01L23/498

CPC分类号： H01L23/49816 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/12 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16235 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/05552

摘要： The present invention relates to a chip having a bump and a package having the same. The chip includes a chip body, at least one via, a passivation layer, an under ball metal layer and at least one bump. The via penetrates the chip body, and is exposed to a surface of the chip body. The passivation layer is disposed on the surface of the chip body, and the passivation layer has at least one opening. The opening exposes the via. The under ball metal layer is disposed in the opening of the passivation layer, and is connected to the via. The bump is disposed on the under ball metal layer, and includes a first metal layer, a second metal layer and a third metal layer. The first metal layer is disposed on the under ball metal layer. The second metal layer is disposed on the first metal layer. The third metal layer is disposed on the second metal layer. As the bumps can connect two chips, the chip is stackable, and so the density of the product is increased while the size of the product is reduced.

摘要翻译： 本发明涉及具有凸块的芯片和具有该凸块的封装。 芯片包括芯片体，至少一个通孔，钝化层，下部球金属层和至少一个凸块。 通孔穿透芯片体并暴露于芯片体的表面。 钝化层设置在芯片体的表面上，钝化层具有至少一个开口。 开幕式暴露了通道。 下球金属层设置在钝化层的开口中，并连接到通孔。 凸块设置在下球金属层上，并且包括第一金属层，第二金属层和第三金属层。 第一金属层设置在球形金属层的下方。 第二金属层设置在第一金属层上。 第三金属层设置在第二金属层上。 由于凸块可以连接两个芯片，芯片可堆叠，因此产品的密度增加，而产品的尺寸减小。

公开(公告)号：US20100237539A1

公开(公告)日：2010-09-23

申请号：US12408430

申请日：2009-03-20

申请人： Chang-Chih Sung ,  Chen-Sheng Lee ,  Yun-Pin Yang

发明人： Chang-Chih Sung ,  Chen-Sheng Lee ,  Yun-Pin Yang

IPC分类号： B29C59/04

CPC分类号： B29C59/046 ,  B29C35/0888 ,  B29C43/222 ,  B29C43/28 ,  B29C2035/0827 ,  B29C2043/3483 ,  B29D11/00346 ,  B29D11/00663 ,  B29L2011/0016 ,  B29L2011/005

摘要： The present invention provides a manufacturing method and an apparatus for an optical sheet placed in a backlight assembly. The optical sheet produced by the manufacturing method and apparatus has pluralities of first microstructures on the surface of the optical sheet. The optical sheet is mainly made of cured photo resin, for instance: ultraviolet glue. The optical sheet has higher performance and lower cost. Furthermore, the manufacturing method and the apparatus can produce the optical sheet more efficiently.

摘要翻译： 本发明提供一种放置在背光组件中的光学片的制造方法和装置。 通过该制造方法和装置制造的光学片在光学片的表面上具有多个第一微结构。 光学片主要由固化的光树脂制成，例如：紫外线胶。 光学片具有更高的性能和更低的成本。 此外，制造方法和装置可以更有效地制造光学片。

公开(公告)号：US07667003B2

公开(公告)日：2010-02-23

申请号：US12231623

申请日：2008-09-04

申请人： Juan J. Perez-Villar ,  Han Chang ,  Steven B. Kanner ,  Gena S. Whitney ,  Yuli Wu ,  Wen-Pin Yang

发明人： Juan J. Perez-Villar ,  Han Chang ,  Steven B. Kanner ,  Gena S. Whitney ,  Yuli Wu ,  Wen-Pin Yang

IPC分类号： C07K16/28

CPC分类号： C07K14/47 ,  A01K2217/05 ,  Y10S435/81

摘要： The present invention describes a newly discovered full-length polynucleotide encoding an SH2 domain-containing adapter protein, called human MIST, cloned, isolated and identified from a human spleen cDNA library. Also described are the MIST polypeptide sequence, expression vectors, host cells, agonists, antagonists, antisense molecules, and antibodies related to the polynucleotide and/or polypeptide of the present invention. Novel splice variant forms of human MIST are provided. Methods for screening for modulators, particularly inhibitors, of the MIST protein and use of the human MIST polynucleotide and polypeptide for therapeutics and diagnostics are described.

摘要翻译： 本发明描述了一种新发现的全长多核苷酸，其编码含有SH2结构域的衔接蛋白，称为人MIST，从人脾cDNA文库克隆，分离和鉴定。 还描述了与本发明的多核苷酸和/或多肽相关的MIST多肽序列，表达载体，宿主细胞，激动剂，拮抗剂，反义分子和抗体。 提供人类MIST的新型剪接变体形式。 描述了用于筛选MIST蛋白的调节剂，特别是抑制剂的方法以及人MIST多核苷酸和多肽用于治疗和诊断的用途。