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    Robust LED structure for substrate lift-off
    3.
    发明授权
    Robust LED structure for substrate lift-off 有权
    坚固的LED结构，用于衬底剥离

    公开(公告)号：US07687810B2

    公开(公告)日：2010-03-30

    申请号：US11876404

    申请日：2007-10-22

    申请人： Qingwei Mo ,  Arnold Daguio

    发明人： Qingwei Mo ,  Arnold Daguio

    IPC分类号： H01L27/15 ,  H01L29/40 ,  H01L23/29

    CPC分类号： H01L33/0079 ,  H01L33/0095 ,  H01L33/505 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/13 ,  H01L2224/73204 ,  H01L2933/0041

    摘要： An etching step is performed on an LED/substrate wafer to etch through the LED epitaxial layers entirely around each LED on the substrate wafer to form a gap between each LED on the wafer. The substrate is not etched. When the LEDs/substrates are singulated, edges of each substrate extend beyond edges of the LED die. The LEDs are flip-chips and are mounted on a submount with the LED die between the submount and the substrate. An insulating underfill material is injected under the LED die and also covers the sides of the LED die and “enlarged” substrate. The substrate is then removed by laser lift-off. The raised walls of the underfill that were along the edges of the enlarged substrate are laterally spaced from the edges of the LED die so that a phosphor plate can be easily positioned on top to the LED die with a relaxed positioning tolerance.

    摘要翻译： 在LED /衬底晶片上执行蚀刻步骤，以在衬底晶片上的每个LED上整个围绕LED外延层蚀刻，以在晶片上的每个LED之间形成间隙。 衬底不被蚀刻。 当LED /衬底被分割时，每个衬底的边缘延伸超过LED管芯的边缘。 LED是倒装芯片，并且安装在基座上，LED管芯位于基座和基板之间。 在LED管芯下方注入绝缘底层填充材料，并且还覆盖LED管芯的侧面和“扩大的”基板。 然后通过激光剥离去除衬底。 沿着放大的基板的边缘的底部填充物的隆起的壁与LED模具的边缘横向间隔开，使得荧光体板可以容易地放置在LED模具的顶部，具有放松的定位公差。

    ROBUST LED STRUCTURE FOR SUBSTRATE LIFT-OFF
    7.
    发明申请
    ROBUST LED STRUCTURE FOR SUBSTRATE LIFT-OFF 有权
    用于底板提升的坚固的LED结构

    公开(公告)号：US20090101929A1

    公开(公告)日：2009-04-23

    申请号：US11876404

    申请日：2007-10-22

    申请人： Qingwei Mo ,  Arnold Daguio

    发明人： Qingwei Mo ,  Arnold Daguio

    IPC分类号： H01L33/00

    CPC分类号： H01L33/0079 ,  H01L33/0095 ,  H01L33/505 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/13 ,  H01L2224/73204 ,  H01L2933/0041

    摘要： An etching step is performed on an LED/substrate wafer to etch through the LED epitaxial layers entirely around each LED on the substrate wafer to form a gap between each LED on the wafer. The substrate is not etched. When the LEDs/substrates are singulated, edges of each substrate extend beyond edges of the LED die. The LEDs are flip-chips and are mounted on a submount with the LED die between the submount and the substrate. An insulating underfill material is injected under the LED die and also covers the sides of the LED die and “enlarged” substrate. The substrate is then removed by laser lift-off. The raised walls of the underfill that were along the edges of the enlarged substrate are laterally spaced from the edges of the LED die so that a phosphor plate can be easily positioned on top to the LED die with a relaxed positioning tolerance.

    摘要翻译： 在LED /衬底晶片上执行蚀刻步骤，以在衬底晶片上的每个LED上整个围绕LED外延层蚀刻，以在晶片上的每个LED之间形成间隙。 衬底不被蚀刻。 当LED /衬底被分割时，每个衬底的边缘延伸超过LED管芯的边缘。 LED是倒装芯片，并且安装在基座上，LED管芯位于基座和基板之间。 在LED管芯下方注入绝缘底层填充材料，并且还覆盖LED管芯的侧面和“扩大的”基板。 然后通过激光剥离去除衬底。 沿着放大的基板的边缘的底部填充物的隆起的壁与LED模具的边缘横向间隔开，使得荧光体板可以容易地放置在LED模具的顶部，具有放松的定位公差。

    Optical microscanning system and method with embedded scannable photo-pumped light source
    8.
    发明申请
    Optical microscanning system and method with embedded scannable photo-pumped light source 审中-公开
    具有嵌入式可扫描光泵浦光源的光学显微系统和方法

    公开(公告)号：US20060126144A1

    公开(公告)日：2006-06-15

    申请号：US11008077

    申请日：2004-12-09

    申请人： Qingwei Mo

    发明人： Qingwei Mo

    IPC分类号： G02B26/08

    CPC分类号： G02B26/0833 ,  G02B26/101 ,  G02B26/105

    摘要： An optical microscanning system for selectively emitting a highly coherent, collimated, and monochromatic beam of light (122) in a desired trajectory and selectively redirecting the trajectory within a scan field. The system includes a fixed light source (112) of substantially coherent, collimated, and monochromatic light (118) and an optically pumped light source (120) of highly coherent, collimated, and monochromatic light (122). The optically pumped light source (120) is optically pumped by the fixed light source (112). The optically pumped light source (120) can selectively redirect its light output (122). Also, a method of manufacturing such an optical microscanning system. A cavity is etched (156) in a base substrate. Two electrodes are provided (158) at the cavity floor. A second layer is provided (160) over the mouth of the cavity. A mirror layer is bonded (162) onto the second layer. Spacers are etched (164) through the mirror layer and second layer to define a substrate section (165). The mirror layer is etched to define a mirror (166).

    摘要翻译： 一种光学显微系统，用于以期望的轨迹选择性地发射高度相干，准直和单色光束（122），并选择性地重定向扫描场内的轨迹。 该系统包括基本相干，准直和单色光（118）的固定光源（112）和高度相干，准直和单色光（122）的光泵浦光源（120）。 光泵浦光源（120）由固定光源（112）光泵浦。 光泵浦光源（120）可以选择性地重定向其光输出（122）。 另外，制造这种光学显微镜系统的方法。 在基底衬底中刻蚀空腔（156）。 在空腔底部设有两个电极（158）。 在空腔的口部上设置有第二层（160）。 将镜层（162）结合到第二层上。 通过镜层和第二层蚀刻间隔物（164）以限定衬底部分（165）。 蚀刻镜层以限定反射镜（166）。